DE102011087414B4 - Leistungshalbleitervorrichtung, gedruckte Leiterplatte und Mechanismus zum Verbinden der Leistungshalbleitervorrichtung und der gedruckten Leiterplatte - Google Patents

Leistungshalbleitervorrichtung, gedruckte Leiterplatte und Mechanismus zum Verbinden der Leistungshalbleitervorrichtung und der gedruckten Leiterplatte Download PDF

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Publication number
DE102011087414B4
DE102011087414B4 DE102011087414.3A DE102011087414A DE102011087414B4 DE 102011087414 B4 DE102011087414 B4 DE 102011087414B4 DE 102011087414 A DE102011087414 A DE 102011087414A DE 102011087414 B4 DE102011087414 B4 DE 102011087414B4
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DE
Germany
Prior art keywords
semiconductor device
power semiconductor
insert
fitting
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102011087414.3A
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German (de)
English (en)
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DE102011087414A1 (de
Inventor
Seiji Oka
Shiori Idaka
Hiroshi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of DE102011087414A1 publication Critical patent/DE102011087414A1/de
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE102011087414.3A 2011-01-20 2011-11-30 Leistungshalbleitervorrichtung, gedruckte Leiterplatte und Mechanismus zum Verbinden der Leistungshalbleitervorrichtung und der gedruckten Leiterplatte Active DE102011087414B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011009539A JP5599328B2 (ja) 2011-01-20 2011-01-20 電力用半導体装置とプリント配線板との接続機構
JP2011-009539 2011-01-20

Publications (2)

Publication Number Publication Date
DE102011087414A1 DE102011087414A1 (de) 2012-07-26
DE102011087414B4 true DE102011087414B4 (de) 2021-12-09

Family

ID=46510898

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102011087414.3A Active DE102011087414B4 (de) 2011-01-20 2011-11-30 Leistungshalbleitervorrichtung, gedruckte Leiterplatte und Mechanismus zum Verbinden der Leistungshalbleitervorrichtung und der gedruckten Leiterplatte

Country Status (4)

Country Link
US (1) US8575745B2 (enExample)
JP (1) JP5599328B2 (enExample)
CN (1) CN102686013B (enExample)
DE (1) DE102011087414B4 (enExample)

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JP2014049582A (ja) * 2012-08-31 2014-03-17 Mitsubishi Electric Corp 半導体装置
EP2963684B1 (en) * 2013-02-26 2023-06-07 Mitsubishi Electric Corporation Power semiconductor device
CN103367299B (zh) * 2013-07-03 2017-02-15 株洲南车时代电气股份有限公司 半导体模块功率互联装置及其方法
JP6117661B2 (ja) 2013-09-19 2017-04-19 日立オートモティブシステムズ株式会社 電子制御装置
US9706643B2 (en) 2014-06-19 2017-07-11 Panasonic Intellectual Property Management Co., Ltd. Electronic device and method for manufacturing the same
DE102014116793B4 (de) 2014-11-17 2018-03-08 Infineon Technologies Ag Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls
CN107210279B (zh) * 2015-05-21 2019-07-19 三菱电机株式会社 电力用半导体装置
JP6380244B2 (ja) 2015-06-15 2018-08-29 三菱電機株式会社 半導体装置、電力変換装置
JP6455364B2 (ja) * 2015-08-28 2019-01-23 三菱電機株式会社 半導体装置、インテリジェントパワーモジュールおよび電力変換装置
JP6743542B2 (ja) 2016-07-15 2020-08-19 富士電機株式会社 半導体装置及び半導体装置用ケース
JP6445066B2 (ja) * 2017-03-22 2018-12-26 日立オートモティブシステムズ株式会社 電子制御装置
JP6445068B2 (ja) * 2017-03-23 2018-12-26 日立オートモティブシステムズ株式会社 電子制御装置
EP3442080A1 (de) * 2017-08-09 2019-02-13 HILTI Aktiengesellschaft Steckkupplung für eine akkueinheit
CN107946273A (zh) * 2017-12-22 2018-04-20 江苏宏微科技股份有限公司 一种插接功率模块封装装置
US10497635B2 (en) * 2018-03-27 2019-12-03 Linear Technology Holding Llc Stacked circuit package with molded base having laser drilled openings for upper package
US11901273B2 (en) * 2021-07-26 2024-02-13 Infineon Technologies Ag Power module with press-fit contacts
US12494418B2 (en) 2021-07-26 2025-12-09 Infineon Technologies Ag Power module with press-fit contacts
US12438068B2 (en) 2022-01-18 2025-10-07 Infineon Technologies Austria Ag Stacked module arrangement
DE102022118358A1 (de) * 2022-07-22 2024-01-25 HARTING Electronics GmbH Steckverbinder mit Transportsicherung für Gegenkontaktelemente

Citations (3)

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JPH07297197A (ja) 1994-04-27 1995-11-10 Nec Corp 実装装置およびその製造方法
JP2001298129A (ja) 2000-02-24 2001-10-26 Eupec Europaeische Ges Fuer Leistungshalbleiter Mbh & Co Kg 電力半導体モジュール
JP2008198597A (ja) 2007-02-08 2008-08-28 Semikron Elektronik Gmbh & Co Kg 接触バネを有するパワー半導体モジュール

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DE112008000229B4 (de) * 2007-01-22 2014-10-30 Mitsubishi Electric Corp. Leistungshalbleitervorrichtung
JP4879069B2 (ja) * 2007-03-30 2012-02-15 矢崎総業株式会社 メタルコア基板
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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07297197A (ja) 1994-04-27 1995-11-10 Nec Corp 実装装置およびその製造方法
JP2001298129A (ja) 2000-02-24 2001-10-26 Eupec Europaeische Ges Fuer Leistungshalbleiter Mbh & Co Kg 電力半導体モジュール
JP2008198597A (ja) 2007-02-08 2008-08-28 Semikron Elektronik Gmbh & Co Kg 接触バネを有するパワー半導体モジュール

Also Published As

Publication number Publication date
DE102011087414A1 (de) 2012-07-26
US20120187554A1 (en) 2012-07-26
JP2012151019A (ja) 2012-08-09
CN102686013B (zh) 2016-02-03
JP5599328B2 (ja) 2014-10-01
US8575745B2 (en) 2013-11-05
CN102686013A (zh) 2012-09-19

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