CN102683223A - 半导体器件制造方法和半导体器件 - Google Patents

半导体器件制造方法和半导体器件 Download PDF

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CN102683223A
CN102683223A CN2012100719523A CN201210071952A CN102683223A CN 102683223 A CN102683223 A CN 102683223A CN 2012100719523 A CN2012100719523 A CN 2012100719523A CN 201210071952 A CN201210071952 A CN 201210071952A CN 102683223 A CN102683223 A CN 102683223A
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semiconductor chip
cap
space
adhesive
front surface
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高桥典之
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Renesas Electronics Corp
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Renesas Electronics Corp
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CN2012100719523A 2011-03-16 2012-03-15 半导体器件制造方法和半导体器件 Pending CN102683223A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011057832A JP5732286B2 (ja) 2011-03-16 2011-03-16 半導体装置の製造方法
JP2011-057832 2011-03-16

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CN104671188A (zh) * 2013-11-26 2015-06-03 英飞凌科技股份有限公司 具有气隙的半导体封装
CN106206473A (zh) * 2016-08-30 2016-12-07 无锡中微高科电子有限公司 集成电路塑料封装结构及其制备方法
CN110697648A (zh) * 2019-10-16 2020-01-17 中电国基南方集团有限公司 一种mems层叠器件微波端口实现的工艺方法
CN112750804A (zh) * 2019-10-31 2021-05-04 日月光半导体制造股份有限公司 半导体设备封装和其制造方法
US20220041436A1 (en) * 2019-01-31 2022-02-10 Robert Bosch Gmbh Method for producing a plurality of sensor devices, and sensor device
CN114166196A (zh) * 2020-09-11 2022-03-11 精工爱普生株式会社 电子器件的制造方法

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US9257370B2 (en) 2013-08-27 2016-02-09 Ubotic Company Limited Cavity package with pre-molded cavity leadframe
EP2843698A3 (en) 2013-08-27 2015-04-01 Ubotic Company Limited Cavity package with pre-molded substrate
DE102014105861B4 (de) * 2014-04-25 2015-11-05 Infineon Technologies Ag Sensorvorrichtung und Verfahren zum Herstellen einer Sensorvorrichtung
CA2956867C (en) * 2014-08-01 2020-07-28 Carl Freudenberg Kg Sensor, filter element comprising a sensor and use of said type of filter element
US9472904B2 (en) * 2014-08-18 2016-10-18 Amphenol Corporation Discrete packaging adapter for connector
JP6384239B2 (ja) * 2014-09-29 2018-09-05 セイコーエプソン株式会社 光学フィルターデバイス、光学モジュール、及び電子機器
JP6256301B2 (ja) * 2014-10-31 2018-01-10 株式会社デンソー 電子回路部品
CN108141976B (zh) * 2016-03-22 2020-05-05 富士电机株式会社 外壳、半导体装置和外壳的制造方法
JP6654116B2 (ja) * 2016-08-12 2020-02-26 浜松ホトニクス株式会社 リニアイメージセンサおよびその製造方法
US9960197B1 (en) * 2017-01-13 2018-05-01 Semiconductor Components Industries, Llc Molded image sensor chip scale packages and related methods
DE102018204772B3 (de) 2018-03-28 2019-04-25 Infineon Technologies Ag Chip-Stapelanordnung und Verfahren zum Herstellen derselben
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