JP5732286B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP5732286B2
JP5732286B2 JP2011057832A JP2011057832A JP5732286B2 JP 5732286 B2 JP5732286 B2 JP 5732286B2 JP 2011057832 A JP2011057832 A JP 2011057832A JP 2011057832 A JP2011057832 A JP 2011057832A JP 5732286 B2 JP5732286 B2 JP 5732286B2
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cap
sealing
semiconductor chip
adhesive
semiconductor device
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Expired - Fee Related
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Japanese (ja)
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JP2012195417A (ja
JP2012195417A5 (https=
Inventor
高橋　典之
典之 高橋
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Renesas Electronics Corp
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Renesas Electronics Corp
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Priority to JP2011057832A priority Critical patent/JP5732286B2/ja
Priority to US13/419,899 priority patent/US8742559B2/en
Priority to CN2012100719523A priority patent/CN102683223A/zh
Publication of JP2012195417A publication Critical patent/JP2012195417A/ja
Publication of JP2012195417A5 publication Critical patent/JP2012195417A5/ja
Priority to US14/256,431 priority patent/US20140225240A1/en
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    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
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JP2011057832A 2011-03-16 2011-03-16 半導体装置の製造方法 Expired - Fee Related JP5732286B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011057832A JP5732286B2 (ja) 2011-03-16 2011-03-16 半導体装置の製造方法
US13/419,899 US8742559B2 (en) 2011-03-16 2012-03-14 Manufacturing method of semiconductor device, and semiconductor device
CN2012100719523A CN102683223A (zh) 2011-03-16 2012-03-15 半导体器件制造方法和半导体器件
US14/256,431 US20140225240A1 (en) 2011-03-16 2014-04-18 Manufacturing method of semiconductor device, and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011057832A JP5732286B2 (ja) 2011-03-16 2011-03-16 半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014160845A Division JP5795411B2 (ja) 2014-08-06 2014-08-06 半導体装置

Publications (3)

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JP2012195417A JP2012195417A (ja) 2012-10-11
JP2012195417A5 JP2012195417A5 (https=) 2013-12-05
JP5732286B2 true JP5732286B2 (ja) 2015-06-10

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JP (1) JP5732286B2 (https=)
CN (1) CN102683223A (https=)

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JP2013044524A (ja) * 2011-08-21 2013-03-04 Denso Corp 角速度センサ装置
DE102013100388B4 (de) * 2013-01-15 2014-07-24 Epcos Ag Bauelement mit einer MEMS Komponente und Verfahren zur Herstellung
US9082883B2 (en) * 2013-03-04 2015-07-14 Unisem (M) Berhad Top port MEMS cavity package and method of manufacture thereof
US8999757B2 (en) * 2013-03-04 2015-04-07 Unisem (M) Berhad Top port MEMS cavity package and method of manufacture thereof
US9099391B2 (en) * 2013-03-14 2015-08-04 Infineon Technologies Austria Ag Semiconductor package with top-side insulation layer
US9296607B2 (en) * 2013-07-22 2016-03-29 Invensense, Inc. Apparatus and method for reduced strain on MEMS devices
US9257370B2 (en) 2013-08-27 2016-02-09 Ubotic Company Limited Cavity package with pre-molded cavity leadframe
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US10224260B2 (en) 2013-11-26 2019-03-05 Infineon Technologies Ag Semiconductor package with air gap
DE102014105861B4 (de) * 2014-04-25 2015-11-05 Infineon Technologies Ag Sensorvorrichtung und Verfahren zum Herstellen einer Sensorvorrichtung
CA2956867C (en) * 2014-08-01 2020-07-28 Carl Freudenberg Kg Sensor, filter element comprising a sensor and use of said type of filter element
US9472904B2 (en) * 2014-08-18 2016-10-18 Amphenol Corporation Discrete packaging adapter for connector
JP6384239B2 (ja) * 2014-09-29 2018-09-05 セイコーエプソン株式会社 光学フィルターデバイス、光学モジュール、及び電子機器
JP6256301B2 (ja) * 2014-10-31 2018-01-10 株式会社デンソー 電子回路部品
CN108141976B (zh) * 2016-03-22 2020-05-05 富士电机株式会社 外壳、半导体装置和外壳的制造方法
JP6654116B2 (ja) * 2016-08-12 2020-02-26 浜松ホトニクス株式会社 リニアイメージセンサおよびその製造方法
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