JP6654116B2 - リニアイメージセンサおよびその製造方法 - Google Patents
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- JP6654116B2 JP6654116B2 JP2016158527A JP2016158527A JP6654116B2 JP 6654116 B2 JP6654116 B2 JP 6654116B2 JP 2016158527 A JP2016158527 A JP 2016158527A JP 2016158527 A JP2016158527 A JP 2016158527A JP 6654116 B2 JP6654116 B2 JP 6654116B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 claims description 240
- 238000007789 sealing Methods 0.000 claims description 55
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 12
- 238000010586 diagram Methods 0.000 description 6
- 229920002050 silicone resin Polymers 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- H—ELECTRICITY
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/041—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00
- H01L25/042—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00 the devices being arranged next to each other
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
- H04N1/028—Details of scanning heads ; Means for illuminating the original for picture information pick-up
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
- H04N1/028—Details of scanning heads ; Means for illuminating the original for picture information pick-up
- H04N1/03—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array
- H04N1/031—Details of scanning heads ; Means for illuminating the original for picture information pick-up with photodetectors arranged in a substantially linear array the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors
- H04N1/0318—Integral pick-up heads, i.e. self-contained heads whose basic elements are a light-source, a lens array and a photodetector array which are supported by a single-piece frame
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/04—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa
- H04N1/19—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa using multi-element arrays
- H04N1/191—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa using multi-element arrays the array comprising a one-dimensional array, or a combination of one-dimensional arrays, or a substantially one-dimensional array, e.g. an array of staggered elements
- H04N1/192—Simultaneously or substantially simultaneously scanning picture elements on one main scanning line
- H04N1/193—Simultaneously or substantially simultaneously scanning picture elements on one main scanning line using electrically scanned linear arrays, e.g. linear CCD arrays
- H04N1/1934—Combination of arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N2201/00—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof
- H04N2201/024—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted
- H04N2201/028—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted for picture information pick-up
- H04N2201/03—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted for picture information pick-up deleted
- H04N2201/031—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted for picture information pick-up deleted deleted
- H04N2201/03104—Integral pick-up heads, i.e. self-contained heads whose basic elements are a light source, a lens and a photodetector supported by a single-piece frame
- H04N2201/03108—Components of integral heads
- H04N2201/03141—Photodetector lens
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N2201/00—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof
- H04N2201/024—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted
- H04N2201/028—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted for picture information pick-up
- H04N2201/03—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted for picture information pick-up deleted
- H04N2201/031—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted for picture information pick-up deleted deleted
- H04N2201/03104—Integral pick-up heads, i.e. self-contained heads whose basic elements are a light source, a lens and a photodetector supported by a single-piece frame
- H04N2201/03108—Components of integral heads
- H04N2201/03145—Photodetector
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Description
Claims (10)
- 一次元状に配列された複数の受光領域を有する第1センサチップと、
一次元状に配列された複数の受光領域を有する第2センサチップと、
前記第1センサチップの一部を一端側において突出させて前記第1センサチップを搭載する第1基板と、
前記第2センサチップの一部を一端側において突出させて前記第2センサチップを搭載する第2基板と、
前記第1基板の前記一端側と前記第2基板の前記一端側とが対向した状態で前記第1基板および前記第2基板を搭載する共通支持基板と、
対向している前記第1基板の前記一端側と前記第2基板の前記一端側との間の間隙において前記第1センサチップおよび前記第2センサチップを挟んで両側に設けられた支持部と、
前記第1基板、前記第2基板および前記支持部の上において前記第1センサチップおよび前記第2センサチップを囲んで環状に設けられたダム部と、
前記ダム部により囲われた領域において前記第1センサチップおよび前記第2センサチップを封止する封止部と、
を備えるリニアイメージセンサ。 - 前記第1基板が、前記第1センサチップに加えて、一次元状に配列された複数の受光領域を有する他のセンサチップを搭載し、
前記第2基板が、前記第2センサチップに加えて、一次元状に配列された複数の受光領域を有する他のセンサチップを搭載し、
前記ダム部が、前記第1センサチップおよび前記第2センサチップに加えてこれら他のセンサチップを囲んで環状に設けられ、
前記封止部が、前記ダム部により囲われた領域において前記第1センサチップおよび前記第2センサチップに加えてこれら他のセンサチップを封止する、
請求項1に記載のリニアイメージセンサ。 - 前記支持部が、前記間隙において前記第1センサチップおよび前記第2センサチップに対して一方側から他方側にかけて連続して設けられている、
請求項1または2に記載のリニアイメージセンサ。 - 前記支持部が、前記共通支持基板の上面に至るまで設けられている、
請求項1〜3の何れか1項に記載のリニアイメージセンサ。 - 前記支持部、前記ダム部および前記封止部それぞれが樹脂からなる、
請求項1〜4の何れか1項に記載のリニアイメージセンサ。 - 一次元状に配列された複数の受光領域を有する第1センサチップの一部を第1基板の一端側において突出させた状態で前記第1センサチップを前記第1基板上に搭載する第1基板搭載ステップと、
一次元状に配列された複数の受光領域を有する第2センサチップの一部を第2基板の一端側において突出させた状態で前記第2センサチップを前記第2基板上に搭載する第2基板搭載ステップと、
前記第1基板搭載ステップおよび前記第2基板搭載ステップの後に、共通支持基板上において、前記第1基板の前記一端側と前記第2基板の前記一端側とを対向させ、前記第1センサチップおよび前記第2センサチップそれぞれの受光領域の配列に基づいて前記第1基板および前記第2基板の配置を調整して、前記第1センサチップおよび前記第2センサチップを搭載する共通支持基板搭載ステップと、
前記共通支持基板搭載ステップの後に、対向している前記第1基板の前記一端側と前記第2基板の前記一端側との間の間隙において前記第1センサチップおよび前記第2センサチップを挟んで両側に設けられた支持部を形成する支持部形成ステップと、
前記支持部形成ステップの後に、前記第1基板、前記第2基板および前記支持部の上において前記第1センサチップおよび前記第2センサチップを囲んで環状に設けられたダム部を形成するダム部形成ステップと、
前記ダム部形成ステップの後に、前記ダム部により囲われた領域において前記第1センサチップおよび前記第2センサチップを封止する封止部を形成する封止部形成ステップと、
を備えるリニアイメージセンサ製造方法。 - 前記第1基板搭載ステップにおいて、前記第1センサチップに加えて、一次元状に配列された複数の受光領域を有する他のセンサチップを前記第1基板上に搭載し、
前記第2基板搭載ステップにおいて、前記第2センサチップに加えて、一次元状に配列された複数の受光領域を有する他のセンサチップを前記第2基板上に搭載し、
前記ダム部形成ステップにおいて、前記第1センサチップおよび前記第2センサチップに加えて前記他のセンサチップを囲んで環状に設けられた前記ダム部を形成し、
前記封止部形成ステップにおいて、前記ダム部により囲われた領域において前記第1センサチップおよび前記第2センサチップに加えて前記他のセンサチップを封止する前記封止部を形成する、
請求項6に記載のリニアイメージセンサ製造方法。 - 前記支持部形成ステップにおいて、前記間隙において前記第1センサチップおよび前記第2センサチップに対して一方側から他方側にかけて連続して前記支持部を形成する、
請求項6または7に記載のリニアイメージセンサ製造方法。 - 前記支持部形成ステップにおいて、前記共通支持基板の上面に至るまで前記支持部を形成する、
請求項6〜8の何れか1項に記載のリニアイメージセンサ製造方法。 - 前記支持部、前記ダム部および前記封止部それぞれとして樹脂を用いる、
請求項6〜9の何れか1項に記載のリニアイメージセンサ製造方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016158527A JP6654116B2 (ja) | 2016-08-12 | 2016-08-12 | リニアイメージセンサおよびその製造方法 |
PCT/JP2017/026892 WO2018030147A1 (ja) | 2016-08-12 | 2017-07-25 | リニアイメージセンサおよびその製造方法 |
US16/322,558 US10886316B2 (en) | 2016-08-12 | 2017-07-25 | Linear image sensor and method for manufacturing same |
DE112017004056.6T DE112017004056T5 (de) | 2016-08-12 | 2017-07-25 | Linearer Bildsensor und Verfahren zur Herstellung desselben |
TW110117731A TWI776513B (zh) | 2016-08-12 | 2017-08-02 | 圖像感測器及其製造方法 |
TW106126023A TWI729179B (zh) | 2016-08-12 | 2017-08-02 | 線性圖像感測器及其製造方法 |
US17/069,524 US11282880B2 (en) | 2016-08-12 | 2020-10-13 | Linear image sensor and method for manufacturing same |
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JP2016158527A JP6654116B2 (ja) | 2016-08-12 | 2016-08-12 | リニアイメージセンサおよびその製造方法 |
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JP2018026491A JP2018026491A (ja) | 2018-02-15 |
JP6654116B2 true JP6654116B2 (ja) | 2020-02-26 |
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US (2) | US10886316B2 (ja) |
JP (1) | JP6654116B2 (ja) |
DE (1) | DE112017004056T5 (ja) |
TW (2) | TWI776513B (ja) |
WO (1) | WO2018030147A1 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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LU86925A1 (fr) | 1987-06-19 | 1989-03-08 | Glaverbel | Article en verre transmettant la lumiere et presentant une faible reflexion speculaire |
JPS6482851A (en) * | 1987-09-25 | 1989-03-28 | Seiko Instr & Electronics | Image sensor module |
JPH0548061A (ja) * | 1991-08-13 | 1993-02-26 | Sony Corp | 密着型リニアセンサー |
DE60214701T2 (de) | 2001-04-13 | 2007-09-13 | Vertex Pharmaceuticals Inc., Cambridge | Inhibitoren von c-jun-n-terminalen-kinasen (jnk) und anderen proteinkinasen |
JP2008192853A (ja) * | 2007-02-05 | 2008-08-21 | Sharp Corp | 複数の半導体素子を備える半導体装置、および半導体装置の製造方法 |
JP5732286B2 (ja) * | 2011-03-16 | 2015-06-10 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP5587392B2 (ja) * | 2011-12-22 | 2014-09-10 | キヤノン・コンポーネンツ株式会社 | イメージセンサユニット、画像読取装置および画像形成装置 |
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2016
- 2016-08-12 JP JP2016158527A patent/JP6654116B2/ja active Active
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2017
- 2017-07-25 DE DE112017004056.6T patent/DE112017004056T5/de active Pending
- 2017-07-25 US US16/322,558 patent/US10886316B2/en active Active
- 2017-07-25 WO PCT/JP2017/026892 patent/WO2018030147A1/ja active Application Filing
- 2017-08-02 TW TW110117731A patent/TWI776513B/zh active
- 2017-08-02 TW TW106126023A patent/TWI729179B/zh active
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Publication number | Publication date |
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US11282880B2 (en) | 2022-03-22 |
US20210028211A1 (en) | 2021-01-28 |
TW202135335A (zh) | 2021-09-16 |
TWI776513B (zh) | 2022-09-01 |
DE112017004056T5 (de) | 2019-04-25 |
TWI729179B (zh) | 2021-06-01 |
US20190189660A1 (en) | 2019-06-20 |
TW201806176A (zh) | 2018-02-16 |
JP2018026491A (ja) | 2018-02-15 |
WO2018030147A1 (ja) | 2018-02-15 |
US10886316B2 (en) | 2021-01-05 |
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