JPS6482851A - Image sensor module - Google Patents

Image sensor module

Info

Publication number
JPS6482851A
JPS6482851A JP62240350A JP24035087A JPS6482851A JP S6482851 A JPS6482851 A JP S6482851A JP 62240350 A JP62240350 A JP 62240350A JP 24035087 A JP24035087 A JP 24035087A JP S6482851 A JPS6482851 A JP S6482851A
Authority
JP
Japan
Prior art keywords
work
transparent resin
sensor
optical
image sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62240350A
Other languages
Japanese (ja)
Inventor
Masaaki Bandai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP62240350A priority Critical patent/JPS6482851A/en
Publication of JPS6482851A publication Critical patent/JPS6482851A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To have a sufficient environmental resistance at a low cost and to make uniform an optical distance between an original surface and a sensor surface over the full length by using an optical heat source in the curing process of a transparent resin which covers and protects a sensor IC chip. CONSTITUTION:A transparent resin 3 with comparatively low viscosity is supplied to the inside of a frame 2. After this work, a work is held horizontally for a while, after stabilizing the transparent resin, the optical heat source such as an infrared light is irradiated from the fight above of the work, and the resin is temporarily cured by heat-generating a light absorbing area 9. Further, the work is set in a curing furnace and is permanently cured. Thus, an image sensor module, in which the optical distance between the transparent resin 3 and the surface of a sensor IC chip 1 is uniform in every place, can be obtained.
JP62240350A 1987-09-25 1987-09-25 Image sensor module Pending JPS6482851A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62240350A JPS6482851A (en) 1987-09-25 1987-09-25 Image sensor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62240350A JPS6482851A (en) 1987-09-25 1987-09-25 Image sensor module

Publications (1)

Publication Number Publication Date
JPS6482851A true JPS6482851A (en) 1989-03-28

Family

ID=17058180

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62240350A Pending JPS6482851A (en) 1987-09-25 1987-09-25 Image sensor module

Country Status (1)

Country Link
JP (1) JPS6482851A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018030147A1 (en) * 2016-08-12 2018-02-15 浜松ホトニクス株式会社 Linear image sensor and method for manufacturing same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018030147A1 (en) * 2016-08-12 2018-02-15 浜松ホトニクス株式会社 Linear image sensor and method for manufacturing same
JP2018026491A (en) * 2016-08-12 2018-02-15 浜松ホトニクス株式会社 Linear image sensor and manufacturing method thereof
US10886316B2 (en) 2016-08-12 2021-01-05 Hamamatsu Photonics K.K. Linear image sensor and method for manufacturing same
US11282880B2 (en) 2016-08-12 2022-03-22 Hamamatsu Photonics K.K. Linear image sensor and method for manufacturing same

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