CN102680748B - 电子部件测试装置用线路板及其制造方法 - Google Patents

电子部件测试装置用线路板及其制造方法 Download PDF

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Publication number
CN102680748B
CN102680748B CN201210058936.0A CN201210058936A CN102680748B CN 102680748 B CN102680748 B CN 102680748B CN 201210058936 A CN201210058936 A CN 201210058936A CN 102680748 B CN102680748 B CN 102680748B
Authority
CN
China
Prior art keywords
board
external connection
electronic component
terminal
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210058936.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN102680748A (zh
Inventor
小野友义
秋田和重
野村俊寿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Publication of CN102680748A publication Critical patent/CN102680748A/zh
Application granted granted Critical
Publication of CN102680748B publication Critical patent/CN102680748B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN201210058936.0A 2011-03-07 2012-03-07 电子部件测试装置用线路板及其制造方法 Expired - Fee Related CN102680748B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011-048639 2011-03-07
JP2011048639 2011-03-07
JP2011224720A JP5777997B2 (ja) 2011-03-07 2011-10-12 電子部品検査装置用配線基板およびその製造方法
JP2011-224720 2011-10-12

Publications (2)

Publication Number Publication Date
CN102680748A CN102680748A (zh) 2012-09-19
CN102680748B true CN102680748B (zh) 2016-01-20

Family

ID=46794503

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210058936.0A Expired - Fee Related CN102680748B (zh) 2011-03-07 2012-03-07 电子部件测试装置用线路板及其制造方法

Country Status (4)

Country Link
US (1) US8981237B2 (https=)
JP (1) JP5777997B2 (https=)
KR (1) KR101568054B1 (https=)
CN (1) CN102680748B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5798435B2 (ja) * 2011-03-07 2015-10-21 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
JP6110117B2 (ja) * 2012-11-29 2017-04-05 株式会社日本マイクロニクス プローブ組立体及びプローブ基板
CN107172808A (zh) * 2016-03-08 2017-09-15 讯芯电子科技（中山）有限公司 双面直接镀铜陶瓷电路板及其制造方法
US10705134B2 (en) 2017-12-04 2020-07-07 International Business Machines Corporation High speed chip substrate test fixture
CN114624568B (zh) * 2022-02-24 2025-08-08 长江存储科技有限责任公司 失效分析装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0520841A1 (en) * 1991-06-27 1992-12-30 Motorola, Inc. Composite flip chip semi-conductor device and method for making and burning-in the same
CN1171167A (zh) * 1994-11-15 1998-01-21 佛姆法克特股份有限公司 微电子组件的复合中间连接元件及其制法
CN1307793A (zh) * 1998-06-30 2001-08-08 佛姆法克特股份有限公司 带有弹性封装的一电子器件的组件
CN101256202A (zh) * 2006-12-08 2008-09-03 日本特殊陶业株式会社 电子器件检查布线板及其制造方法

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7198969B1 (en) * 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5258330A (en) * 1990-09-24 1993-11-02 Tessera, Inc. Semiconductor chip assemblies with fan-in leads
US5258648A (en) * 1991-06-27 1993-11-02 Motorola, Inc. Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
JPH0653277A (ja) * 1992-06-04 1994-02-25 Lsi Logic Corp 半導体装置アセンブリおよびその組立方法
US20050062492A1 (en) 2001-08-03 2005-03-24 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
JPH0758241A (ja) * 1993-08-18 1995-03-03 Shinko Electric Ind Co Ltd セラミックパッケージ、回路基板およびその製造方法
US7064566B2 (en) * 1993-11-16 2006-06-20 Formfactor, Inc. Probe card assembly and kit
EP0795200B1 (en) 1994-11-15 2007-10-24 FormFactor, Inc. Mounting electronic components to a circuit board
US20100065963A1 (en) 1995-05-26 2010-03-18 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
JPH09186453A (ja) * 1995-12-27 1997-07-15 Toshiba Corp 配線基板の製造方法とその配線基板構造
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits
JP3681542B2 (ja) * 1998-07-01 2005-08-10 富士通株式会社 プリント回路基板および多段バンプ用中継基板
JP3656484B2 (ja) * 1999-03-03 2005-06-08 株式会社村田製作所 セラミック多層基板の製造方法
KR20020091785A (ko) 2001-05-31 2002-12-06 니혼도꾸슈도교 가부시키가이샤 전자부품 및 이것을 사용한 이동체 통신장치
JP2003017851A (ja) * 2001-06-29 2003-01-17 Murata Mfg Co Ltd 多層セラミック基板の製造方法
US6729019B2 (en) 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card
US7102367B2 (en) * 2002-07-23 2006-09-05 Fujitsu Limited Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof
US20060091510A1 (en) * 2004-03-11 2006-05-04 Chipmos Technologies (Bermuda) Ltd. Probe card interposer
US7459795B2 (en) * 2004-08-19 2008-12-02 Formfactor, Inc. Method to build a wirebond probe card in a many at a time fashion
JP4668210B2 (ja) 2004-12-21 2011-04-13 旭化成せんい株式会社 分離膜支持体
US7898276B2 (en) * 2005-03-01 2011-03-01 Sv Probe Pte Ltd. Probe card with stacked substrate
KR100890231B1 (ko) * 2005-11-25 2009-03-25 가부시키가이샤 무라타 세이사쿠쇼 다층 세라믹 기판의 제조 방법
US7821283B2 (en) 2005-12-22 2010-10-26 Jsr Corporation Circuit board apparatus for wafer inspection, probe card, and wafer inspection apparatus
CN101346813A (zh) 2005-12-22 2009-01-14 Jsr株式会社 晶片检查用电路基板装置、探针卡和晶片检查装置
JP5050384B2 (ja) * 2006-03-31 2012-10-17 富士通セミコンダクター株式会社 半導体装置およびその製造方法
ATE492147T1 (de) * 2006-08-07 2011-01-15 Murata Manufacturing Co Verfahren zur herstellung eines keramischen, mehrschichtsubstrats
US7875810B2 (en) * 2006-12-08 2011-01-25 Ngk Spark Plug Co., Ltd. Electronic component-inspection wiring board and method of manufacturing the same
JPWO2008120755A1 (ja) * 2007-03-30 2010-07-15 日本電気株式会社 機能素子内蔵回路基板及びその製造方法、並びに電子機器
US7911805B2 (en) * 2007-06-29 2011-03-22 Tessera, Inc. Multilayer wiring element having pin interface
JP2009192309A (ja) 2008-02-13 2009-08-27 Shinko Electric Ind Co Ltd 半導体検査装置
US7692436B2 (en) * 2008-03-20 2010-04-06 Touchdown Technologies, Inc. Probe card substrate with bonded via
KR101555379B1 (ko) * 2008-06-30 2015-09-23 니혼도꾸슈도교 가부시키가이샤 전기검사용 기판 및 그 제조방법
KR101120987B1 (ko) * 2009-07-08 2012-03-06 주식회사 에이엠에스티 프로브 카드
JP5386272B2 (ja) * 2009-08-21 2014-01-15 日本電子材料株式会社 プローブカード
US20130265073A1 (en) * 2011-01-16 2013-10-10 Japan Electronic Materials Corporation Probe Card And Manufacturing Method Therefor
JP5798435B2 (ja) * 2011-03-07 2015-10-21 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
JP5670806B2 (ja) * 2011-04-01 2015-02-18 日本特殊陶業株式会社 セラミック基板及びその製造方法
KR101270591B1 (ko) * 2011-06-02 2013-06-03 (주)기가레인 프로브 카드

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0520841A1 (en) * 1991-06-27 1992-12-30 Motorola, Inc. Composite flip chip semi-conductor device and method for making and burning-in the same
CN1171167A (zh) * 1994-11-15 1998-01-21 佛姆法克特股份有限公司 微电子组件的复合中间连接元件及其制法
CN1307793A (zh) * 1998-06-30 2001-08-08 佛姆法克特股份有限公司 带有弹性封装的一电子器件的组件
CN101256202A (zh) * 2006-12-08 2008-09-03 日本特殊陶业株式会社 电子器件检查布线板及其制造方法

Also Published As

Publication number Publication date
KR20120102024A (ko) 2012-09-17
KR101568054B1 (ko) 2015-11-10
US20120228017A1 (en) 2012-09-13
JP2012198190A (ja) 2012-10-18
JP5777997B2 (ja) 2015-09-16
CN102680748A (zh) 2012-09-19
US8981237B2 (en) 2015-03-17

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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Granted publication date: 20160120