CN102569335B - 存储元件、存储元件制造方法和存储装置 - Google Patents

存储元件、存储元件制造方法和存储装置 Download PDF

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Publication number
CN102569335B
CN102569335B CN201110399205.8A CN201110399205A CN102569335B CN 102569335 B CN102569335 B CN 102569335B CN 201110399205 A CN201110399205 A CN 201110399205A CN 102569335 B CN102569335 B CN 102569335B
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CN
China
Prior art keywords
layer
electrode
memory element
resistance change
ion source
Prior art date
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Expired - Fee Related
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CN201110399205.8A
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English (en)
Chinese (zh)
Other versions
CN102569335A (zh
Inventor
清宏彰
保田周郎
保田周一郎
河内山彰
水口徹也
紫牟田雅之
大场和博
荒谷胜久
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Sony Semiconductor Solutions Corp
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Sony Corp
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Publication date
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Publication of CN102569335A publication Critical patent/CN102569335A/zh
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Publication of CN102569335B publication Critical patent/CN102569335B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20—Multistable switching devices, e.g. memristors
    • H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011—Manufacture or treatment of multistable switching devices
    • H10N70/021—Formation of switching materials, e.g. deposition of layers
    • H10N70/026—Formation of switching materials, e.g. deposition of layers by physical vapor deposition, e.g. sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011—Manufacture or treatment of multistable switching devices
    • H10N70/041—Modification of switching materials after formation, e.g. doping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20—Multistable switching devices, e.g. memristors
    • H10N70/24—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20—Multistable switching devices, e.g. memristors
    • H10N70/24—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
    • H10N70/245—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies the species being metal cations, e.g. programmable metallization cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/821—Device geometry
    • H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/841—Electrodes
    • H10N70/8416—Electrodes adapted for supplying ionic species
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/881—Switching materials

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
CN201110399205.8A 2010-12-13 2011-12-05 存储元件、存储元件制造方法和存储装置 Expired - Fee Related CN102569335B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010-276749 2010-12-13
JP2010276749 2010-12-13
JP2011124610A JP5708929B2 (ja) 2010-12-13 2011-06-02 記憶素子およびその製造方法、並びに記憶装置
JP2011-124610 2011-06-02

Publications (2)

Publication Number Publication Date
CN102569335A CN102569335A (zh) 2012-07-11
CN102569335B true CN102569335B (zh) 2016-08-03

Family

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CN201110399205.8A Expired - Fee Related CN102569335B (zh) 2010-12-13 2011-12-05 存储元件、存储元件制造方法和存储装置

Country Status (5)

Country Link
US (1) US9112149B2 (enExample)
JP (1) JP5708929B2 (enExample)
KR (1) KR101984308B1 (enExample)
CN (1) CN102569335B (enExample)
TW (1) TWI462356B (enExample)

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KR102166506B1 (ko) * 2012-12-26 2020-10-15 소니 세미컨덕터 솔루션즈 가부시키가이샤 기억 장치 및 그 제조 방법
US20140264224A1 (en) * 2013-03-14 2014-09-18 Intermolecular, Inc. Performance Enhancement of Forming-Free ReRAM Devices Using 3D Nanoparticles
US8981334B1 (en) * 2013-11-01 2015-03-17 Micron Technology, Inc. Memory cells having regions containing one or both of carbon and boron
KR20180085057A (ko) 2014-03-28 2018-07-25 제이엑스금속주식회사 Al-Te-Cu-Zr 합금으로 이루어지는 스퍼터링 타깃 및 그 제조 방법
TWI667354B (zh) * 2014-10-09 2019-08-01 日商Ｊｘ日鑛日石金屬股份有限公司 由Ａｌ－Ｔｅ－Ｃｕ－Ｚｒ系合金組成之濺鍍靶及其製造方法
CN106601909B (zh) * 2016-12-20 2019-08-02 南京邮电大学 一种卟啉忆阻器及其制备方法
CN107732010B (zh) * 2017-09-29 2020-07-10 华中科技大学 一种选通管器件及其制备方法
KR20190067668A (ko) * 2017-12-07 2019-06-17 에스케이하이닉스 주식회사 저항 변화 소자
WO2020138975A1 (ko) * 2018-12-26 2020-07-02 한양대학교 에리카산학협력단 메모리 소자 및 그 제조 방법
JP2021048258A (ja) * 2019-09-18 2021-03-25 キオクシア株式会社 抵抗変化素子
CN114420838A (zh) * 2021-12-30 2022-04-29 长江先进存储产业创新中心有限责任公司 相变存储器及其制造方法
KR102747797B1 (ko) * 2022-07-28 2024-12-31 고려대학교산학협력단 전기화학적 금속화 스위치 및 이의 제조 방법

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Publication number Priority date Publication date Assignee Title
JP4792714B2 (ja) * 2003-11-28 2011-10-12 ソニー株式会社 記憶素子及び記憶装置
US7199394B2 (en) * 2004-08-17 2007-04-03 Spansion Llc Polymer memory device with variable period of retention time
US20060245235A1 (en) * 2005-05-02 2006-11-02 Advanced Micro Devices, Inc. Design and operation of a resistance switching memory cell with diode
JP3913258B2 (ja) * 2005-06-30 2007-05-09 シャープ株式会社 半導体記憶装置
JP2008135659A (ja) * 2006-11-29 2008-06-12 Sony Corp 記憶素子、記憶装置
US8097878B2 (en) * 2007-03-05 2012-01-17 Intermolecular, Inc. Nonvolatile memory elements with metal-deficient resistive-switching metal oxides
JP2008251108A (ja) * 2007-03-30 2008-10-16 Toshiba Corp 情報記録再生装置
JP2009043905A (ja) * 2007-08-08 2009-02-26 Hitachi Ltd 半導体装置
JP5050813B2 (ja) * 2007-11-29 2012-10-17 ソニー株式会社 メモリセル
JP5257573B2 (ja) * 2007-12-06 2013-08-07 ソニー株式会社 記憶素子および記憶装置
JP4466738B2 (ja) * 2008-01-09 2010-05-26 ソニー株式会社 記憶素子および記憶装置
JP5361864B2 (ja) * 2008-04-03 2013-12-04 株式会社東芝 不揮発性記憶装置及びその製造方法
US20110096595A1 (en) * 2008-06-20 2011-04-28 Masayuki Terai Semiconductor memory device and operation method thereof
TWI426551B (zh) * 2009-03-25 2014-02-11 Ind Tech Res Inst 立體金屬氧化物電極及其製造方法
JP2010278275A (ja) * 2009-05-29 2010-12-09 Sony Corp 半導体記憶装置
JP2011124511A (ja) * 2009-12-14 2011-06-23 Sony Corp 記憶素子および記憶装置
US8216862B2 (en) * 2010-03-16 2012-07-10 Sandisk 3D Llc Forming and training processes for resistance-change memory cell
US8427859B2 (en) * 2010-04-22 2013-04-23 Micron Technology, Inc. Arrays of vertically stacked tiers of non-volatile cross point memory cells, methods of forming arrays of vertically stacked tiers of non-volatile cross point memory cells, and methods of reading a data value stored by an array of vertically stacked tiers of non-volatile cross point memory cells

Also Published As

Publication number Publication date
KR20120065933A (ko) 2012-06-21
JP5708929B2 (ja) 2015-04-30
JP2012142543A (ja) 2012-07-26
TW201228059A (en) 2012-07-01
CN102569335A (zh) 2012-07-11
US9112149B2 (en) 2015-08-18
KR101984308B1 (ko) 2019-05-30
US20120145987A1 (en) 2012-06-14
TWI462356B (zh) 2014-11-21

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C06 Publication
PB01 Publication
C53 Correction of patent of invention or patent application
CB03 Change of inventor or designer information

Inventor after: Qing Hongzhang

Inventor after: Yasuda Shuichiro

Inventor after: Kauchi Yamaakira

Inventor after: Mizuguchi Tetsuya

Inventor after: Shimuta Masayuki

Inventor after: Ohba Kazuhiro

Inventor after: Katsuhisa Aratani

Inventor before: Qing Hongzhang

Inventor before: Yasuda Shuichiro

COR Change of bibliographic data

Free format text: CORRECT: INVENTOR; FROM: HIROAKI SEI SHUICHIRO YASUDA TO: HIROAKI SEI SHUICHIRO YASUDA AKIRA KOUCHIYAMA TETSUYA MIZUGUCHI MASAYUKI SHIMUTA KAZUHIRO OHBA KATSUHISA ARATANI

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GR01 Patent grant
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TR01 Transfer of patent right

Effective date of registration: 20160920

Address after: Kanagawa

Patentee after: SONY semiconductor solutions

Address before: Tokyo, Japan

Patentee before: Sony Corp

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160803

Termination date: 20201205