CN102369791B - 多层配线基板的制造方法及通过该方法获得的多层配线基板 - Google Patents
多层配线基板的制造方法及通过该方法获得的多层配线基板 Download PDFInfo
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- CN102369791B CN102369791B CN2010800115999A CN201080011599A CN102369791B CN 102369791 B CN102369791 B CN 102369791B CN 2010800115999 A CN2010800115999 A CN 2010800115999A CN 201080011599 A CN201080011599 A CN 201080011599A CN 102369791 B CN102369791 B CN 102369791B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
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- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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Abstract
多层基板的制造方法,包含通过激光加工在预成型料上设置通路孔的穿孔工序、向该通路孔填充含有树脂构成成分和金属粉末的导电性糊剂的工序、在所填充的该导电性糊剂的上下配置铜箔或被构图的基材的铜箔部分并进行挤压的工序,作为导电性糊剂使用金属粉末的至少一部分熔融而相邻的金属粉末彼此合金化的合金型糊剂,作为预成型料,使用在将从60℃升温至200℃的温度曲线图中贮藏弹性率从增加变为减少的拐点处的贮藏弹性率设为A、将从减少变为增加的拐点处的贮藏弹性率设为B的情况下的比率A/B在预加热前为10以上的材料,在穿孔工序前对预成型料进行预加热,使比率A/B为不到10,由此获得导电性及其长期稳定性优异的多层配线基板。
Description
技术领域
本发明涉及多层配线基板的制造方法及通过该方法获得的多层配线基板,更详细而言,涉及用含有金属粉末的导电性糊剂填充通路孔的多层配线基板的制造方法。
背景技术
近年来,在电子学领域中,伴随着产品的轻薄短小化的趋势,对印刷配线基板来说同样的需求也正在提高。对于印刷配线基板的轻薄短小化,多层化是不可或缺的,在多层化的情况下,薄板化成为技术性课题。
作为多层配线基板的制造方法的现有技术,有如下的手法:例如,如图4所示,(a)在绝缘原材料的两面设置有铜箔层11的芯基板10上设置通路孔,在该通路孔的壁面实施通孔镀敷12后,印刷、填充通孔填充糊剂13,使其固化后,(b)研磨所填充的糊剂13的突出部,之后,(c)对两面实施盖镀敷14。另外,有如下的方法:如图5(a)所示,将具有涂布了树脂的层15的铜箔(CCL)16以其树脂层15朝向基板10的方式配置在基板10的两面,(b)通过挤压,通过芯基板10的树脂层15的树脂填充通路孔。
但是,前者具有如下问题,即:在糊剂研磨后基材有可能延伸,薄膜化有限度,另外,若进行盖镀敷,则表面的铜箔变厚,精细构图变得困难。另一方面,后者存在不能在通路孔上设置通路孔(层叠孔)的问题,或者基板表面的平滑性不足、长期可靠性试验时产生裂缝等问题。
针对这些问题,使用不进行如上所述的通孔镀敷或盖镀敷,而仅用导电性糊剂获得内层导通的方法,具体而言,采用使用通过导电性粉体与导电性粉体的接触表现出导电性的糊剂(以下将其称为粉体接触型糊剂)的冲压工法,但若使用这种糊剂,在通常的挤压条件下,存在糊剂正上方的基板产生突出、凹凸的问题,还有经时导电性变化率增大、长期可靠性恶化的问题。
对此,公开了一种方法,其使用含有通过加热而合金化的金属粉末的糊剂(以下将其称为“合金型糊剂”),在导电性粉体彼此及粉体和铜箔之间形成合金, 由此可提高导电性和其长期稳定性(专利文献1)。
另一方面,作为印刷基板的原材料,通常使用预成型料(专利文献2)。预成型料是指使热固化树脂处于B阶段状态的粘接片材,一般为使热固化树脂含浸于作为增强材料的玻璃布等中而制成的材料。在使用该预成型料制造基板时,在预成型料上如现有技术那样通过激光加工设置通路孔,填充导电性糊剂,在上下面配置铜箔或被构图的基材并进行挤压。
但是,在用上述合金型糊剂形成通孔时,由于当低熔点金属进行熔融前糊剂树脂成分完全固化时会妨碍合金化,因此需要减慢糊剂树脂成分的固化速度。然而,对于通用预成型料,存在如下问题:若减慢糊剂树脂成分的固化速度,则在挤压时,或产生导电性糊剂的渗透,或预成型料的树脂成分与糊剂彼此混合,不能获得所期待的特性。
现有技术文献
专利文献1:专利第4191678号公报
专利文献2:特开平7-176846号公报
发明内容
发明要解决的问题
本发明是鉴于上述而做出的,目的在于提供一种即使在使用成本方面有利的通用预成型料的情况下,也能够获得导电性和其长期稳定性优异的多层配线基板(以下称为“多层基板”)的制造方法及通过该方法获得的多层基板。
用于解决问题的手段
本发明的多层基板的制造方法,包含通过激光加工在预成型料上设置通路孔的穿孔工序、对该通路孔填充含有树脂构成成分和金属粉末的导电性糊剂的工序、在其填充的导电性糊剂的上下配置铜箔或被构图的基材的铜箔部分并进行挤压的工序,作为导电性糊剂,使用金属粉末的至少一部分熔融、相邻的金属粉末之间合金化的合金型糊剂,作为预成型料,使用在将从60℃升温至200℃的温度曲线图中贮藏弹性率从增加变为减少的拐点处的贮藏弹性率设为A、将从减少变为增加的拐点处的贮藏弹性率设为B的情况下比率A/B在预加热前为10以上的材料,通过在所述穿孔工序前对该预成型料进行预加热使比率A/B为不到10。
在上述中,作为预成型料,能够使用含有苯氧基树脂、环氧树脂及双马来 酰亚胺三嗪树脂(BT树脂)中至少一种的材料。
另外,预加热一般在80~140℃进行约30~120分钟。
进而,作为导电性糊剂,优选的是使用含有如下成分的材料,(A)相对于含有丙烯酸酯树脂单体及环氧树脂预聚物的树脂构成成分100重量份,(B)金属粉末200~2200重量份,该金属粉末包含至少一种熔点在180℃以下的低熔点金属,以及熔点在800℃以上的高熔点金属,该低熔点金属为单独的铟或者选自由锡、铅、铋及铟组成的组中的两种以上的合金,该高熔点金属为选自由金、银、铜及镍组成的组中的至少一种金属及/或选自该组的两种以上的金属的合金,(C)含有酚系固化剂0.3~35重量份的固化剂0.5~40重量份、及(D)助熔剂0.3~80重量份。
另外,本发明的多层配线基板为在预成型料上设置通路孔、对该通路孔填充导电性糊剂、在该填充的导电性糊剂的上下配置铜箔或被构图的基材的铜箔部分而成的多层基板,作为所述预成型料,使用在将从60℃升温至200℃的温度曲线图中贮藏弹性率从增加变为减少的拐点处的贮藏弹性率设为A、将从减少变为增加的拐点处的贮藏弹性率设为B的情况下比率A/B不到10的材料,并且,作为所述导电性糊剂,使用含有金属粉末的导电性糊剂,所述金属粉末包含通过加热彼此合金化的两种以上的金属。该多层配线基板能够通过上述的本发明的制造方法制造。
另外,在本说明书等中,金属粉末之间等的“合金化”是指,两种以上的金属熔融并一体化。例如,若对低熔点金属颗粒和高熔点金属颗粒混合的物质进行加热,则各自的颗粒的表层熔融并一体化,形成合金层。
发明效果
通过本发明的制造方法获得的多层基板,由于不使用盖镀敷,因此精细线构图成为可能,满足薄板化的要求。另外,由于导电性糊剂中包含的金属粉末彼此合金化,同时,金属粉末和通孔内的导电层端面合金化,因此导电性和其长期稳定性优异。另外,由于不产生渗透等问题,因此能够使用通用预成型料,也在成本方面有利。另外,也可形成层叠孔构造。进而,也能够容易地将多层基板与多层基板接合而以高收率制造超多层基板。如以上所述,能够使用通用装置且以低成本提供一种解决了现有技术的各种问题的高品质的多层基板。
附图说明
图1是表示本发明的多层基板的制造方法的一种实施方式的示意剖面图;
图2是表示本发明的多层基板的制造方法的其它实施方式的示意剖面图;
图3是模块化紧凑型流变仪(MCR)的贮藏弹性率测量图;
图4是表示现有的多层基板的制造方法的一例的示意剖面图;
图5是表示现有的多层基板的制造方法的其它例子的示意剖面图;
图6是表示基板的膨出量的评价方法的示意剖面图。
符号说明
1……预成型料
2……导电性糊剂
3、5……铜箔
4……图案化基板
10……芯基板
11……铜箔层
12……通孔镀敷
13……导电性糊剂
14……盖镀敷
15……树脂层
16……铜箔
具体实施方式
本发明的多层基板的制造方法至少包含(1)在预成型料上设置通路孔前进行预加热的工序、(2)在预加热的预成型料上通过激光加工设置通路孔的工序、(3)对该通路孔填充导电性糊剂的工序、(4)在该填充的导电性糊剂的上下的面上配置铜箔或被构图的基材的铜箔部分并进行挤压而一体化的工序。另外,在上述(3)中,作为导电性糊剂,使用含有因糊剂固化时的加热而熔融的金属粉末、熔融的金属粉末彼此合金化的合金型糊剂。另外,在(4)中,在层叠没有被构图的铜箔的情况下,在挤压后进行构图。
下面,利用图对本发明进一步具体地进行说明。图1是表示本发明的多层基板的制造方法之一实施方式的示意剖面图,表示(a)向预成型料1的通路孔填充导电性糊剂2,(b)在该预成型料1的上下两面配置铜箔3并挤压以一体化,(c)之后,进行构图的情况。符号2’表示导电性糊剂的固化物、符号3’表示被构图的铜箔。
另一方面,图2是表示本发明的其它实施方式的示意剖面图,表示(a)向预成型料1的通路孔填充导电性糊剂2,(b)在该预成型料1的上下两面按照图案化基板4的铜箔部分5与导电性糊剂接触的方式配置、挤压以一体化的情况。
本发明中使用的预成型料为,如图3所示,在将从60℃升温至200℃的温度曲线图中贮藏弹性率从增加变为减少的拐点a处的贮藏弹性率设为A、将从减少变为增加的拐点b处的贮藏弹性率设为B的情况下比率A/B在预加热前为10以上的预成型料。预成型料的贮藏弹性率的测定可以使用通常的流变仪(例如,Anton Paar制,Modular Compact Rheometer(MCR)300)。
预成型料的原材料没有特别限定,能够适当使用目前使用的以苯氧基树脂、环氧树脂、双马来酰亚胺三嗪树脂(BT树脂)中的至少一种为成分的原材料。另外,作为增强材料的玻璃纤维等也能够使用目前使用的材料。
对于预加热,选择比率A/B不到10的条件即可,因树脂的种类等不同而不同,但一般为在80~140℃、30~120分钟程度。预加热的定时优选为预加热后直到挤压工序的时间较短的定时。另外,进行预加热的方法也没有特别限定,优选为将预成型料夹持在不锈钢等表面平滑的板上进行。
因而,事先确认用于比率A/B成为不到10的所需时间,在通过上述激光加工设置通路孔的工序之前,夹持在表面平滑的板上,在事先确认的规定条件下由空气烘箱等加热即可。
另外,预加热后设置通路孔,但此时由于使用激光加工,孔的壁面被某种程度固化,即使这样也能够防止预成型料和糊剂树脂的混杂。
对于本发明中使用的导电性糊剂,只要是至少含有树脂构成成分和金属粉末,通过在规定温度下进行加热,树脂构成成分固化,同时,金属粉末的至少一部分熔融且金属粉末彼此或金属粉末和与其相接的铜箔或构图铜部分等的导电性端面发生合金化的导电性糊剂即可。
例如,优选:(A)相对于含有丙烯酸酯树脂单体及环氧树脂预聚物的树脂构成成分100重量份(以下仅称为份),将(B)由含有低熔点金属和高熔点金属、包含两种以上的金属的金属粉末200~2200份、(C)含有酚系固化剂0.3~35份的固化剂0.5~40份、及(D)助熔剂0.3~80份作为必须成分而含有的导电性糊剂。
作为丙烯酸酯树脂单体的具体例子,能够列举出丙烯酸异戊酯、新戊二醇二丙烯酸酯、三羟甲基丙烷三丙烯酸酯、二三羟甲基丙烷四丙烯酸酯、苯基缩水甘油醚丙烯酸酯六亚甲基二异氰酸酯氨酯预聚物、双酚A二缩水甘油醚丙烯酸加成物、乙二醇二甲基丙烯酸酯及二乙二醇二甲基丙烯酸酯等。
另外,作为环氧树脂的具体例子,能够列举出:双酚A型环氧树脂、溴化环氧树脂、双酚F型环氧树脂、酚醛清漆型环氧树脂、脂环式环氧树脂、缩水甘油胺型环氧树脂、缩水甘油醚型环氧树脂、缩水甘油酯型环氧树脂、杂环式环氧树脂等。
丙烯酸酯树脂和环氧树脂的配合比率(重量%)优选为5∶95~95∶5,更优选为20∶80~80∶20。
上述(A)树脂构成成分也可以是在丙烯酸酯树脂单体及环氧树脂预聚物中混合醇酸树脂、三聚氰胺树脂或二甲苯树脂中的一种以上的树脂构成物的成分。醇酸树脂、三聚氰胺树脂、二甲苯树脂为分别作为树脂改性剂使用的树脂,只要能够实现该目的即可,并没有特别限定。混合这些改性剂时的配合比为(A)成分总量中不到40重量%,优选不到10重量%。
金属粉末只要为通过加热就能发生合金化的金属粉末即可,但优选为含有一种以上熔点在180℃以下的低熔点金属和一种以上熔点在800℃以上的高熔点金属的、含有两种以上金属的金属粉末。作为两种以上金属的存在形态的例子,可以列举出将某种金属粉末与包含其他种类金属的金属粉末混合的形态,或用其他种类的金属被覆某种金属粉末的形态,或者将它们混合的形态。
作为低熔点金属及高熔点金属,除包含单一的金属之外,还可以使用两种以上的金属的合金。
作为低熔点金属的优选例,能够列举出单独的铟(熔点:156℃),或将锡(熔点:231℃)、铅(熔点:327℃)、铋(熔点:271℃)或铟中的两种以上制成合金使其熔点在180℃以下的金属,也可以使用两种以上的合金。
另外,作为高熔点金属的优选例,能够列举出金(熔点:1064℃)、银(熔点:961℃)、铜(熔点:1083℃)或镍(熔点:1455℃)或在此列举的两种以上金属的合金,也可以使用这些金属单体及合金中的两种以上,还可以将金属单体和合金组合使用。
金属粉末的形状没有限制,可以使用树枝状、球状、鳞片状等目前使用的形状。另外,粒径也没有限制,平均粒径一般在1~50μm程度。
上述金属粉末的配合量优选为相对于(A)树脂构成成分100份为200~2200份。另外,上述的低熔点金属粉末和高熔点金属粉末的配合比(重量比,下同)优选为8∶2~2∶8的范围内。
其次,(C)固化剂以酚系固化剂为必须成分,除此之外,也可以并用咪唑系固化剂、阳离子系固化剂、游离基系固化剂(聚合引发剂)等。
酚系固化剂的使用量优选相对于树脂构成成分100份为0.3~35份。酚系固化剂之外的固化剂的使用量优选为相对于树脂100份0.2~35份,固化剂全体优选为0.5~40份。
作为酚系固化剂的例子,能够列举出酚醛清漆、萘酚系化合物等。作为咪唑系固化剂的例子,能够列举出咪唑、2-十一烷基咪唑、2-十七烷基咪唑、2-乙基咪唑、2-苯基咪唑、2-乙基-4-甲基-咪唑、1-氰乙基-2-十一烷基咪唑、2-苯基咪唑。作为阳离子系固化剂的例子,能够列举出以三氟化硼的胺盐、对甲氧苯六氟磷酸重氮盐、二苯基碘鎓六氟磷酸盐、三苯基锍、四正丁基鏻四苯基硼酸酯、四正丁基鏻-o,o-二乙基二硫代磷酸酯等为代表的鎓系化合物。作为游离基系固化剂(聚合引发剂)的例子,能够列举出二枯基过氧化物、叔丁基枯基过氧化物、叔丁基氢过氧化物、氢过氧化异丙苯等。
进而,作为(D)成分的助熔剂为促进上述金属粉末的合金化的助熔剂,作为例子,能够列举出氯化锌、乳酸、柠檬酸、油酸、硬脂酸、谷氨酸、苯甲酸、草酸、谷氨酸盐酸盐、苯胺盐酸盐、溴化十六烷基吡啶、尿素、三乙醇胺、甘油、肼、松香等。助熔剂的使用量优选的是相对于树脂构成成分100份为0.3~80份。
本发明中使用的导电性糊剂是通过混合上述各成分获得的,但在市售的导电性糊剂中,能够适当使用例如タツタ システム·エレクトロニクス(株)制、メタライズペ一スト(MP系列)。
向预加热的预成型料的通路孔填充导电性糊剂后,通过在与使用的合金型糊剂相应的条件下进行挤压的同时进行加热,获得本发明的多层基板。使用本发明中进行了规定的预加热的预成型料将获得的多层基板之间接合,进而也能够容易地进行多层化。由于通过本发明获得的多层基板长期可靠性优异,且多 层基板彼此的接合部的可靠性也优异,因此,根据本发明,也能够高收率地制造先前存在困难的几十层的超多层基板。
实施例
下面,通过实施例对本发明进一步具体地进行说明,本发明不限定于以下的实施例。
1、基板的制作
分别使用如表1所示的厚度约为100μm的预成型料(松下电工(株)制R-1551或三菱气体化学(株)制GHPL-830),在实施例1~3、比较例3中如下述进行预加热,在比较例1、2中不进行预加热。在这些预成型料上,使用CO2激光设置 的孔,在通过印刷法填充表1所示的导电性糊剂后,使用真空压机在如下条件下进行挤压。
压力:0kg/cm2→面压10.2kg/cm2(升压17分钟、保持10分钟)→面压30.6kg/cm2(升压24分钟、保持46分钟)→0kg/cm2(减压23分钟)
温度:30℃→130℃(升温17分钟、保持10分钟)→180℃(升温24分钟、保持46分钟)→30℃(冷却23分钟)
作为预成型料的预加热,在厚度为1.2mm的不锈钢板上夹持预成型料,在设定为如表1所示的温度的恒温槽中,对其进行表所示的时间的加热处理。
预成型料的贮藏弹性率,使用Anton Paar制、Modular Compact Rheometer(MCR)300,在预加热前和预加热后(除比较例1、2以外)分别测量从60℃升温至200℃的温度曲线图中贮藏弹性率从增加变为减少的拐点a处的贮藏弹性率A、及从减少变为增加的拐点b处的贮藏弹性率B,并由这些测量值求出比率A/B。
作为导电性糊剂,如表1所示使用下面的合金型糊剂或粉体接触型糊剂。
合金型:タツタ システム·エレクトロニクス(株)制,メタライズペ一スト(MP系列)
粉体接触型:タツタ システム·エレクトロニクス(株)制,AE1840
2.基板的评价
基于通过上述制作所获得的多层基板进行下面的评价。
(1)挤压后的膨出
用光学显微镜观察完成基板的截面,测量图6所示的膨出量(s),将不足5μm 定为○、5μm以上定为×。
(2)初始导电性
对于 的初始导电性,制作200孔、400孔、600孔、800孔连结图案,测量电阻值。用各孔数除这些电阻值,求出每一孔的电阻值,算出其平均值。200孔、400孔、600孔连结图案制作是在N=6下进行,800孔连结图案制作是在N=2下进行。
对于 的初始导电性,制作200孔、400孔、600孔连结图案,测量电阻值。用各孔数除这些电阻值,求出每一孔的电阻值,算出其平均值。200孔、400孔、600孔连结图案制作是在N=4下进行。
(3)导电性变化率(长期可靠性)
在制作的任意的连结图案中将试验前测量的电阻值设为a、试验后测量的电阻值设为b,通过下式求出导电性变化率,将导电性变化率在±20%以内的情况定为○、不到-20%或超过20%的情况定为×。
(b-a)×100/a
长期可靠性试验条件如下。
焊锡浸渍试验:将在260℃的焊锡中浸渍10秒钟后在常温大气中进行冷却的循环重复三个循环。
压力锅试验(PCT):暴露于121℃、湿度100%、2个大气压的气氛中24小时。
热循环试验:暴露于反复进行1000次在-65℃下保持30分钟后在125℃下保持30分钟的循环的气氛中。
耐热性试验:在100℃的气氛下暴露1000小时。
耐湿性试验:在温度85℃、湿度85%的气氛下暴露1000小时。
(4)绝缘可靠性
向 的孔中填充导电性糊剂,按照孔间距为0.6mm、0.8mm、1.0mm这三种间距的方式制作梳状图案。对该图案施加50V直流电流,在温度85℃、湿度85%下暴露1000小时后,测量在试验气氛下的电阻值,将该电阻值在106Ω以上的情况定为○,不到106Ω的情况定为×。
[表1]
Claims (4)
1.多层基板的制造方法,包含:
通过激光加工在预成型料上设置通路孔的穿孔工序、向该通路孔中填充含有树脂构成成分和金属粉末的导电性糊剂的工序、在所填充的该导电性糊剂的上下配置铜箔或被构图的基材的铜箔部分并进行挤压的工序,其特征在于,
作为所述导电性糊剂,使用所述金属粉末的至少一部分熔融而相邻的金属粉末彼此合金化的合金型糊剂,所述合金型糊剂含有:
(A)含有丙烯酸酯树脂单体及环氧树脂预聚物的树脂构成成分100重量份,
(B)金属粉末200~2200重量份,该金属粉末包含至少一种熔点在180℃以下的低熔点金属并包含熔点在800℃以上的高熔点金属,该低熔点金属为单独的铟或者选自由锡、铅、铋及铟组成的组中的两种以上的合金,该高熔点金属为选自由金、银、铜及镍组成的组中的至少一种金属及/或选自该组的两种以上的金属的合金,
(C)含有0.3~35重量份酚系固化剂的固化剂0.5~40重量份,及
(D)助熔剂0.3~80重量份;
作为所述预成型料,使用在将从60℃升温至200℃的温度曲线图中贮藏弹性率从增加变为减少的拐点处的贮藏弹性率设为A、将从减少变为增加的拐点处的贮藏弹性率设为B的情况下的比率A/B在预加热前为10以上的材料,
通过在所述穿孔工序前对该预成型料进行预加热使所述比率A/B不足10。
2.权利要求1所述的多层配线基板的制造方法,其特征在于,
作为所述预成型料,使用含有苯氧基树脂、环氧树脂及双马来酰亚胺三嗪树脂中的至少一种的材料。
3.权利要求1或2所述的多层配线基板的制造方法,其特征在于,
所述预加热在80~140℃下进行30~120分钟。
4.通过权利要求1~3中任一项所述的制造方法制造的多层配线基板。
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- 2010-03-09 EP EP10750562.0A patent/EP2408285B1/en active Active
- 2010-03-09 CN CN2010800115999A patent/CN102369791B/zh active Active
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- 2010-03-09 US US13/256,114 patent/US8756805B2/en active Active
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US20140138126A1 (en) | 2014-05-22 |
EP2408285A4 (en) | 2017-11-22 |
US20120037409A1 (en) | 2012-02-16 |
WO2010103805A1 (ja) | 2010-09-16 |
EP2408285A1 (en) | 2012-01-18 |
EP2408285B1 (en) | 2018-11-14 |
JP4778114B2 (ja) | 2011-09-21 |
US9420706B2 (en) | 2016-08-16 |
TW201043109A (en) | 2010-12-01 |
US8756805B2 (en) | 2014-06-24 |
HK1167776A1 (en) | 2012-12-07 |
TWI419633B (zh) | 2013-12-11 |
CN102369791A (zh) | 2012-03-07 |
KR101114058B1 (ko) | 2012-03-13 |
JPWO2010103805A1 (ja) | 2012-09-13 |
KR20110112877A (ko) | 2011-10-13 |
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