JP4468750B2 - 導電性ペースト及びこれを用いた多層基板 - Google Patents
導電性ペースト及びこれを用いた多層基板 Download PDFInfo
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- JP4468750B2 JP4468750B2 JP2004192053A JP2004192053A JP4468750B2 JP 4468750 B2 JP4468750 B2 JP 4468750B2 JP 2004192053 A JP2004192053 A JP 2004192053A JP 2004192053 A JP2004192053 A JP 2004192053A JP 4468750 B2 JP4468750 B2 JP 4468750B2
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- 239000002184 metal Substances 0.000 claims description 48
- 238000002844 melting Methods 0.000 claims description 37
- 230000008018 melting Effects 0.000 claims description 36
- 239000003795 chemical substances by application Substances 0.000 claims description 31
- 239000003822 epoxy resin Substances 0.000 claims description 31
- 229920000647 polyepoxide Polymers 0.000 claims description 31
- 239000000843 powder Substances 0.000 claims description 25
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 12
- 230000004907 flux Effects 0.000 claims description 11
- 150000002739 metals Chemical class 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 7
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- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 5
- 125000002091 cationic group Chemical group 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- -1 electrode formation Substances 0.000 description 14
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- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical class FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
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- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
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- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- NDBJTKNWAOXLHS-UHFFFAOYSA-N 4-methoxybenzenediazonium Chemical class COC1=CC=C([N+]#N)C=C1 NDBJTKNWAOXLHS-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
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- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
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- 229910002065 alloy metal Inorganic materials 0.000 description 1
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- 239000002518 antifoaming agent Substances 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- DVBJBNKEBPCGSY-UHFFFAOYSA-M cetylpyridinium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+]1=CC=CC=C1 DVBJBNKEBPCGSY-UHFFFAOYSA-M 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004220 glutamic acid Substances 0.000 description 1
- 235000013922 glutamic acid Nutrition 0.000 description 1
- 229960003707 glutamic acid hydrochloride Drugs 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000003827 glycol group Chemical group 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
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- 235000021313 oleic acid Nutrition 0.000 description 1
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- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
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- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- 229960004418 trolamine Drugs 0.000 description 1
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- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Conductive Materials (AREA)
Description
表1に示す割合で各成分を配合し、混合して導電性ペーストを調製した。なお、使用した各成分の詳細は以下の通りである。
エポキシ樹脂:旭電化工業(株)製、EP4901E
アクリレート樹脂:2−ヒドロキシ−3−アクリロイロキシプロピルメタクリレート(80重量%)、トリエチレングリコールジアクリレート(20重量%)
イミダゾール系硬化剤:1−シアノエチル−2−ウンデシルイミダゾリウムトリメリテイト
カチオン系硬化剤:テトラ−n−ブチルホスホニウムテトラフェニルボレート
フェノール系硬化剤:荒川化学工業(株)製、タマノール758
金属粉:Sn−Bi合金金属粉(Sn:Bi=42:58、融点138℃、粒径20μm、50重量%)、銀粉(融点961℃、粒径20μm、50重量%)
フラックス:ヒドロキシエチルラウリルアミン
上記により得られた導電性ペーストを160℃で60分間加熱して硬化させ、TG/DTAを用いて融点測定したところ、260℃及び500℃付近に融点の吸熱ピークが観察された。また、電子顕微鏡及びX線マイクロアナライザーによる観察において、金属粉がメタライズ化しているのが確認された。
12、22……絶縁層
13、23……導電性ペースト
Claims (4)
- (A)エチレングリコール変性エポキシ樹脂20〜70重量%を含有するエポキシ樹脂からなる樹脂成分100重量部に対し、
(B)融点180℃以下の低融点金属少なくとも1種と融点800℃以上の高融点金属少なくとも1種とを含む、2種以上の金属からなる金属粉1300〜2400重量部、
(C)硬化剤0.5〜40重量部、及び
(D)フラックス0.3〜110重量部
を含有してなる、導電性ペースト。 - 前記(B)成分の低融点金属が、インジウム単独、又は錫、鉛、ビスマス及びインジウムからなる群から選択された1種又は2種以上の合金であることを特徴とする、請求項1に記載の導電性ペースト。
- 前記(C)成分が、イミダゾール系硬化剤、カチオン系硬化剤、及びフェノール系硬化剤からなる群から選択された1種又は2種以上であることを特徴とする、請求項1又は2に記載の導電性ペースト。
- 複数の導電層と絶縁層とが交互に積層されてなる多層基板であって、前記導電層間の導通が多層基板の厚み方向に設けられたホールに充填された導電性ペーストによって得られる多層基板において、
このホールに請求項1〜3のいずれか1項に記載の導電性ペーストが充填され、加熱されたことにより、導電性ペースト中に含有される金属粉が融解して相互に一体化し、合金化した
ことを特徴とする多層基板。
Priority Applications (1)
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Publications (2)
Publication Number | Publication Date |
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JP2006012734A JP2006012734A (ja) | 2006-01-12 |
JP4468750B2 true JP4468750B2 (ja) | 2010-05-26 |
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JP4949802B2 (ja) * | 2006-10-26 | 2012-06-13 | タツタ電線株式会社 | 導電性ペースト及びこれを用いた多層基板 |
KR101329695B1 (ko) | 2006-12-20 | 2013-11-14 | 에스케이케미칼주식회사 | 재작업이 가능한 에폭시 수지 조성물 |
JP4787195B2 (ja) * | 2007-03-26 | 2011-10-05 | 三菱樹脂株式会社 | ビアホール充填用導電性ペースト組成物とそれを用いた多層配線基板 |
US7910837B2 (en) | 2007-08-10 | 2011-03-22 | Napra Co., Ltd. | Circuit board, electronic device and method for manufacturing the same |
JP2013247339A (ja) * | 2012-05-29 | 2013-12-09 | Tdk Corp | 電子部品モジュールの製造方法 |
WO2016136204A1 (ja) * | 2015-02-27 | 2016-09-01 | タツタ電線株式会社 | 導電性ペースト及びこれを用いた多層基板 |
JP6835051B2 (ja) | 2018-09-26 | 2021-02-24 | 日亜化学工業株式会社 | 回路基板及び部品実装基板、並びに、それらの製造方法 |
CN111128442B (zh) * | 2020-01-07 | 2021-12-03 | 北京梦之墨科技有限公司 | 一种液态金属导电浆料及其制备方法、电子器件 |
TW202246423A (zh) * | 2021-05-25 | 2022-12-01 | 日商拓自達電線股份有限公司 | 導電性糊及使用其之多層基板 |
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US10178766B2 (en) | 2015-03-18 | 2019-01-08 | Tatsuta Electric Wire & Cable Co., Ltd. | Stretchable cable and stretchable circuit board |
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