JP4949802B2 - 導電性ペースト及びこれを用いた多層基板 - Google Patents
導電性ペースト及びこれを用いた多層基板 Download PDFInfo
- Publication number
- JP4949802B2 JP4949802B2 JP2006291568A JP2006291568A JP4949802B2 JP 4949802 B2 JP4949802 B2 JP 4949802B2 JP 2006291568 A JP2006291568 A JP 2006291568A JP 2006291568 A JP2006291568 A JP 2006291568A JP 4949802 B2 JP4949802 B2 JP 4949802B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- metal
- parts
- weight
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims description 40
- 229910052751 metal Inorganic materials 0.000 claims description 61
- 239000002184 metal Substances 0.000 claims description 61
- 229920000647 polyepoxide Polymers 0.000 claims description 39
- 239000003822 epoxy resin Substances 0.000 claims description 38
- 238000002844 melting Methods 0.000 claims description 36
- 230000008018 melting Effects 0.000 claims description 36
- 239000000843 powder Substances 0.000 claims description 33
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 25
- 239000000460 chlorine Substances 0.000 claims description 25
- 229910052801 chlorine Inorganic materials 0.000 claims description 25
- 239000003795 chemical substances by application Substances 0.000 claims description 21
- 239000004593 Epoxy Substances 0.000 claims description 15
- 230000004907 flux Effects 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 150000002739 metals Chemical class 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical group OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 8
- 238000012360 testing method Methods 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 238000001465 metallisation Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- HCYSJBICYOIBLS-UHFFFAOYSA-N 2-(dodecylamino)ethanol Chemical compound CCCCCCCCCCCCNCCO HCYSJBICYOIBLS-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- -1 hydroxyethyl lauryl Chemical group 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- RPAJSBKBKSSMLJ-DFWYDOINSA-N (2s)-2-aminopentanedioic acid;hydrochloride Chemical compound Cl.OC(=O)[C@@H](N)CCC(O)=O RPAJSBKBKSSMLJ-DFWYDOINSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 description 1
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- MMCPOSDMTGQNKG-UJZMCJRSSA-N aniline;hydrochloride Chemical compound Cl.N[14C]1=[14CH][14CH]=[14CH][14CH]=[14CH]1 MMCPOSDMTGQNKG-UJZMCJRSSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- DVBJBNKEBPCGSY-UHFFFAOYSA-M cetylpyridinium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+]1=CC=CC=C1 DVBJBNKEBPCGSY-UHFFFAOYSA-M 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004220 glutamic acid Substances 0.000 description 1
- 235000013922 glutamic acid Nutrition 0.000 description 1
- 229960003707 glutamic acid hydrochloride Drugs 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 229960004418 trolamine Drugs 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
Images
Landscapes
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
表1に示す割合で各成分を配合し、混合して導電性ペーストを調製した。なお、使用した各成分の詳細は以下の通りである。また、樹脂成分全体の加水分解性塩素濃度を表1に併記する。
エポキシ樹脂2(2官能エポキシ樹脂):ジャパンエポキシレジン(株)製、エピコート828EL(エポキシ当量180、加水分解性塩素濃度1000ppm)
エポキシ樹脂3(希釈剤):(株)ADEKA製、アデカレジンED529(エポキシ当量180、加水分解性塩素濃度500ppm)
エポキシ樹脂4:大日本インキ化学工業(株)製、HP820(エポキシ当量220、加水分解性塩素濃度2000ppm)
金属粉:Sn−Bi合金金属粉(Sn:Bi=42:58、融点138℃、粒径20μm)
銀粉:融点961℃、粒径20μm
フラックス:ヒドロキシエチルラウリルアミン
2……絶縁層
3……導電性ペースト
L1〜L6……導電層
Claims (4)
- (A)エポキシ当量が200〜600の範囲内であり、かつ加水分解性塩素濃度が200ppm未満であるエポキシ樹脂20重量部以上とこのエポキシ樹脂以外の樹脂80重量部以下とからなり、エチレングリコール変性エポキシ樹脂を含まず、かつ全体の加水分解性塩素濃度が1000ppm未満である樹脂成分100重量部に対し、
(B)融点180℃以下の低融点金属少なくとも1種と融点800℃以上の高融点金属少なくとも1種とを含む、2種以上の金属からなる金属粉200〜1800重量部、
(C)硬化剤3〜20重量部、及び
(D)フラックス3〜15重量部
を含有してなる、導電性ペースト。 - 前記(B)成分の低融点金属が、インジウム単独、又は錫、鉛、ビスマス及びインジウムからなる群から選択された1種又は2種以上の合金であり、高融点金属が、銀、銅、銀コート銅粉からなる群から選択された1種又は2種以上の金属粉からなることを特徴とする、請求項1に記載の導電性ペースト
- 前記低融点金属がスズ(Sn)とビスマス(Bi)の合金であり、その合金比率がSn:Bi=80:20〜42:58の範囲内であることを特徴とする、請求項1又は2に記載の導電性ペースト。
- 複数の導電層と絶縁層とが交互に積層されてなる多層基板であって、前記導電層間の導通が絶縁層の厚み方向に設けられた貫通もしくは有底のバイアホールに充填された導電性ペーストによって得られる多層基板において、このバイアホールに請求項1〜3のいずれか1項に記載の導電性ペーストが充填され、加熱されたことにより、導電性ペースト中に含有される金属粉が溶融して相互に一体化し、合金化したことを特徴とする多層基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006291568A JP4949802B2 (ja) | 2006-10-26 | 2006-10-26 | 導電性ペースト及びこれを用いた多層基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006291568A JP4949802B2 (ja) | 2006-10-26 | 2006-10-26 | 導電性ペースト及びこれを用いた多層基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008108629A JP2008108629A (ja) | 2008-05-08 |
JP4949802B2 true JP4949802B2 (ja) | 2012-06-13 |
Family
ID=39441793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006291568A Active JP4949802B2 (ja) | 2006-10-26 | 2006-10-26 | 導電性ペースト及びこれを用いた多層基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4949802B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10178766B2 (en) | 2015-03-18 | 2019-01-08 | Tatsuta Electric Wire & Cable Co., Ltd. | Stretchable cable and stretchable circuit board |
CN109679552A (zh) * | 2018-11-16 | 2019-04-26 | 云南科威液态金属谷研发有限公司 | 一种液态金属导电胶及其应用 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5217640B2 (ja) * | 2008-05-30 | 2013-06-19 | 富士通株式会社 | プリント配線板の製造方法およびプリント基板ユニットの製造方法 |
JP5633286B2 (ja) * | 2010-01-25 | 2014-12-03 | 日立化成株式会社 | 電極用ペースト組成物および太陽電池 |
US9390829B2 (en) | 2010-01-25 | 2016-07-12 | Hitachi Chemical Company, Ltd. | Paste composition for electrode and photovoltaic cell |
US9224517B2 (en) | 2011-04-07 | 2015-12-29 | Hitachi Chemical Company, Ltd. | Paste composition for electrode and photovoltaic cell |
JP2015115147A (ja) * | 2013-12-10 | 2015-06-22 | 旭硝子株式会社 | 金属粒子、導電膜形成用ペースト、および物品 |
WO2016136204A1 (ja) * | 2015-02-27 | 2016-09-01 | タツタ電線株式会社 | 導電性ペースト及びこれを用いた多層基板 |
JPWO2018116693A1 (ja) * | 2016-12-19 | 2019-10-24 | タツタ電線株式会社 | 導電性ペースト |
JP6835051B2 (ja) | 2018-09-26 | 2021-02-24 | 日亜化学工業株式会社 | 回路基板及び部品実装基板、並びに、それらの製造方法 |
CN111128435A (zh) * | 2018-10-31 | 2020-05-08 | 广州力及热管理科技有限公司 | 混合两种不同熔点金属粉末的电子浆料 |
CN111040691B (zh) * | 2019-11-29 | 2021-01-26 | 江苏富威尔电子材料科技有限公司 | 一种基于不同熔点多组分金属导电粘合剂及其制备方法 |
WO2022034696A1 (ja) * | 2020-08-11 | 2022-02-17 | タツタ電線株式会社 | 導電性組成物 |
TW202414442A (zh) * | 2022-09-01 | 2024-04-01 | 日商拓自達電線股份有限公司 | 導電性糊及使用其之多層基板 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4468750B2 (ja) * | 2004-06-29 | 2010-05-26 | タツタ システム・エレクトロニクス株式会社 | 導電性ペースト及びこれを用いた多層基板 |
-
2006
- 2006-10-26 JP JP2006291568A patent/JP4949802B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10178766B2 (en) | 2015-03-18 | 2019-01-08 | Tatsuta Electric Wire & Cable Co., Ltd. | Stretchable cable and stretchable circuit board |
CN109679552A (zh) * | 2018-11-16 | 2019-04-26 | 云南科威液态金属谷研发有限公司 | 一种液态金属导电胶及其应用 |
Also Published As
Publication number | Publication date |
---|---|
JP2008108629A (ja) | 2008-05-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4949802B2 (ja) | 導電性ペースト及びこれを用いた多層基板 | |
US7214419B2 (en) | Conductive paste multilayered board including the conductive paste and process for producing the same | |
KR101086358B1 (ko) | 도전성 페이스트 | |
KR101225497B1 (ko) | 도전성 접착제와 그 제조 방법 및 이를 포함하는 전자 장치 | |
US6515237B2 (en) | Through-hole wiring board | |
JP6001231B1 (ja) | 導電性ペースト及びこれを用いた多層基板 | |
WO2004068506A1 (ja) | 導電ペースト | |
KR101814084B1 (ko) | 세라믹 칩부품의 연성외부전극 형성용 도전성 페이스트 조성물 | |
JP4933217B2 (ja) | 導電性接着剤 | |
JP4468750B2 (ja) | 導電性ペースト及びこれを用いた多層基板 | |
JP3592006B2 (ja) | ビアホール充填用導電性ペースト及びそれを用いたプリント配線板 | |
TWI405519B (zh) | A conductive paste composition for hole filling, a printed circuit board using the same, and a method for manufacturing the same | |
JP2000290617A (ja) | 導電性接着剤およびその使用法 | |
JP2004047418A (ja) | 導電ペースト | |
JP4437946B2 (ja) | 導電性ペースト | |
JP4354047B2 (ja) | ビア充填用導電ペースト組成物 | |
JP2004055543A (ja) | 導電性ペースト | |
JP2008147220A (ja) | 多層配線基板の製造方法及びそれにより得られる多層配線基板 | |
JP2002289038A (ja) | ビア充填用導電ペースト組成物 | |
JP5861600B2 (ja) | 導電性接着剤組成物及びそれを用いた電子素子 | |
JP4224774B2 (ja) | 導電ペースト | |
JP2005353783A (ja) | 多層配線基板用導電性ペースト組成物 | |
JP4888295B2 (ja) | 導電性ペースト | |
JP2007273253A (ja) | 導電性ペースト | |
JP2004047419A (ja) | 導電ペースト |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090811 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20100707 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110114 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110412 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110609 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120306 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120308 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150316 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4949802 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |