CN102341912B - 半导体膜的形成方法、半导体器件的形成方法和半导体器件 - Google Patents

半导体膜的形成方法、半导体器件的形成方法和半导体器件 Download PDF

Info

Publication number
CN102341912B
CN102341912B CN201080009985.4A CN201080009985A CN102341912B CN 102341912 B CN102341912 B CN 102341912B CN 201080009985 A CN201080009985 A CN 201080009985A CN 102341912 B CN102341912 B CN 102341912B
Authority
CN
China
Prior art keywords
film
sno
amorphous
region
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201080009985.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN102341912A (zh
Inventor
薮田久人
加地信幸
林享
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN102341912A publication Critical patent/CN102341912A/zh
Application granted granted Critical
Publication of CN102341912B publication Critical patent/CN102341912B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate

Landscapes

  • Thin Film Transistor (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
CN201080009985.4A 2009-03-06 2010-03-01 半导体膜的形成方法、半导体器件的形成方法和半导体器件 Active CN102341912B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009053712A JP5506213B2 (ja) 2009-03-06 2009-03-06 半導体素子の形成方法
JP2009-053712 2009-03-06
PCT/JP2010/001383 WO2010100885A1 (en) 2009-03-06 2010-03-01 Method for forming semiconductor film, method for forming semiconductor device and semiconductor device

Publications (2)

Publication Number Publication Date
CN102341912A CN102341912A (zh) 2012-02-01
CN102341912B true CN102341912B (zh) 2015-12-02

Family

ID=42115923

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080009985.4A Active CN102341912B (zh) 2009-03-06 2010-03-01 半导体膜的形成方法、半导体器件的形成方法和半导体器件

Country Status (4)

Country Link
US (1) US8389996B2 (enExample)
JP (1) JP5506213B2 (enExample)
CN (1) CN102341912B (enExample)
WO (1) WO2010100885A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5360587B2 (ja) * 2009-12-04 2013-12-04 独立行政法人科学技術振興機構 n型半導体薄膜、ホモpn接合素子及び薄膜太陽電池並びにn型半導体薄膜及びホモpn接合素子の製造方法
JP5735306B2 (ja) * 2011-03-01 2015-06-17 国立大学法人東京工業大学 同時両極性電界効果型トランジスタ及びその製造方法
KR101835005B1 (ko) * 2011-04-08 2018-03-07 삼성전자주식회사 반도체소자 및 그 제조방법
JP6208971B2 (ja) * 2012-09-14 2017-10-04 ルネサスエレクトロニクス株式会社 半導体装置、及び半導体装置の製造方法
CN103681515B (zh) * 2013-12-24 2016-06-22 京东方科技集团股份有限公司 一种互补型薄膜晶体管驱动背板及其制备方法、显示装置
JP6547273B2 (ja) 2013-12-26 2019-07-24 株式会社リコー p型酸化物半導体、p型酸化物半導体製造用組成物、p型酸化物半導体の製造方法、半導体素子、表示素子、画像表示装置、及びシステム
US9985139B2 (en) 2014-11-12 2018-05-29 Qualcomm Incorporated Hydrogenated p-channel metal oxide semiconductor thin film transistors
US9685542B2 (en) * 2014-12-30 2017-06-20 Qualcomm Incorporated Atomic layer deposition of P-type oxide semiconductor thin films
US9647135B2 (en) * 2015-01-22 2017-05-09 Snaptrack, Inc. Tin based p-type oxide semiconductor and thin film transistor applications
CN106191774A (zh) * 2015-05-08 2016-12-07 清华大学 锡氧化物靶材及其制备方法
US9680030B1 (en) 2015-12-02 2017-06-13 Advanced Device Research Inc. Enhancement-mode field effect transistor having metal oxide channel layer
TWI566417B (zh) * 2015-12-04 2017-01-11 財團法人工業技術研究院 p型金屬氧化物半導體材料與電晶體
JP6942943B2 (ja) * 2016-07-22 2021-09-29 株式会社リコー 半導体素子の製造方法
KR102676341B1 (ko) * 2016-12-30 2024-06-17 엘지디스플레이 주식회사 박막 트랜지스터, 그의 제조방법, 및 그를 포함한 표시장치
KR102145387B1 (ko) * 2019-01-07 2020-08-18 한양대학교 산학협력단 박막 트랜지스터 및 그 제조방법
JP2024085505A (ja) * 2022-12-15 2024-06-27 東京エレクトロン株式会社 半導体装置の製造方法及び半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030218221A1 (en) * 2002-05-21 2003-11-27 the State of Oregon acting by and through the behalf of Oregon State University Transistor structures and methods for making the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL294370A (enExample) * 1963-06-20
JPH02271917A (ja) * 1989-04-10 1990-11-06 Sanyo Electric Co Ltd SnO↓2膜の形成方法及び光起電力装置の製造方法
JP2002235177A (ja) 2001-02-07 2002-08-23 Star Micronics Co Ltd SnO膜及びその作製方法
JP4788238B2 (ja) 2005-08-22 2011-10-05 富士電機株式会社 薄膜ガスセンサの製造方法および薄膜ガスセンサ
KR100729043B1 (ko) 2005-09-14 2007-06-14 삼성에스디아이 주식회사 투명 박막 트랜지스터 및 그의 제조방법
JP4946123B2 (ja) * 2006-03-27 2012-06-06 セイコーエプソン株式会社 半導体装置、電気光学装置および電子機器
BRPI0721193B8 (pt) * 2007-02-05 2019-10-29 Univ Nova De Lisboa dispositivo semicondutor eletrônico baseado em óxidos de cobre e níquel e gálio-estanho-zinco-cobre-titânio tipos p e n, e respectivo processo de fabricação
JP5168605B2 (ja) * 2008-07-24 2013-03-21 独立行政法人科学技術振興機構 pチャネル薄膜トランジスタとその製造方法
JP2009053712A (ja) 2008-10-28 2009-03-12 Mitsubishi Chemicals Corp 静電荷像現像用キャリア

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030218221A1 (en) * 2002-05-21 2003-11-27 the State of Oregon acting by and through the behalf of Oregon State University Transistor structures and methods for making the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
p-channel thin-film transistor using p-type oxide semiconductor,SnO;Yoichi Ogo,et al;《Applied Physics Letters》;20080725;第93卷(第3期);032113-1-032113-3 *

Also Published As

Publication number Publication date
JP2010212285A (ja) 2010-09-24
WO2010100885A1 (en) 2010-09-10
US20110309356A1 (en) 2011-12-22
JP5506213B2 (ja) 2014-05-28
US8389996B2 (en) 2013-03-05
CN102341912A (zh) 2012-02-01

Similar Documents

Publication Publication Date Title
CN102341912B (zh) 半导体膜的形成方法、半导体器件的形成方法和半导体器件
KR101540127B1 (ko) 박막 트랜지스터, 다결정 산화물 반도체 박막의 제조 방법, 및 박막 트랜지스터의 제조 방법
JP4609797B2 (ja) 薄膜デバイス及びその製造方法
US8021916B2 (en) Method for manufacturing semiconductor device
US20080277663A1 (en) Thin film transistor and method of manufacturing the same
TWI570808B (zh) 濺鍍靶及半導體裝置製造方法
KR101552975B1 (ko) 산화물 반도체 및 이를 포함하는 박막 트랜지스터
JP2012069935A (ja) 半導体装置およびその作製方法
JPWO2010047077A1 (ja) 薄膜トランジスタ及びその製造方法
JP2007073699A (ja) 酸化物半導体デバイスの製造方法
TW201218382A (en) Semiconductor device, power diode, and rectifier
JP2009295997A (ja) 薄膜デバイス及びその製造方法
JP2000223419A (ja) 単結晶シリコン層の形成方法及び半導体装置の製造方法、並びに半導体装置
JP2011029238A (ja) 結晶性ホモロガス化合物層を含む積層体の製造方法及び電界効果型トランジスタ
JP2001244464A (ja) 金属酸化物トランジスタの製造方法
CN115210850A (zh) 碲氧化物和包括作为沟道层的碲氧化物的薄膜晶体管
KR101132989B1 (ko) 박막 트랜지스터의 제조 방법 및 전기 광학 장치의 제조 방법
JPH10247723A (ja) 半導体装置のキャパシタの製造方法
JP2014107303A (ja) 酸化物半導体薄膜および薄膜トランジスタ
CN105552128A (zh) 半导体器件和制造半导体器件的方法
JP6036984B2 (ja) 酸窒化物半導体薄膜
CN116504642A (zh) 一种有源层制造方法以及半导体器件
CN110660865A (zh) 一种可靠的双极性SnO薄膜晶体管及其制备方法
JP5612299B2 (ja) トランジスタの作製方法
JP4091025B2 (ja) ポリシリコン層形成方法及びこれを用いた薄膜トランジスタの製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant