CN102301840B - 自动锡焊装置及输送装置 - Google Patents

自动锡焊装置及输送装置 Download PDF

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Publication number
CN102301840B
CN102301840B CN2010800057137A CN201080005713A CN102301840B CN 102301840 B CN102301840 B CN 102301840B CN 2010800057137 A CN2010800057137 A CN 2010800057137A CN 201080005713 A CN201080005713 A CN 201080005713A CN 102301840 B CN102301840 B CN 102301840B
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CN
China
Prior art keywords
mentioned
framework
frame
heat treatment
conveying
Prior art date
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CN2010800057137A
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English (en)
Chinese (zh)
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CN102301840A (zh
Inventor
杉原崇史
薄叶隆
市川广一
六辻利彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
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Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of CN102301840A publication Critical patent/CN102301840A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G37/00—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes
    • B65G37/005—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes comprising two or more co-operating conveying elements with parallel longitudinal axes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
CN2010800057137A 2009-01-27 2010-01-26 自动锡焊装置及输送装置 Active CN102301840B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009015868A JP5218097B2 (ja) 2009-01-27 2009-01-27 自動はんだ付け装置及び搬送装置
JP2009-015868 2009-01-27
PCT/JP2010/050982 WO2010087342A1 (ja) 2009-01-27 2010-01-26 自動はんだ付け装置及び搬送装置

Publications (2)

Publication Number Publication Date
CN102301840A CN102301840A (zh) 2011-12-28
CN102301840B true CN102301840B (zh) 2013-07-31

Family

ID=42395603

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800057137A Active CN102301840B (zh) 2009-01-27 2010-01-26 自动锡焊装置及输送装置

Country Status (6)

Country Link
US (1) US8186563B2 (enExample)
EP (1) EP2384104B1 (enExample)
JP (1) JP5218097B2 (enExample)
CN (1) CN102301840B (enExample)
HU (1) HUE047287T2 (enExample)
WO (1) WO2010087342A1 (enExample)

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KR102034820B1 (ko) * 2012-11-30 2019-11-08 삼성전자주식회사 반도체 칩 실장장치 및 이를 이용한 반도체 칩의 실장방법
CN103863861B (zh) * 2014-03-06 2017-03-01 深圳市劲拓自动化设备股份有限公司 滚动式支承结构和传输装置
EP3127150A4 (en) * 2014-03-29 2017-12-20 Intel Corporation Integrated circuit chip attachment using local heat source
JP6502615B2 (ja) * 2014-04-11 2019-04-17 株式会社タムラ製作所 搬送加熱装置
JP5878219B1 (ja) * 2014-10-09 2016-03-08 千住金属工業株式会社 はんだ付け装置
JP6269793B1 (ja) 2016-12-05 2018-01-31 千住金属工業株式会社 搬送装置
IT201900008835A1 (it) * 2019-06-13 2020-12-13 Regina Catene Calibrate Spa Tampone gommato, in particolare per catene per linee di movimentazione/sollevamento di prodotti.

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Also Published As

Publication number Publication date
EP2384104B1 (en) 2019-11-27
JP2010177288A (ja) 2010-08-12
HUE047287T2 (hu) 2020-04-28
EP2384104A1 (en) 2011-11-02
CN102301840A (zh) 2011-12-28
EP2384104A4 (en) 2017-06-14
US20110278348A1 (en) 2011-11-17
JP5218097B2 (ja) 2013-06-26
US8186563B2 (en) 2012-05-29
WO2010087342A1 (ja) 2010-08-05

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