CN102291933A - 布线基板及其制造方法 - Google Patents

布线基板及其制造方法 Download PDF

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Publication number
CN102291933A
CN102291933A CN201110162222XA CN201110162222A CN102291933A CN 102291933 A CN102291933 A CN 102291933A CN 201110162222X A CN201110162222X A CN 201110162222XA CN 201110162222 A CN201110162222 A CN 201110162222A CN 102291933 A CN102291933 A CN 102291933A
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CN
China
Prior art keywords
layer
connection
connection pads
insulating layer
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201110162222XA
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English (en)
Chinese (zh)
Inventor
近藤人资
下平朋幸
佐藤雅子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
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Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of CN102291933A publication Critical patent/CN102291933A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201110162222XA 2010-06-18 2011-06-16 布线基板及其制造方法 Pending CN102291933A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-138906 2010-06-18
JP2010138906A JP5566200B2 (ja) 2010-06-18 2010-06-18 配線基板及びその製造方法

Publications (1)

Publication Number Publication Date
CN102291933A true CN102291933A (zh) 2011-12-21

Family

ID=45327672

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110162222XA Pending CN102291933A (zh) 2010-06-18 2011-06-16 布线基板及其制造方法

Country Status (3)

Country Link
US (1) US8669478B2 (https=)
JP (1) JP5566200B2 (https=)
CN (1) CN102291933A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102833963A (zh) * 2012-09-03 2012-12-19 高德（无锡）电子有限公司 一种改善盲钻孔在电镀软金时孔底露铜的水平前处理方法
CN103928412A (zh) * 2013-01-15 2014-07-16 富士通半导体股份有限公司 半导体装置及制造该半导体装置的方法
CN105374784A (zh) * 2014-08-19 2016-03-02 英特尔公司 用于无芯封装和具有嵌入式互连桥的封装的双面阻焊层及其制造方法
CN110691487A (zh) * 2019-09-12 2020-01-14 无锡江南计算技术研究所 一种面向高密度组装的大功率供电背板
CN112740476A (zh) * 2018-09-18 2021-04-30 日本特殊陶业株式会社 波导管

Families Citing this family (24)

* Cited by examiner, † Cited by third party
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US8569167B2 (en) * 2011-03-29 2013-10-29 Micron Technology, Inc. Methods for forming a semiconductor structure
US8952540B2 (en) * 2011-06-30 2015-02-10 Intel Corporation In situ-built pin-grid arrays for coreless substrates, and methods of making same
US20130192879A1 (en) * 2011-09-22 2013-08-01 Ibiden Co., Ltd. Multilayer printed wiring board
US20130168132A1 (en) * 2011-12-29 2013-07-04 Sumsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same
KR101859483B1 (ko) * 2012-03-06 2018-06-27 엘지디스플레이 주식회사 입체 영상 표시 장치 및 그 제조 방법
JP5502139B2 (ja) * 2012-05-16 2014-05-28 日本特殊陶業株式会社 配線基板
US9686854B2 (en) * 2012-09-25 2017-06-20 Denso Corporation Electronic device
JP6105316B2 (ja) * 2013-02-19 2017-03-29 京セラ株式会社 電子装置
JP6418757B2 (ja) * 2014-03-03 2018-11-07 新光電気工業株式会社 配線基板及びその製造方法と半導体装置
JP2016076534A (ja) * 2014-10-03 2016-05-12 イビデン株式会社 金属ポスト付きプリント配線板およびその製造方法
TWI559829B (zh) * 2014-10-22 2016-11-21 矽品精密工業股份有限公司 封裝結構及其製法
JP6453625B2 (ja) * 2014-11-27 2019-01-16 新光電気工業株式会社 配線基板及びその製造方法と電子部品装置
JP6812678B2 (ja) * 2016-06-29 2021-01-13 昭和電工マテリアルズ株式会社 配線板の製造方法
US10446515B2 (en) * 2017-03-06 2019-10-15 Advanced Semiconductor Engineering, Inc. Semiconductor substrate and semiconductor packaging device, and method for forming the same
US11309294B2 (en) * 2018-09-05 2022-04-19 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated fan-out packages and methods of forming the same
KR20200055432A (ko) * 2018-11-13 2020-05-21 삼성전기주식회사 인쇄회로기판
KR102680005B1 (ko) * 2018-11-27 2024-07-02 삼성전기주식회사 인쇄회로기판
KR102724892B1 (ko) * 2018-12-04 2024-11-01 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US11862594B2 (en) * 2019-12-18 2024-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure with solder resist underlayer for warpage control and method of manufacturing the same
CN113207244B (zh) * 2020-02-03 2024-12-10 奥特斯奥地利科技与系统技术有限公司 制造部件承载件的方法及部件承载件
US12342677B2 (en) * 2021-09-06 2025-06-24 Samsung Display Co., Ltd. Display device and method for fabricating electronic device by using the same
KR102561794B1 (ko) * 2022-01-12 2023-08-01 주식회사 코리아써키트 인쇄회로기판 및 이의 제조 방법
TW202335542A (zh) * 2022-01-12 2023-09-01 南韓商韓國電路股份有限公司 印刷電路板及其製造方法
JP2024017824A (ja) * 2022-07-28 2024-02-08 Ｆｉｃｔ株式会社 多層基板及び多層基板の製造方法

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JP3633252B2 (ja) * 1997-01-10 2005-03-30 イビデン株式会社 プリント配線板及びその製造方法
JP3346263B2 (ja) * 1997-04-11 2002-11-18 イビデン株式会社 プリント配線板及びその製造方法
JP2002171050A (ja) 1997-04-11 2002-06-14 Ibiden Co Ltd プリント配線板
JP2000022337A (ja) * 1998-06-30 2000-01-21 Matsushita Electric Works Ltd 多層配線板及びその製造方法
JP2001094260A (ja) * 1999-09-24 2001-04-06 Toshiba Chem Corp 多層プリント配線板の製造方法
JP2002290022A (ja) * 2001-03-27 2002-10-04 Kyocera Corp 配線基板およびその製造方法ならびに電子装置
JP2006093438A (ja) * 2004-09-24 2006-04-06 Denso Corp プリント基板及びその製造方法
US8062750B2 (en) * 2004-11-30 2011-11-22 Matsushita Electric Works, Ltd. Epoxy resin composition for prepreg, prepreg and multilayered printed wiring board
US7838779B2 (en) * 2005-06-17 2010-11-23 Nec Corporation Wiring board, method for manufacturing same, and semiconductor package
JP2008140886A (ja) * 2006-11-30 2008-06-19 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
JP4994922B2 (ja) 2007-04-06 2012-08-08 太陽ホールディングス株式会社 ソルダーレジスト組成物およびその硬化物
US8502398B2 (en) * 2007-10-05 2013-08-06 Shinko Electric Industries Co., Ltd. Wiring board, semiconductor apparatus and method of manufacturing them
JP2009200356A (ja) * 2008-02-22 2009-09-03 Tdk Corp プリント配線板及びその製造方法
WO2010010910A1 (ja) * 2008-07-23 2010-01-28 日本電気株式会社 コアレス配線基板、半導体装置及びそれらの製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102833963A (zh) * 2012-09-03 2012-12-19 高德（无锡）电子有限公司 一种改善盲钻孔在电镀软金时孔底露铜的水平前处理方法
CN102833963B (zh) * 2012-09-03 2015-04-01 高德（无锡）电子有限公司 一种改善盲钻孔工件在电镀软金时孔底露铜的水平前处理方法
CN103928412A (zh) * 2013-01-15 2014-07-16 富士通半导体股份有限公司 半导体装置及制造该半导体装置的方法
CN105374784A (zh) * 2014-08-19 2016-03-02 英特尔公司 用于无芯封装和具有嵌入式互连桥的封装的双面阻焊层及其制造方法
US10629469B2 (en) 2014-08-19 2020-04-21 Intel Corporation Solder resist layers for coreless packages and methods of fabrication
US11443970B2 (en) 2014-08-19 2022-09-13 Intel Corporation Methods of forming a package substrate
CN112740476A (zh) * 2018-09-18 2021-04-30 日本特殊陶业株式会社 波导管
CN110691487A (zh) * 2019-09-12 2020-01-14 无锡江南计算技术研究所 一种面向高密度组装的大功率供电背板
CN110691487B (zh) * 2019-09-12 2021-06-22 无锡江南计算技术研究所 一种面向高密度组装的大功率供电背板

Also Published As

Publication number Publication date
JP2012004399A (ja) 2012-01-05
US20110308849A1 (en) 2011-12-22
JP5566200B2 (ja) 2014-08-06
US8669478B2 (en) 2014-03-11

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Application publication date: 20111221