CN102237342B - 一种无线通讯模块产品 - Google Patents
一种无线通讯模块产品 Download PDFInfo
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Abstract
本发明公开了一种无线通讯模块产品,减小无线通讯模块的体积。所述无线通讯模块产品包括:采用晶片封装工艺封装的功能晶片(die)、采用芯片封装工艺封装的功能芯片以及基板(PCB),所述功能晶片和功能芯片通过所述基板相连;其中,所述基板包含第一表面和第二表面;其中,所述功能晶片和功能芯片分别独立封装在所述基板的不同表面;或者,所述功能晶片和功能芯片独立封装在所述基板的同一表面;或者,所述功能晶片和功能芯片层叠封装在所述基板的同一表面。
Description
技术领域
本发明涉及电子领域,尤其涉及一种无线通讯模块产品。
背景技术
随着消费类电子和无线网络的不断发展与升级,无线通讯模块越来越受到人们的关注,与此同时,随着移动通讯技术的飞速发展,消费类产品对无线通讯模块的要求也越来越高,很多新兴的产品形式需要体积更小,厚度更薄的无线通讯模块。
目前,市面上的无线通讯模块形式多种多样,尺寸基本都比较大,厚度也较大,在消费类电子中,有时候很难满足超薄超小型的设计要求。按照封装的不同形式,主要分为以下几种:
日本WILLCOM运营商的推出的可用于PHS的W-SIM通用模块,同时也可应用于笔记本电脑使用的移动电话或掌上电脑。这种封装形式的模块尺寸为25.6(W)×42(L)×4(H)mm,接口统一,支持热插拔,同时内部集成天线等优点,但散热问题不易解决,同时由于天线影响,给结构上带来限制,且尺寸太大和厚度都较大。
邮票孔封装的模块,这种封装形式使用较为广泛。模块引脚类似于齿状突出于模块边缘,对应主板焊盘为矩形。此类型封装,技术较为成熟,工艺较为简单,同时对于模块的焊接状况易于检修。但是,这种封装方式由于其自身的特点,所以容易造成孔内铜丝和孔切偏、孔切破后残留铜丝,从而导致焊接性能下降;且采用的是比较普通的PCB工艺,尺寸和厚度难以降低。
PCIE封装形式,外部设备部件接口(PeripheralComponentInterconnection,简称为PCIE)组织定义了PCIExpressMiniCard协议标准,任何符合该协议的模块都可以插在符合该协议的插槽中。目前,该技术已经广泛应用在个人电脑上。基于PCIE的MiniPCIE这种封装形式接口统一,即插即用,成本较低,更换容易。但PCIExpressMiniCard协议规定了模块尺寸大小及管脚定义,模块尺寸大小为:全尺寸50.95mm(L)×30mm(W)×5mm(H),半尺寸26.80mm(L)×30mm(W)×5mm(H),因此,即使是半尺寸的PCIE封装模块尺寸较大,不易使用在一些对尺寸大小及厚度要求比较严格的场合。
B2B模块,在模块和主板上分别焊接有配套的连接器,模块可通过连接器直接插在主板上。采用B2B连接器的形式,可靠性高,更换容易。但是,一般情况下由于连接器的尺寸一般都比较大、高度比较高,这种模块的尺寸也较大、高度比较高。
可见,现有的封装技术都会导致封装后的无线通讯模块尺寸和厚度较大。
发明内容
本发明要解决的技术问题是提供一种无线通讯模块产品,减小无线通讯模块的体积。
为解决上述技术问题,本发明提供了一种无线通讯模块产品,包括:采用晶片封装工艺封装的功能晶片(die)、采用芯片封装工艺封装的功能芯片以及基板(PCB),所述功能晶片和功能芯片通过所述基板相连;
其中,所述基板包含第一表面和第二表面;
其中,所述功能晶片和功能芯片分别独立封装在所述基板的不同表面;或者,所述功能晶片和功能芯片独立封装在所述基板的同一表面;或者,所述功能晶片和功能芯片层叠封装在所述基板的同一表面。
进一步地,当所述功能晶片和功能芯片分别独立封装在所述基板的不同表面时,封装有所述功能晶片的所述基板的第一表面或第二表面焊接有焊球或焊盘。
进一步地,所述焊球包括接地焊球及作为所述无线通讯模块产品功能引脚的焊球。
进一步地,所述焊球作为以下一种或几种功能引脚:通用串行总线(USB)接口引脚、语音输入接口引脚、语音输出接口引脚、通用异步接收发送(UART)接口引脚、JTAG(联合测试行为组织定义的)接口引脚、主天线引脚、分集天线引脚、供电引脚、通用输入输出(GPIO)接口引脚、接地引脚、客户识别模块(SIM卡)接口、安全数字卡(SD)接口、I2C接口和串行外围接口(SPI)引脚。
进一步地,所述功能晶片独立封装在所述基板上时,所述功能晶片与所述基板通过倒装芯片或者金线连接。
进一步地,所述功能晶片和功能芯片层叠封装在所述基板的同一表面时,所述功能芯片封装在所述基板的第一表面或第二表面,所述功能晶片封装在所述功能芯片上。
进一步地,所述功能晶片封装在所述功能芯片上时,所述功能晶片与所述功能芯片通过倒装芯片或者金线连接。
进一步地,所述基板的第一表面焊接有射频连接器,和/或,所述基板的第二表面焊接有射频焊件,所述射频焊件包括焊球或焊盘。
进一步地,所述基板的第一表面焊接有射频连接器,且所述基板的第二表面焊接有射频焊件时,所述射频焊件置于所述第二表面上与所述第一表面的射频连接器的射频走线最短的位置。
进一步地,所述基板的第一表面和/或第二表面焊接有屏蔽器件。
进一步地,所述屏蔽器件包括屏蔽架和屏蔽罩,所述基板的第一表面和/或第二表面焊接有屏蔽架,所述屏蔽架外卡接有屏蔽罩,所述屏蔽架与屏蔽罩组合形成密闭腔体;或者,所述屏蔽器件包括屏蔽罩,所述基板的第一表面和/或第二表面焊接有屏蔽罩,所述屏蔽罩与基板组合形成密闭腔体。
进一步地,所述功能晶片和功能芯片分别独立封装在所述基板的不同表面时,在所述基板的封装有所述功能晶片的第一表面或第二表面上,焊接有直径大于所述功能晶片厚度的焊球,所述焊球分布于所述功能晶片的周围,所述焊球中包括接地焊球,所述无线通讯模块产品通过所述接地焊球焊接在用户主板上,所述用户主板上与所述功能晶片对应的位置铺铜,所述用户主板、所述接地焊球与所述基板组合形成所述功能晶片的屏蔽腔。
进一步地,所述功能芯片包括以下芯片中的一种或几种:基带芯片、射频芯片、功率放大器芯片、电源管理芯片、音频编解码芯片、存储器芯片、时钟晶振、时钟晶体。
进一步地,所述功能晶片包括以下晶片中的一种或几种:存储器晶片、基带晶片、射频晶片、功率放大器晶片、电源管理晶片、音频编解码晶片。
进一步地,所述基板上还焊接有被动器件,所述被动器件包括以下器件中的一种或几种:电阻、电容、电感。
本发明通过将功能晶片代替芯片封装在PCB板上作为无线通讯模块产品,可以有效减小整个无线通讯模块产品的厚度或尺寸,从而达到缩小无线通讯模块体积的目的。当双面布局时,即功能晶片和功能芯片分别独立封装在所述基板的不同表面时,更为有效地减小整个模块产品的尺寸和厚度,实现了超小型化的通讯模块。另外,由于将能达到统一功能的芯片和晶片模块化,使得在手机或其他通讯产品的生产制造过程中省去了对该类功能模块的考虑,缩短了开发和生产周期,同时小型的体积也方便系统方案设计。此外,还可以在该无线通讯模块产品上集成射频连接器,以方便应用。
本发明无线通讯模块产品可以应用在手机、MID(MobileInernetDevice,移动互联网设备),电子书,视频监控,PMP(portablemediaplayer,可携式媒体播放器),导航仪,汽车电子等具有通讯功能的电子设备中。
附图说明
图1是模块整理架构图;
图2是模块底面视图;
图3a是晶片封装于PCB顶面的示意图;
图3b是晶片封装于芯片顶面的示意图;
图4a是晶片封装于基板底面位置时,基板焊接在用户主板上的示意图;
图4b是晶片封装在基板底面时,基板的仰视图;
图5a是射频连接器封装于基板上的剖视图;
图5b是射频连接器封装于基板上时的俯视图;
图6a是基板上直接安装屏蔽罩的剖视图;
图6b是基板上直接安装屏蔽罩的俯视图;
图6c安装有射频连接器的基板上安装屏蔽罩的俯视图;
图7a是采用屏蔽罩结合屏蔽架的屏蔽方式的立体分解图;
图7b安装有射频连接器的基板上安装屏蔽和屏蔽架的示意图;
图7c是采用屏蔽罩结合屏蔽架的屏蔽方式的剖视图。
具体实施方式
本发明所述模块产品包括功能晶片(die)、功能芯片以及基板(PCB,PrintedCircuitBoard,印刷电路板),所述功能晶片和功能芯片通过基板相连;其中,所述基板包含第一表面和第二表面;其中,所述功能晶片和功能芯片分别独立封装在所述基板的不同表面;或者,所述功能晶片和功能芯片独立封装在所述基板的同一表面;或者,所述功能晶片和功能芯片层叠封装在所述基板的同一表面。其中,所述功能晶片采用晶片的封装工艺封装(例如塑封胶(molding)方式进行封装),所述功能芯片采用芯片的封装工艺封装。
所述基板可以采用LTCC基板或者FR4基板或者BT基板或者其他介质的基板实现。
当所述功能晶片和功能芯片分别独立封装在所述基板的不同表面时,封装有所述功能晶片的所述基板的第一表面或第二表面焊接有焊球或焊盘。
上述焊球包括接地焊球及作为所述无线通讯模块产品功能引脚的焊球(即所述模块采用焊球的封装形式引出信号线)。所述焊球作为以下一种或几种功能引脚:通用串行总线(USB)接口引脚、语音输入接口引脚、语音输出接口引脚、通用异步接收发送(UART)接口引脚、JTAG(联合测试行为组织定义的)接口引脚、主天线引脚、分集天线引脚、供电引脚、通用输入输出(GPIO)接口引脚、接地引脚、客户识别模块(SIM卡)接口、安全数字卡(SD)接口、I2C接口和串行外围接口(SPI)引脚。不排除作为其他功能引脚的可能。这些功能引脚提供了常用的丰富的通讯接口,同时上述接地焊球还可以提高模块的散热性能。
所述功能晶片和功能芯片层叠封装在所述基板的同一表面时,所述功能芯片封装在所述基板的第一表面或第二表面,所述功能晶片封装在所述功能芯片上。
所述功能晶片独立封装在所述基板上时,或者,所述功能晶片封装在所述功能芯片上时,所述功能晶片与所述基板通过倒装芯片(flip-chip)或者金线连接(wirebonding)。
所述基板的第一表面焊接有射频连接器,和/或,所述基板的第二表面焊接有射频焊件,所述射频焊件包括焊球或焊盘。所述基板的第一表面焊接有射频连接器,且所述基板的第二表面焊接有射频焊件时,所述射频焊件置于所述第二表面上与所述第一表面的射频连接器的射频走线最短的位置。
所述基板的第一表面和/或第二表面焊接有屏蔽器件,其中:所述屏蔽器件包括屏蔽架和屏蔽罩,所述基板的第一表面和/或第二表面焊接有屏蔽架,屏蔽架外卡接有屏蔽罩,所述屏蔽架与屏蔽罩组合形成密闭腔体;或者,所述屏蔽器件包括屏蔽罩,所述基板的第一表面和/或第二表面焊接有屏蔽罩,所述屏蔽罩与基板组合形成密闭腔体。该屏蔽器件可以避免电磁干扰。
屏蔽器件可以屏蔽整体模块和外界之间的干扰,起到保护所述模块产品的作用。
所述功能晶片和功能芯片分别独立封装在所述基板的不同表面时,在所述基板的封装有所述功能晶片的第一表面或第二表面上,焊接有直径大于所述功能晶片厚度的焊球,所述焊球分布于所述功能晶片的周围,所述焊球中包括接地焊球,所述无线通讯模块产品通过所述接地焊球焊接在用户主板上,所述用户主板上与所述功能晶片对应的位置铺铜。
优选地,所述功能芯片包括以下芯片中的一种或几种:基带芯片、射频芯片、功率放大器(PA,PowerAmplifier)芯片、电源管理芯片、音频编解码芯片、存储器芯片、时钟晶振和时钟晶体。
优选地,所述功能晶片包括以下晶片中的一种或几种:存储器晶片、基带晶片、射频晶片、功率放大器晶片、电源管理晶片、音频编解码晶片。
优选地,在不影响所述模块产品整体体积的情况下,所述基板上还可焊接一些被动器件。所述被动器件包括以下器件中的一种或几种电阻、电容和电感。
下面通过以下实施例及附图对本通讯模块进行详细说明。在下述实施例中,用顶面和地面的描述方式代替第一表面和第二表面的描述方式。
图1为模块纵向剖面图,如图1所示,本通讯模块的顶面分布有基带和射频芯片组,所述基带和射频芯片组采用常规的封装方法与基板焊接,例如可以是BGA(BallGridArray,球栅阵列)封装、LGA(LandGridArray,栅格阵列)封装或者QFN(QuadFlatNo-lead,方形扁平无引脚)封装等方式。如图所示,基带芯片与射频芯片有各自的屏蔽腔体。本实施例中的PCB基板是BT介质。模块底面圆形图示为本通讯模块的焊球,焊球分布在晶片的四周,也可以分布在晶片的一侧或两侧。在其他实施例中,晶片的周围也可以分布为焊盘。
分布在晶片周围的焊球为功能引脚焊盘,即作为该模块产品的功能引脚,可作为以下功能引脚中的一种或几种:通用串行总线(USB)接口引脚、语音输入接口引脚、语音输出接口引脚、通用异步接收发送(UART)接口引脚、JTAG(联合测试行为组织定义的)接口引脚、主天线引脚、分集天线引脚、供电引脚、通用输入输出(GPIO)接口引脚、接地引脚、客户识别模块(SIM卡)接口、安全数字卡(SD)接口、I2C接口和串行外围接口(SPI)引脚等。
模块的底面,焊球之间是封装的是功能晶片,图示实施例中底面封装的晶片是存储器的晶片,包括Nandflash和DDRAM的晶片,采用金线(wire-bond)的连接方式,直接从晶片连到基板PCB,外面通过塑封胶塑封将晶片保护起来,由于晶片紧贴着PCB板,其塑封后整个高度比BGA的焊球要低一些。
另外,由于焊球的高度较高,还可以在塑封的晶片和焊球之间的空隙或者焊球与焊球之间的间隙焊接一些器件高度较矮、体积较小的被动器件,比如电阻、电容和电感中的一种或几种等,以提高空间的利用率,如图2所示。
在现有的电路设计中,如果是单面布局,通常需要在PCB板上贴一个flash芯片,而本实施例通过直接将flash的晶片封装在PCB底面,对于单面布局的PCB板,其不占用额外的空间,对于双面布局的PCB板,用晶片方式封装可以减少PCB板的厚度和面积,从而有效减小通讯模块的体积。
在本实施例中,采用芯片封装工艺的晶片只有NAND和DDRAM两种存储器晶片,事实上,也可以根据实际情况封装其它功能单元,例如射频收发器、双工器等。
除了将晶片置于PCB板的底面外,还可置于PCB板的顶面,如图3a所示,优选地,晶片可以置于芯片的顶面,如图3b所示。
为了优化散热,将发热较为严重的器件,如射频、功率放大器等封装于PCB板顶面,并且在这些高功率器件对应的PCB底面焊接可用于散热的接地焊球。
图4介绍了模块底面封装晶片的屏蔽方式。如图4a所示,由于晶片是在焊球和两块PCB之间的腔体内,因此可以通过PCB的设计来形成屏蔽。为了保证底面晶片的屏蔽效果,一般会在PCB板上,晶片封装区域的周围,焊接接地焊球,同时在晶片对应的用户主板PCB区域铺大量的地铜层,该用户主板与PCB板通过PCB板上的地焊球连接,所述用户主板、所述接地焊球与所述基板组合形成所述功能晶片的屏蔽腔,如图4a所示,焊球和用户主板上的铺铜形成一个类似于屏蔽架的形式,从而将该晶片包裹于屏蔽腔内。图4b是图4a中基板PCB的仰视图,从图中可以看出,在PCB板底面铺设的焊球中有大量的接地焊球,以保证晶片的散热效果。
本发明模块还可增加射频连接的功能,通过在基板上封装射频连接器和/或在基板上封装射频焊球来实现,如图5a所示,图中示出了两种射频接入方式,一种是模块PCB板的一角处焊接的射频连接器,另一种是模块PCB板底面焊接的射频焊球,或称天线引脚焊球,也可采用其他射频焊件,如焊盘。射频连接器和相对应的射频焊件可分别设在模块的任意位置,优选地,所述射频焊件置于所述第二表面上与所述第一表面的射频连接器的射频走线最短的位置,如射频连接器在PCB板上面的位置与天线引脚焊球在PCB板底面的位置相对应,所述相对应是指二者在模块的垂直线上处于一样或相近的位置。例如,图5b中,射频连接器封装于模块顶面的左上角,相对应的,模块天线引脚焊球的位置位于射频连接器的位置垂直映射在模块底面的位置或在其附近。
当基板PCB上的芯片容易受外界干扰时,可以在基板顶面设置屏蔽器件,如图6和图7所示,图6为直接采用屏蔽罩的屏蔽方式,其中,图6a为是基板上直接焊接屏蔽罩的剖视图,图6b为图6a的俯视图,图6c为焊接有射频连接器的模块安装屏蔽罩的俯视图。图7为屏蔽架加屏蔽罩的屏蔽方式。图7a为模块上焊接屏蔽架后的俯视图以及焊接屏蔽罩后的俯视图,图7b为焊接有射频连接器的模块上焊接屏蔽架后的俯视图以及焊接屏蔽罩后的俯视图,图7c为屏蔽罩结合屏蔽架的屏蔽方式的剖视图。
图7所示的屏蔽罩加屏蔽架的屏蔽方式是将屏蔽架直接焊接在模块PCB板的顶面(正面),然后再将屏蔽罩直接卡接在屏蔽架上,屏蔽架与屏蔽罩组合形成密闭腔体。此种方式的优点是,屏蔽架和屏蔽罩制作简单,去掉屏蔽罩后,可以直接对模块正面的元器件进行维修和检查,测试调试方便,但由于屏蔽架焊接在模块正面PCB板上后,还要将屏蔽罩扣在屏蔽架上,增加了模块整体的厚度。而图6所示的没有屏蔽架的屏蔽方式,屏蔽罩直接焊接在模块PCB板的顶面,在屏蔽罩与基板组合形成密闭腔体。优点是,模块正面元器件在屏蔽罩内部可采用塑胶等方式进行分腔,密闭性能及屏蔽性能较好,同时,因为采用直接焊接屏蔽罩的方式,减少了屏蔽架的尺寸高度,所以可以有效的减少模块的厚度。但由于是采用直接焊接的方式,所以不易维修、测试。
当然,本发明还可有其他多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。
Claims (14)
1.一种无线通讯模块产品,其特征在于,
所述无线通讯模块产品包括:采用晶片封装工艺封装的功能晶片、采用芯片封装工艺封装的功能芯片以及基板,所述功能晶片和功能芯片通过所述基板相连;
其中,所述基板包含第一表面和第二表面;
其中,所述功能晶片和功能芯片分别独立封装在所述基板的不同表面,在所述基板的封装有所述功能晶片的第一表面或第二表面上,焊接有直径大于所述功能晶片厚度的焊球,所述焊球分布于所述功能晶片的周围,所述焊球中包括接地焊球,所述无线通讯模块产品通过所述接地焊球焊接在用户主板上,所述用户主板上与所述功能晶片对应的位置铺铜,所述用户主板、所述接地焊球与所述基板组合形成所述功能晶片的屏蔽腔。
2.如权利要求1所述的无线通讯模块产品,其特征在于,
所述焊球作为以下一种或几种功能引脚:
通用串行总线(USB)接口引脚、语音输入接口引脚、语音输出接口引脚、通用异步接收发送传输器(UART)接口引脚、JTAG(联合测试行为组织)接口引脚、主天线引脚、分集天线引脚、供电引脚、通用输入输出(GPIO)接口引脚、接地引脚、客户识别模块(SIM)接口、安全数字(SD)接口、I2C接口和串行外围接口(SPI)引脚。
3.如权利要求1或2所述的无线通讯模块产品,其特征在于,
所述功能晶片独立封装在所述基板上时,所述功能晶片与所述基板通过倒装芯片或者金线连接。
4.如权利要求1所述的无线通讯模块产品,其特征在于,
所述功能晶片和功能芯片层叠封装在所述基板的同一表面时,所述功能芯片封装在所述基板的第一表面或第二表面,所述功能晶片封装在所述功能芯片上。
5.如权利要求4所述的无线通讯模块产品,其特征在于,
所述功能晶片封装在所述功能芯片上时,所述功能晶片与所述功能芯片通过倒装芯片或者金线连接。
6.如权利要求3所述的无线通讯模块产品,其特征在于,
所述基板的第一表面焊接有射频连接器,和/或,所述基板的第二表面焊接有射频焊件,所述射频焊件包括焊球或焊盘。
7.如权利要求1或2或4所述的无线通讯模块产品,其特征在于,
所述基板的第一表面焊接有射频连接器,和/或,所述基板的第二表面焊接有射频焊件,所述射频焊件包括焊球或焊盘。
8.如权利要求6所述的无线通讯模块产品,其特征在于,
所述基板的第一表面焊接有射频连接器,且所述基板的第二表面焊接有射频焊件时,所述射频焊件置于所述第二表面上与所述第一表面的射频连接器的射频走线最短的位置。
9.如权利要求7所述的无线通讯模块产品,其特征在于,
所述基板的第一表面焊接有射频连接器,且所述基板的第二表面焊接有射频焊件时,所述射频焊件置于所述第二表面上与所述第一表面的射频连接器的射频走线最短的位置。
10.如权利要求1或2或4或5所述的无线通讯模块产品,其特征在于,
所述基板的第一表面和/或第二表面焊接有屏蔽器件。
11.如权利要求10所述的无线通讯模块产品,其特征在于,
所述屏蔽器件包括屏蔽架和屏蔽罩,所述基板的第一表面和/或第二表面焊接有屏蔽架,所述屏蔽架外卡接有屏蔽罩,所述屏蔽架与屏蔽罩组合形成密闭腔体;或者,
所述屏蔽器件包括屏蔽罩,所述基板的第一表面和/或第二表面焊接有屏蔽罩,所述屏蔽罩与基板组合形成密闭腔体。
12.如权利要求1或2或4或5所述的无线通讯模块产品,其特征在于,
所述功能芯片包括以下芯片中的一种或几种:基带芯片、射频芯片、功率放大器芯片、电源管理芯片、音频编解码芯片、存储器芯片、时钟晶振、时钟晶体。
13.如权利要求1或2或4或5所述的无线通讯模块产品,其特征在于,
所述功能晶片包括以下晶片中的一种或几种:存储器晶片、基带晶片、射频晶片、功率放大器晶片、电源管理晶片、音频编解码晶片。
14.如权利要求1或2或4或5所述的无线通讯模块产品,其特征在于,
所述基板上还焊接有被动器件,所述被动器件包括以下器件中的一种或几种:电阻、电容、电感。
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