CN102218487B - 导热座供多热管密合排列之组配方法及其结构 - Google Patents

导热座供多热管密合排列之组配方法及其结构 Download PDF

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CN102218487B
CN102218487B CN201110052053.4A CN201110052053A CN102218487B CN 102218487 B CN102218487 B CN 102218487B CN 201110052053 A CN201110052053 A CN 201110052053A CN 102218487 B CN102218487 B CN 102218487B
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heat
conducting seat
groove
heat pipe
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CN102218487A (zh
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黄崇贤
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Dongguan Hanxu Hardware Plastic Technology Co Ltd
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Priority to CN201110052053.4A priority Critical patent/CN102218487B/zh
Priority to US13/178,489 priority patent/US8806748B2/en
Priority to DE202011050768U priority patent/DE202011050768U1/de
Priority to KR1020110076065A priority patent/KR101247391B1/ko
Priority to DE102011052710.9A priority patent/DE102011052710B4/de
Priority to JP2011192691A priority patent/JP6240372B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/007—Auxiliary supports for elements
    • F28F9/013—Auxiliary supports for elements for tubes or tube-assemblies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49364—Tube joined to flat sheet longitudinally, i.e., tube sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49377—Tube with heat transfer means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/4984—Retaining clearance for motion between assembled parts
    • Y10T29/49845—Retaining clearance for motion between assembled parts by deforming interlock
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49945—Assembling or joining by driven force fit

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Steam Or Hot-Water Central Heating Systems (AREA)

Abstract

本发明涉及一种导热座供多热管密合排列之组配方法及其结构，其步骤系先提供一导热座、以及复数热管，且导热座具有复数供热管挤入之沟槽，接着将各热管分别挤入各沟槽内，再于热管分别挤入各沟槽内的过程中，使各热管朝向彼此间变形而相抵接，以令各热管间因彼此相抵接而密合。如此可消除各热管间的间距而能密合接触，以增加热管彼此间的热传效果。

Description

导热座供多热管密合排列之组配方法及其结构
技术领域
本发明系与一种热传技术有关，尤指一种导热座供多热管密合排列之组配方法及其结构。
背景技术
按，利用热管（Heatpipe）与导热座结合，以增加导热座之热传效率者，已为现今散热器上常见的技术手段或结构之一。而以往欲将多热管结合于导热座上时，往往碍于导热座上的各沟槽间在设置上留有间距，而造成所挤入的各热管间也必须维持各沟槽原有的间距；如此，将造成各热管无法更紧密地相靠拢排列，在设计上可能会因为间距的产生而减少热管所能设置的数量，同时各热管间的热传递效果亦不佳，因为位于较外侧的热管会因较远离热源而无法有效发挥其热传效果，且又与较内侧的热管存在有间距而不利于互相传热。
此外，以往欲将热管结合于导热座上时，通常会透过焊料以将热管固定于导热座的沟槽内、或是利用略呈椭圆的弧状沟槽使热管相接触的表面产生变形，进而防止热管结合于导热座的沟槽内时发生滑动等脱落问题。然而，若热管与导热座间未使用焊料等黏着剂作为固定时，热管与导热座间仍因相接触的表面呈弧状而容易产生滑动、甚至脱落等偏位问题，且当所欲结合的热管为复数时，各热管间也由于沟槽略呈椭圆而加大了彼此的间距，使得在多热管的应用场合下无法将各热管有效集中；而若是使用焊料等黏着剂作为固定时，则有焊料过少无法黏固、过多容易溢出而影响外观等困扰，且使用焊料也增加了材料与制造成本，殊不尽理想。
发明内容
本发明之主要目的，在于可提供一种导热座供多热管密合排列之组配方法及其结构，其系可供多热管组配于导热座上时，使各热管间不生间距而能密合接触，以增加彼此间的热传效果。
本发明之次要目的，在于可提供一种导热座供多热管密合排列之组配方法及其结构，其系可在无需使用焊料的情况下，使热管被挤入导热座之沟槽内后，即可被限位而不易产生偏位，且可适用在断面呈正弧形（即约略为二分之一半圆）之沟槽上，能在组配多热管时将各热管有效集中。
为了达成上述之目的，本发明系提供一种导热座供多热管密合排列之组配方法，包括下列步骤：
a)提供一导热座、以及复数热管，且该导热座具有复数供该等热管挤入之沟槽，而任二相邻所述沟槽间即形成一支撑肋，所述支撑肋末端形成一顶缘；
b)将各所述热管分别挤入各该沟槽内；以及
c)于上述将各所述热管分别挤入各该沟槽内的过程中，使各所述热管朝向彼此间变形而相抵接，以令各所述热管间因彼此相抵接而密合。
为了达成上述之目的，本发明系提供一种导热座供多热管密合排列之组配结构，包括一导热座、以及复数热管；其中，导热座具有一表面，并于其表面上凹设有复数沟槽，且各沟槽间系相紧邻而呈连续排列，并于任二相邻之所述沟槽间即形成有一支撑肋，且支撑肋末端形成有一顶缘；而各热管则分别紧迫于各沟槽内，各热管系顺着支撑肋之顶缘而形成一侧向突出的变形部，且任二相邻之热管的变形部乃相抵接而密合。
本发明优点在于供多热管组配于导热座上时，使各热管间不生间距而能密合接触，以增加彼此间的热传效果；再者可在无需使用焊料的情况下，使热管被挤入导热座之沟槽内后，即可被限位而不易产生偏位，且可适用在断面呈正弧形（即约略为二分之一半圆）之沟槽上，能在组配多热管时将各热管有效集中。
附图说明
图1是本发明组配方法之流程图。
图2是图1之步骤S1的示意图。
图3是图1之步骤S2的示意图。
图4是图1之步骤S3的示意图。
图5是本发明作为散热器之平面图。
图6是本发明作为散热器之立体图。
图7是本发明作为散热器另一实施例之立体图。
附图标号说明：
导热座　　1
底面　　10　　　　　沟槽　　100
支撑肋　101　　　　　顶缘　　102
凸肋　　103　　　　　限位肋　104
顶面　　11
热管　　　2
变形部　20　　　　　受热面　21
限位缺口22
散热片　3。
具体实施方式
下面结合附图与具体实施方式对本发明作进一步描述。
本发明系提供一种导热座供多热管密合排列之组配方法及其结构。请先参阅图1所示，系为本发明导热座供多热管密合排列之组配方法，其步骤如下：
如图1之步骤S1，并请配合参阅图2所示：首先，提供一导热座1、以及复数热管2；其中，该导热座1可为铜或铝等导热性良好之材质所制成，其系可作为如散热器用以贴附于热源上之基座，并至少具有一用以贴附于热源上的底面10；而在本发明所举之实施例中，该导热座1于底面10上设有供各热管2挤入的复数沟槽100，但所述沟槽100不以设于导热座1之底面10上为限，且各沟槽100的断面可略呈大于二分之一半圆的正弧形者。此外，所述沟槽100的数量系于该等热管2的数量相当，且所述沟槽100间系相紧邻而呈连续排列，并于任二相邻之所述沟槽100间即形成有一支撑肋101，所述支撑肋101末端形成一顶缘102，该顶缘102与导热座1之底面10相较系位于偏向沟槽100的内侧处（即顶缘102未与底面10平齐，且亦非突出于底面10）。
如图1之步骤S2，并请配合参阅图3所示：接着，将上述各热管2分别对应一所述沟槽100，以将该等热管2挤入所述沟槽100内。
如图1之步骤S3，并请配合参阅图4所示：此时，于上述将各热管2分别挤入各沟槽100内的过程中，由于挤入的动作会造成热管2的变形，故可透过如模具或其它外力的控制（图略），使各热管2在被挤入沟槽100内而变形的部位，可朝向彼此间的位置处作位移变形；以本发明所举之实施例为例，由于位在任二相邻之沟槽100间的支撑肋101，其顶缘102系位在偏向沟槽100的内侧处而低于导热座1之底面10，因此，当各热管2被挤入沟槽100内而产生变形时，热管2发生变形的部位即可顺着支撑肋101之顶缘102作变形，并形成一侧向突出的变形部20，以逐渐包覆于支撑肋101之顶缘102上，直至二相邻热管2之变形部20于此处相抵接（此时任二相邻热管2的变形部20即可共同包覆于支撑肋101之顶缘102上），俾可透过彼此相抵接的作用而密合，并使各热管2分别紧迫于其所对应的沟槽100内。
此外，再请一并参阅图2至图4所示，在上述步骤S1中，该导热座1之所述支撑肋101上，亦可朝向其所相对的任一沟槽100（或同时于二沟槽100）而突设一凸肋103，俾藉由凸肋103将热管2由沟槽100槽口向内抵顶，以有效地防止热管2由沟槽100内脱落。同时，各沟槽100内亦可进一步由其内表面上一体突出有至少一限位肋104，而于步骤S3将各热管2挤入相对应的沟槽100内时，热管2进入沟槽100内的部位表面处，系恰好与沟槽100内的限位肋104相对而抵顶，故限位肋104能咬入热管2相对应的表面处而形成一凹入的限位缺口22，进而使热管2与导热座1原本以弧状相接触的关系，因受限位肋104挤压于热管2相对应的表面，而使热管2与导热座1间不再是透过弧状的接触关系，藉以有效防止热管2于导热座1之沟槽12内发生偏位等松脱问题，且可供热管2在毋需使用焊料的情况下，亦能紧密地与导热座1相结合且彼此间直接接触（即彼此间不具有焊料）。
最后，如图3及图4所示，各热管2露出于沟槽100的部位则被挤压成一受热面21，并可令各热管2之受热面21、以及导热座1之底面10皆相平齐而形成共平面者，以便得与热源作接触。
据此，如图5及图6所示，透过上述之步骤流程，即可获得本发明导热座供多热管密合排列之组配结构，且该导热座1相对于其底面10的另一侧可进一步具有一顶面11；而在本发明所举之实施例中，该导热座1于其顶面11处可进一步增设复数散热片3，以构成一散热器者。此外，如第七图所示，系为本发明作为散热器另一实施例之立体图；其中，若热源表面较低于其外围电子组件时，即可令各热管2于受热面21上进一步突设一凸块23，且各热管2之所述凸块23为并列排置，如此即可以直接对应于位置较低的热源并作面与面之接触者。
以上所述，仅是本发明较佳实施例而已，并非对本发明的技术范围作任何限制，故凡是依据本发明的技术实质对以上实施例所作的任何细微修改、等同变化与修饰，均仍属于本发明技术方案的范围内。

Claims (13)

1.一种导热座供多热管密合排列之组配方法，包括下列步骤：
a)提供一导热座、以及复数热管，且该导热座具有复数供该复数热管挤入之沟槽，而任二相邻所述沟槽间即形成一支撑肋，所述支撑肋末端形成一顶缘；所述支撑肋上系朝向其所相对的任一所述沟槽或二所述沟槽而突设一凸肋；
b)将各所述热管分别挤入各该沟槽内；以及
c)于上述将各所述热管分别挤入各该沟槽内的过程中，藉由凸肋将热管由沟槽槽口向内抵顶，各所述热管发生变形的部位系顺着所述支撑肋之顶缘作变形，以逐渐包覆于所述支撑肋之顶缘上，使各所述热管朝向彼此间变形而相抵接，以令各所述热管间因彼此相抵接而密合。
2.如权利要求１所述之导热座供多热管密合排列之组配方法，其特征在于：其中步骤a)于各所述沟槽内系进一步由其内表面上一体突出有限位肋。
3.如权利要求１所述之导热座供多热管密合排列之组配方法，其特征在于：步骤c)系将各所述热管露出于所述沟槽的部位挤压成一受热面。
4.如权利要求3所述之导热座供多热管密合排列之组配方法，其特征在于：步骤c)系进一步令各所述热管之受热面相平齐而形成共平面者。
5.一种导热座供多热管密合排列之组配结构，包括：
一导热座，具有一表面，并于该表面上凹设有复数沟槽，且该复数沟槽间系相紧邻而呈连续排列，并于任二相邻之所述沟槽间即形成有一支撑肋，且所述支撑肋末端形成有一顶缘，所述支撑肋上系朝向其所相对的任一所述沟槽或二所述沟槽而突设一凸肋；以及
复数热管，分别紧迫于该复数沟槽内，由凸肋将热管由沟槽槽口向内抵顶，各该热管系顺着所述支撑肋之顶缘而形成一侧向突出的变形部，且任二相邻之所述热管的变形部乃相抵接而密合。
6.如权利要求5所述之导热座供多热管密合排列之组配结构，其特征在于：该导热座之表面系为其底面。
7.如权利要求6所述之导热座供多热管密合排列之组配结构，其特征于：该导热座相对于其底面的另一侧系具有一顶面，且该导热座于其顶面处设有复数散热片。
8.如权利要求5所述之导热座供多热管密合排列之组配结构，其特征在于：该导热座之沟槽的断面系呈大于半圆的正弧形者。
9.如权利要求5所述之导热座供多热管密合排列之组配结构，其特征在于：该导热座之支撑肋顶缘位于偏向所述沟槽的内侧处。
10.如权利要求5所述之导热座供多热管密合排列之组配结构，其特征在于：各所述沟槽内系进一步由其内表面上一体突出有限位肋。
11.如权利要求10所述之导热座供多热管密合排列之组配结构，其特征在于：所述限位肋系咬入各该热管相对应的表面处而形成凹入的限位缺口。
12.如权利要求5所述之导热座供多热管密合排列之组配结构，其特征在于：各该热管表露于所述沟槽的部位系形成一受热面。
13.如权利要求12所述之导热座供多热管密合排列之组配结构，其特征在于：各该热管于其受热面上系突设有并列排置之凸块。
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