CN102203927B - 一种器件塑封的方法及其封装结构 - Google Patents
一种器件塑封的方法及其封装结构 Download PDFInfo
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- CN102203927B CN102203927B CN2011800007541A CN201180000754A CN102203927B CN 102203927 B CN102203927 B CN 102203927B CN 2011800007541 A CN2011800007541 A CN 2011800007541A CN 201180000754 A CN201180000754 A CN 201180000754A CN 102203927 B CN102203927 B CN 102203927B
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- plastic packaging
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- 239000004033 plastic Substances 0.000 title claims abstract description 82
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 17
- 239000010703 silicon Substances 0.000 claims abstract description 17
- 239000003292 glue Substances 0.000 claims abstract description 16
- 238000005516 engineering process Methods 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 13
- 238000000465 moulding Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 230000001815 facial effect Effects 0.000 claims 1
- 238000012858 packaging process Methods 0.000 abstract 2
- 230000002950 deficient Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
- Y10T428/239—Complete cover or casing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2011/076087 WO2011150879A2 (zh) | 2011-06-22 | 2011-06-22 | 半导体器件封装方法及其结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102203927A CN102203927A (zh) | 2011-09-28 |
CN102203927B true CN102203927B (zh) | 2013-04-24 |
Family
ID=44662789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011800007541A Active CN102203927B (zh) | 2011-06-22 | 2011-06-22 | 一种器件塑封的方法及其封装结构 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9082777B2 (zh) |
EP (1) | EP2565913B1 (zh) |
CN (1) | CN102203927B (zh) |
WO (1) | WO2011150879A2 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011150879A2 (zh) | 2011-06-22 | 2011-12-08 | 华为终端有限公司 | 半导体器件封装方法及其结构 |
JP6098467B2 (ja) * | 2013-10-08 | 2017-03-22 | 株式会社デンソー | 電子装置の製造方法 |
US9397051B2 (en) | 2013-12-03 | 2016-07-19 | Invensas Corporation | Warpage reduction in structures with electrical circuitry |
US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
US11267172B2 (en) | 2016-07-27 | 2022-03-08 | Composecure, Llc | Overmolded electronic components for transaction cards and methods of making thereof |
US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
JP7223748B2 (ja) | 2017-09-07 | 2023-02-16 | コンポセキュア,リミティド ライアビリティ カンパニー | 電子部品が埋め込まれた取引カード及び製造プロセス |
CA3079539A1 (en) | 2017-10-18 | 2019-04-25 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
CN108987289A (zh) * | 2018-06-22 | 2018-12-11 | 江苏长电科技股份有限公司 | 一种双面塑封锡球制程方法 |
USD948613S1 (en) | 2020-04-27 | 2022-04-12 | Composecure, Llc | Layer of a transaction card |
CN113078070A (zh) * | 2021-03-30 | 2021-07-06 | 无锡闻泰信息技术有限公司 | 器件塑封方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1959947A (zh) * | 2005-10-31 | 2007-05-09 | 南通富士通微电子股份有限公司 | 集成电路后道封装塑封成型方法 |
CN101110406A (zh) * | 2006-07-20 | 2008-01-23 | 威宇科技测试封装有限公司 | 一种多芯片封装结构及其封装方法 |
CN101611483A (zh) * | 2007-02-15 | 2009-12-23 | 飞科公司 | 利用真空封装电子元器件的方法和设备 |
CN101719760A (zh) * | 2009-12-04 | 2010-06-02 | 武汉盛华微系统技术股份有限公司 | 环氧树脂模塑封装smt晶体谐振器或振荡器的方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5105259A (en) * | 1990-09-28 | 1992-04-14 | Motorola, Inc. | Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation |
JP4078033B2 (ja) * | 1999-03-26 | 2008-04-23 | 株式会社ルネサステクノロジ | 半導体モジュールの実装方法 |
JP2001077301A (ja) * | 1999-08-24 | 2001-03-23 | Amkor Technology Korea Inc | 半導体パッケージ及びその製造方法 |
US6833628B2 (en) * | 2002-12-17 | 2004-12-21 | Delphi Technologies, Inc. | Mutli-chip module |
US20040178514A1 (en) * | 2003-03-12 | 2004-09-16 | Lee Sang-Hyeop | Method of encapsulating semiconductor devices on a printed circuit board, and a printed circuit board for use in the method |
WO2005067029A1 (en) * | 2004-01-06 | 2005-07-21 | Infineon Technologies Ag | Method for packaging integrated circuit dies |
US7763963B2 (en) * | 2005-05-04 | 2010-07-27 | Stats Chippac Ltd. | Stacked package semiconductor module having packages stacked in a cavity in the module substrate |
US20080251901A1 (en) * | 2006-01-24 | 2008-10-16 | Zigmund Ramirez Camacho | Stacked integrated circuit package system |
JP2010010644A (ja) * | 2008-05-27 | 2010-01-14 | Toshiba Corp | 半導体装置の製造方法 |
WO2011150879A2 (zh) | 2011-06-22 | 2011-12-08 | 华为终端有限公司 | 半导体器件封装方法及其结构 |
US8597979B1 (en) * | 2013-01-23 | 2013-12-03 | Lajos Burgyan | Panel-level package fabrication of 3D active semiconductor and passive circuit components |
-
2011
- 2011-06-22 WO PCT/CN2011/076087 patent/WO2011150879A2/zh active Application Filing
- 2011-06-22 CN CN2011800007541A patent/CN102203927B/zh active Active
- 2011-06-22 EP EP11789258.8A patent/EP2565913B1/en active Active
-
2012
- 2012-12-11 US US13/710,764 patent/US9082777B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1959947A (zh) * | 2005-10-31 | 2007-05-09 | 南通富士通微电子股份有限公司 | 集成电路后道封装塑封成型方法 |
CN101110406A (zh) * | 2006-07-20 | 2008-01-23 | 威宇科技测试封装有限公司 | 一种多芯片封装结构及其封装方法 |
CN101611483A (zh) * | 2007-02-15 | 2009-12-23 | 飞科公司 | 利用真空封装电子元器件的方法和设备 |
CN101719760A (zh) * | 2009-12-04 | 2010-06-02 | 武汉盛华微系统技术股份有限公司 | 环氧树脂模塑封装smt晶体谐振器或振荡器的方法 |
Also Published As
Publication number | Publication date |
---|---|
US20130102113A1 (en) | 2013-04-25 |
WO2011150879A2 (zh) | 2011-12-08 |
US9082777B2 (en) | 2015-07-14 |
WO2011150879A3 (zh) | 2012-05-24 |
EP2565913A4 (en) | 2013-07-31 |
CN102203927A (zh) | 2011-09-28 |
EP2565913B1 (en) | 2019-03-20 |
EP2565913A2 (en) | 2013-03-06 |
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Address after: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee after: Huawei terminal (Shenzhen) Co.,Ltd. Address before: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee before: HUAWEI DEVICE Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20181219 Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: HUAWEI DEVICE Co.,Ltd. Address before: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee before: Huawei terminal (Shenzhen) Co.,Ltd. |