CN110034024A - 封装基板的制造方法 - Google Patents
封装基板的制造方法 Download PDFInfo
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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- 229910052760 oxygen Inorganic materials 0.000 description 1
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- 238000004080 punching Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
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Abstract
提供封装基板的制造方法,能够制造出厚度均匀的封装基板。封装基板的制造方法包含如下的工序:模制树脂提供工序,利用模制模具(12)围绕配设有多个器件(8)的布线基板(2)并提供模制树脂(22);预烧结工序,按照未达到正式烧结的温度的较低温度对模制树脂(22)进行预烧结;模制模具取下工序,将布线基板(2)从模制模具(12)取下;以及正式烧结工序,将布线基板(2)载置于具有第一平坦面(26a)的第一基台(26)上,利用具有与第一平坦面(26a)平行的第二平坦面(28a)的第二基台(28)对布线基板(2)进行按压,并且按照正式烧结的温度进行加热,使预烧结后的模制树脂(22)的厚度达到均匀而进行正式烧结。
Description
技术领域
本发明涉及封装基板的制造方法,该封装基板在由分割预定线划分而形成有多个与器件相对应的布线图案的布线基板上配设有多个器件,并且该封装基板利用模制树脂进行了密封。
背景技术
在由分割预定线划分而在正面上形成有IC、LSI等多个器件的晶片通过切割装置、激光加工装置而分割成各个器件芯片,分割得到的各器件芯片被用于移动电话、个人计算机等电子设备。另外,器件芯片按照利用模制树脂进行密封的被称为CSP(Chip SizePackage:芯片尺寸封装)的方式进行使用(例如,参照专利文献1)。
专利文献1:日本特开2006-32471号公报
但是,存在如下的问题:利用模制模具围绕布线基板并提供模制树脂从而对多个器件进行封装而形成的封装基板的厚度未必均匀,无法实现品质的稳定。
发明内容
由此,本发明的目的在于提供封装基板的制造方法,能够制造出厚度均匀的封装基板。
根据本发明,提供封装基板的制造方法,该封装基板在由交叉的分割预定线划分而形成有多个与器件相对应的布线图案的布线基板上配设有多个器件,并且该封装基板利用模制树脂进行了密封,其中,该封装基板的制造方法具有如下的工序:模制树脂提供工序,利用模制模具围绕配设有多个器件的布线基板并提供模制树脂;预烧结工序,按照未达到正式烧结的温度的较低温度对模制树脂进行预烧结;模制模具取下工序,在实施了该预烧结工序之后,将布线基板从该模制模具取下;以及正式烧结工序,在实施了该模制模具取下工序之后,将布线基板载置于具有第一平坦面的第一基台上,利用具有与该第一平坦面平行的第二平坦面的第二基台对布线基板进行按压,并且按照正式烧结的温度进行加热,使预烧结后的模制树脂的厚度达到均匀而进行正式烧结。
优选布线基板上分成两个以上的组而形成有布线图案。优选该模制树脂为液态环氧树脂,预烧结的温度为160℃~180℃,正式烧结的温度为250℃~270℃。
根据本发明,能够制造出厚度均匀的封装基板。
附图说明
图1是示出在布线基板上配设多个器件的状态的立体图。
图2是配设有多个器件的布线基板的主视图。
图3是层叠有两层器件的情况下的布线基板的局部放大主视图。
图4是配设有多个器件的布线基板和模制模具的立体图。
图5的(a)是示出实施模制树脂提供工序的状态的立体图,图5的(b)是示出实施了模制树脂提供工序的状态的布线基板的剖视图。
图6是示出进行预烧结时的布线基板的状态的立体图。
图7是示出将布线基板从模制模具取下的状态的立体图。
图8是示出实施正式烧结工序的状态的立体图。
图9是封装基板的立体图。
标号说明
2:布线基板;8:器件;12:模制模具;22:模制树脂;26:第一基台;26a:第一平坦面;28:第二基台;28a:第二平坦面;30:封装基板。
具体实施方式
以下,参照附图对本发明的封装基板的制造方法的实施方式进行详细的说明。
图1所示的布线基板2由格子状的分割预定线4划分成多个矩形区域6,在多个矩形区域6中分别形成有与器件8相对应的布线图案(未图示)。本实施方式中的布线基板2分成第一组Ga和第二组Gb这两个组而形成有多个布线图案,但布线基板2所形成的布线图案的组可以为单独的,或者可以为三组以上。如图1和图2所示,在各矩形区域6中配设器件8,各器件8的连接端子(未图示)与形成于各矩形区域6的布线图案的电极(未图示)通过引线10连接。另外,如图3所示,也有层叠两层器件8a、8b的情况,在该情况下,器件8a、8b的连接端子与布线图案的电极分别通过引线10a、10b连接。也有层叠三层以上的器件的情况。另外,也可以借助球电极(未图示)将器件8的连接端子和布线图案的电极连接。
在本实施方式中,首先实施模制树脂提供工序,利用模制模具围绕配设有多个器件8的布线基板2并提供模制树脂。在本实施方式中,如图4所示,模制模具12具有:矩形状的上壁14;以及从上壁14的周缘垂下的四个侧壁16,模制模具12的下端侧开放。另外,在上壁14上形成有:用于提供模制树脂的提供开口18;以及用于将从提供开口18提供的模制树脂的剩余量排出的排出开口20。在模制树脂提供工序中,首先如图4和图5的(a)所示,将模制模具12覆盖于布线基板2的器件8侧的面上,利用模制模具12围绕配设有多个器件8的布线基板2。接着,从提供开口18向模制模具12的内表面与布线基板2的器件8侧的面之间提供液态环氧树脂等模制树脂22而进行填充,并且将从提供开口18提供的模制树脂22的剩余量从排出开口20排出。由此,如图5的(b)所示,能够利用模制树脂22对配设于布线基板2的多个器件8进行密封。另外,为了提高刚性或热传导性,在模制树脂22中可以混入由二氧化硅等构成的粒径数十μm左右的填料。
在实施了模制树脂提供工序之后,实施预烧结工序,按照未达到正式烧结的温度的较低温度对模制树脂22进行预烧结。为了防止预烧结中的模制树脂22的变形,如图6所示在将模制模具12覆盖于布线基板2的状态下实施预烧结工序。例如,在模制树脂提供工序中所提供的模制树脂22为液态环氧树脂的情况下,按照160℃~180℃左右的温度花费15分钟~20分钟左右的时间来实施预烧结工序。这样,按照未达到正式烧结的温度的较低温度对模制树脂22进行预烧结,从而模制树脂22虽未完全硬化而存在发生变形的余地,但硬化至即使将布线基板2从模制模具12取下也可保持模制模具12的形状的程度。
在实施了预烧结工序之后,如图7所示,实施模制模具取下工序,将布线基板2从模制模具12取下。
在实施了模制模具取下工序之后,实施正式烧结工序,将布线基板2载置于具有第一平坦面的第一基台上,利用具有与第一平坦面平行的第二平坦面的第二基台对布线基板2进行按压,并且按照正式烧结的温度进行加热,使预烧结后的模制树脂22的厚度达到均匀而进行正式烧结。正式烧结工序例如可以使用在图8中示出一部分的冲压装置24来实施。冲压装置24包含:圆柱状的第一基台26,其在上端具有第一平坦面26a;以及圆柱状的第二基台28,其在下端具有与第一平坦面26a平行的第二平坦面28a。第一基台26固定于地板上。另一方面,第二基台28构成为升降自如,通过可由油压气缸等构成的适当的升降单元(未图示)进行升降。在该第二基台28中内置有对第二平坦面28a进行加热的加热器(未图示),第二平坦面28a由铝合金或铜合金等热传导率比较高的适当的金属材料形成。
参照图8继续进行说明,在正式烧结工序中,首先使模制树脂22朝上而将布线基板2载置于第一平坦面26a上。接着,利用升降单元使第二基台28下降,利用第二平坦面28a对模制树脂22进行按压。另外,使加热器进行动作,按照比预烧结的温度高的正式烧结的温度且花费比预烧结的时间长的时间而对模制树脂22进行加热。例如,在模制树脂提供工序中所提供的模制树脂22为液态环氧树脂的情况下,按照250℃~270℃左右的温度花费20分钟~25分钟左右的时间而实施正式烧结工序。另外,利用第二平坦面28a对模制树脂22进行按压时的按压力可以为0.5N/cm2~1.0N/cm2左右。由此,能够使模制树脂22完全硬化,并且能够使模制树脂22的厚度达到均匀,能够制造出如图9所示的厚度均匀的封装基板30。
Claims (3)
1.一种封装基板的制造方法,该封装基板在由交叉的分割预定线划分而形成有多个与器件相对应的布线图案的布线基板上配设有多个器件,并且该封装基板利用模制树脂进行了密封,其中,
该封装基板的制造方法具有如下的工序:
模制树脂提供工序,利用模制模具围绕配设有多个器件的布线基板并提供模制树脂;
预烧结工序,按照未达到正式烧结的温度的较低温度对模制树脂进行预烧结;
模制模具取下工序,在实施了该预烧结工序之后,将布线基板从该模制模具取下;以及
正式烧结工序,在实施了该模制模具取下工序之后,将布线基板载置于具有第一平坦面的第一基台上,利用具有与该第一平坦面平行的第二平坦面的第二基台对布线基板进行按压,并且按照正式烧结的温度进行加热,使预烧结后的模制树脂的厚度达到均匀而进行正式烧结。
2.根据权利要求1所述的封装基板的制造方法,其中,
布线基板上分成两个以上的组而形成有布线图案。
3.根据权利要求1所述的封装基板的制造方法,其中,
该模制树脂为液态环氧树脂,预烧结的温度为160℃~180℃,正式烧结的温度为250℃~270℃。
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