CN102156195B - 惯性传感器装置的制造方法 - Google Patents
惯性传感器装置的制造方法 Download PDFInfo
- Publication number
- CN102156195B CN102156195B CN2011100046162A CN201110004616A CN102156195B CN 102156195 B CN102156195 B CN 102156195B CN 2011100046162 A CN2011100046162 A CN 2011100046162A CN 201110004616 A CN201110004616 A CN 201110004616A CN 102156195 B CN102156195 B CN 102156195B
- Authority
- CN
- China
- Prior art keywords
- sensor device
- inertial sensor
- lead
- gyro sensor
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Gyroscopes (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006-216505 | 2006-08-09 | ||
| JP2006216505 | 2006-08-09 | ||
| JP2006-249404 | 2006-09-14 | ||
| JP2006249404 | 2006-09-14 | ||
| JP2007119281A JP5622347B2 (ja) | 2006-08-09 | 2007-04-27 | 慣性センサ装置 |
| JP2007-119281 | 2007-04-27 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101403404A Division CN101126646B (zh) | 2006-08-09 | 2007-08-09 | 惯性传感器、惯性传感器装置及其制造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102156195A CN102156195A (zh) | 2011-08-17 |
| CN102156195B true CN102156195B (zh) | 2013-03-20 |
Family
ID=39049246
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100046162A Expired - Fee Related CN102156195B (zh) | 2006-08-09 | 2007-08-09 | 惯性传感器装置的制造方法 |
| CN2007101403404A Expired - Fee Related CN101126646B (zh) | 2006-08-09 | 2007-08-09 | 惯性传感器、惯性传感器装置及其制造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101403404A Expired - Fee Related CN101126646B (zh) | 2006-08-09 | 2007-08-09 | 惯性传感器、惯性传感器装置及其制造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US7886596B2 (enExample) |
| JP (1) | JP5622347B2 (enExample) |
| CN (2) | CN102156195B (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010002427A (ja) * | 2006-08-09 | 2010-01-07 | Epson Toyocom Corp | 慣性センサ、慣性センサ装置及びその製造方法 |
| DE102007053808B4 (de) * | 2007-11-12 | 2023-07-06 | Robert Bosch Gmbh | Sockelelement, Sockelanordnung und Verfahren zur Herstellung einer weiteren Sockelanordnung |
| EP2112471A1 (fr) * | 2008-04-22 | 2009-10-28 | Microcomponents AG | Dispositif de montage pour composant électronique |
| JP2010060358A (ja) * | 2008-09-02 | 2010-03-18 | Murata Mfg Co Ltd | 角速度センサ |
| US8256288B2 (en) | 2008-12-16 | 2012-09-04 | Seiko Epson Corporation | Sensor device |
| JP2010190706A (ja) * | 2009-02-18 | 2010-09-02 | Panasonic Corp | 慣性力センサ |
| US8359920B2 (en) * | 2009-05-15 | 2013-01-29 | Lockheed Martin Corp. | Gravity sensing instrument |
| JP2011133246A (ja) * | 2009-12-22 | 2011-07-07 | Sony Corp | 角速度センサ及び電子機器 |
| JP5776184B2 (ja) * | 2011-01-19 | 2015-09-09 | 株式会社村田製作所 | センサ装置 |
| KR101239636B1 (ko) * | 2011-04-08 | 2013-03-11 | 국방과학연구소 | Mems 공진기, 이를 구비하는 센서 및 mems 공진기의 제조방법 |
| CN102384749B (zh) * | 2011-10-20 | 2014-02-05 | 惠州市德赛西威汽车电子有限公司 | 车载导航陀螺仪连接器 |
| US9635794B2 (en) * | 2012-02-20 | 2017-04-25 | Trw Automotive U.S. Llc | Method and apparatus for attachment of integrated circuits |
| KR20140009799A (ko) * | 2012-07-13 | 2014-01-23 | 에스케이하이닉스 주식회사 | 전자 소자의 패키지 및 제조 방법 |
| CN103292809B (zh) * | 2013-05-14 | 2016-03-09 | 哈尔滨工程大学 | 一种单轴旋转式惯导系统及其专用误差自补偿方法 |
| JP5757352B2 (ja) * | 2014-02-21 | 2015-07-29 | セイコーエプソン株式会社 | センサデバイス |
| EP3171131A4 (en) * | 2014-07-16 | 2018-03-07 | Seiko Epson Corporation | Sensor unit, electronic apparatus, and mobile body |
| US9612251B2 (en) * | 2014-09-30 | 2017-04-04 | Meng Liang Chen | G-force measurement system with a horizontally deviated accelerometer |
| JP6429199B2 (ja) * | 2015-05-29 | 2018-11-28 | 日立オートモティブシステムズ株式会社 | 慣性センサ |
| US11024608B2 (en) | 2017-03-28 | 2021-06-01 | X Display Company Technology Limited | Structures and methods for electrical connection of micro-devices and substrates |
| CN107167623B (zh) * | 2017-05-22 | 2021-11-26 | 杭州集普科技有限公司 | 汽车碰撞试验用三轴角速度传感器 |
| JP7024349B2 (ja) * | 2017-11-24 | 2022-02-24 | セイコーエプソン株式会社 | センサーユニット、センサーユニットの製造方法、慣性計測装置、電子機器、および移動体 |
| GB2570004B (en) * | 2018-01-09 | 2022-03-02 | Jaguar Land Rover Ltd | Sensor apparatus |
| CN109596141A (zh) * | 2019-01-22 | 2019-04-09 | 广州极飞科技有限公司 | 传感器组件、惯性测量组件和移动设备 |
| JP7179682B2 (ja) * | 2019-05-31 | 2022-11-29 | 株式会社東芝 | 振動検出装置 |
| US11101417B2 (en) | 2019-08-06 | 2021-08-24 | X Display Company Technology Limited | Structures and methods for electrically connecting printed components |
| JP2022107279A (ja) * | 2021-01-08 | 2022-07-21 | セイコーエプソン株式会社 | 慣性計測装置 |
Citations (6)
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|---|---|---|---|---|
| CN1230783A (zh) * | 1998-03-27 | 1999-10-06 | 三菱电机株式会社 | 半导体装置和半导体装置用的引线框 |
| CN1424757A (zh) * | 2001-12-14 | 2003-06-18 | 株式会社日立制作所 | 半导体器件及其制造方法 |
| CN1456857A (zh) * | 2003-06-05 | 2003-11-19 | 上海工程技术大学 | 智能型烘房风机回转供风系统 |
| CN1580701A (zh) * | 2004-05-20 | 2005-02-16 | 上海交通大学 | 静电悬浮转子微惯性传感器及其制造方法 |
| CN1747164A (zh) * | 2004-09-10 | 2006-03-15 | 雅马哈株式会社 | 物理量传感器、引线框架及其制造方法 |
| CN1758435A (zh) * | 2004-10-08 | 2006-04-12 | 雅马哈株式会社 | 物理量传感器及其制造方法 |
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|---|---|---|---|---|
| US3650648A (en) * | 1970-02-25 | 1972-03-21 | Union Carbide Corp | System for molding electronic components |
| US5866818A (en) | 1995-11-30 | 1999-02-02 | Matsushita Electric Works, Ltd. | Acceleration sensor device |
| JP3259645B2 (ja) * | 1995-11-30 | 2002-02-25 | 松下電工株式会社 | 加速度センサ及びその製造方法 |
| JPH09166445A (ja) * | 1995-12-15 | 1997-06-24 | Miyota Kk | 角速度センサ |
| DE19637079C2 (de) * | 1996-09-12 | 2000-05-25 | Telefunken Microelectron | Anordnung zur Beschleunigungsmessung |
| JPH11317326A (ja) * | 1998-03-06 | 1999-11-16 | Rohm Co Ltd | 電子部品 |
| JP3608381B2 (ja) * | 1998-05-18 | 2005-01-12 | 株式会社村田製作所 | 角速度センサ |
| JP2000337884A (ja) * | 1999-03-25 | 2000-12-08 | Murata Mfg Co Ltd | 角速度センサ |
| JP2002022452A (ja) | 2000-07-11 | 2002-01-23 | Ngk Insulators Ltd | 振動型ジャイロスコープを内蔵した角速度測定装置 |
| JP4066608B2 (ja) * | 2001-03-16 | 2008-03-26 | 日亜化学工業株式会社 | パッケージ成形体及びその製造方法 |
| JP2003185439A (ja) * | 2001-12-20 | 2003-07-03 | Nec Tokin Corp | 圧電振動ジャイロ |
| JP2003227844A (ja) | 2002-02-04 | 2003-08-15 | Pioneer Electronic Corp | センサ装置及び移動体用電子機器 |
| JP4084354B2 (ja) | 2002-05-28 | 2008-04-30 | 富士通メディアデバイス株式会社 | 角速度センサ |
| CN100346168C (zh) * | 2002-07-29 | 2007-10-31 | 雅马哈株式会社 | 磁性传感器的制造方法及其引线框 |
| JP4389480B2 (ja) * | 2003-05-28 | 2009-12-24 | セイコーエプソン株式会社 | 振動子の支持機構及び振動子ユニット |
| JP2004361175A (ja) * | 2003-06-03 | 2004-12-24 | Seiko Epson Corp | 素子取付パッケージ |
| EP1684047B1 (en) * | 2003-11-12 | 2018-08-22 | Seiko Epson Corporation | Support member of vibrator |
| JP2005203434A (ja) * | 2004-01-13 | 2005-07-28 | Fuji Photo Film Co Ltd | パターン形成方法 |
| JP2005249428A (ja) | 2004-03-01 | 2005-09-15 | Ngk Insulators Ltd | 振動子の支持構造、その製造方法および振動子用パッケージ |
| JP2006064539A (ja) * | 2004-08-26 | 2006-03-09 | Matsushita Electric Works Ltd | ジャイロセンサおよび角速度検出方法 |
| JP4428309B2 (ja) * | 2004-09-10 | 2010-03-10 | セイコーエプソン株式会社 | 振動型ジャイロスコープ |
| JP2006105614A (ja) * | 2004-09-30 | 2006-04-20 | Seiko Epson Corp | 振動型ジャイロスコープ、及び振動型ジャイロスコープの製造方法 |
| US7595548B2 (en) * | 2004-10-08 | 2009-09-29 | Yamaha Corporation | Physical quantity sensor and manufacturing method therefor |
| KR20070049687A (ko) * | 2004-10-08 | 2007-05-11 | 야마하 가부시키가이샤 | 물리량 센서의 제조 방법 |
| US20060211176A1 (en) * | 2005-03-09 | 2006-09-21 | Shiga International | Manufacturing method for physical quantity sensor using lead frame and bonding device therefor |
| US20060208344A1 (en) * | 2005-03-16 | 2006-09-21 | Shiu Hei M | Lead frame panel and method of packaging semiconductor devices using the lead frame panel |
| JP4682671B2 (ja) * | 2005-03-31 | 2011-05-11 | セイコーエプソン株式会社 | 圧電デバイス |
| JP4534912B2 (ja) * | 2005-08-30 | 2010-09-01 | 株式会社デンソー | 角速度センサの取付構造 |
| US7588999B2 (en) * | 2005-10-28 | 2009-09-15 | Semiconductor Components Industries, Llc | Method of forming a leaded molded array package |
| JP2010002427A (ja) * | 2006-08-09 | 2010-01-07 | Epson Toyocom Corp | 慣性センサ、慣性センサ装置及びその製造方法 |
| ITTO20070489A1 (it) * | 2007-07-05 | 2009-01-06 | St Microelectronics Srl | Procedimento e sistema di fabbricazione di un dispositivo a semiconduttore incapsulato |
-
2007
- 2007-04-27 JP JP2007119281A patent/JP5622347B2/ja not_active Expired - Fee Related
- 2007-07-27 US US11/878,883 patent/US7886596B2/en not_active Expired - Fee Related
- 2007-08-09 CN CN2011100046162A patent/CN102156195B/zh not_active Expired - Fee Related
- 2007-08-09 CN CN2007101403404A patent/CN101126646B/zh not_active Expired - Fee Related
-
2011
- 2011-01-04 US US12/984,133 patent/US8309385B2/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1230783A (zh) * | 1998-03-27 | 1999-10-06 | 三菱电机株式会社 | 半导体装置和半导体装置用的引线框 |
| CN1424757A (zh) * | 2001-12-14 | 2003-06-18 | 株式会社日立制作所 | 半导体器件及其制造方法 |
| CN1456857A (zh) * | 2003-06-05 | 2003-11-19 | 上海工程技术大学 | 智能型烘房风机回转供风系统 |
| CN1580701A (zh) * | 2004-05-20 | 2005-02-16 | 上海交通大学 | 静电悬浮转子微惯性传感器及其制造方法 |
| CN1747164A (zh) * | 2004-09-10 | 2006-03-15 | 雅马哈株式会社 | 物理量传感器、引线框架及其制造方法 |
| CN1758435A (zh) * | 2004-10-08 | 2006-04-12 | 雅马哈株式会社 | 物理量传感器及其制造方法 |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2005-203431A 2005.07.28 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102156195A (zh) | 2011-08-17 |
| CN101126646A (zh) | 2008-02-20 |
| JP2008096420A (ja) | 2008-04-24 |
| JP5622347B2 (ja) | 2014-11-12 |
| US20110113879A1 (en) | 2011-05-19 |
| CN101126646B (zh) | 2011-11-16 |
| US7886596B2 (en) | 2011-02-15 |
| US20080034865A1 (en) | 2008-02-14 |
| US8309385B2 (en) | 2012-11-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: SEIKO EPSON CORP. Free format text: FORMER OWNER: EPSON TOYOCOM CORP. Effective date: 20111014 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20111014 Address after: Tokyo, Japan Applicant after: Seiko Epson Corp. Address before: Tokyo, Japan, Japan Applicant before: Epson Toyocom Corp. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130320 Termination date: 20180809 |