CN102144004B - 改性颗粒及包含所述颗粒的分散体 - Google Patents

改性颗粒及包含所述颗粒的分散体 Download PDF

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Publication number
CN102144004B
CN102144004B CN200980134455.XA CN200980134455A CN102144004B CN 102144004 B CN102144004 B CN 102144004B CN 200980134455 A CN200980134455 A CN 200980134455A CN 102144004 B CN102144004 B CN 102144004B
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particle
dispersion
metal
properties
correcting agent
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Expired - Fee Related
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CN200980134455.XA
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Chinese (zh)
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CN102144004A (zh
Inventor
I·多姆克
A·卡尔波夫
H·希布施特
R·帕卡拉什科夫
I·亨尼希
M·卡斯特勒
F·弗莱施哈克尔
L·韦伯
P·埃克勒
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BASF SE
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BASF SE
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09CTREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/04Compounds of zinc
    • C09C1/043Zinc oxide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/26Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition
    • H10P14/265Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition using solutions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3424Deposited materials, e.g. layers characterised by the chemical composition being Group IIB-VIA materials
    • H10P14/3426Oxides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3434Deposited materials, e.g. layers characterised by the chemical composition being oxide semiconductor materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3451Structure
    • H10P14/3452Microstructure
    • H10P14/3461Nanoparticles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/62Submicrometer sized, i.e. from 0.1-1 micrometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/64Nanometer sized, i.e. from 1-100 nanometer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991Coated
    • Y10T428/2993Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
    • Y10T428/2995Silane, siloxane or silicone coating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Oxygen, Ozone, And Oxides In General (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
CN200980134455.XA 2008-09-04 2009-08-28 改性颗粒及包含所述颗粒的分散体 Expired - Fee Related CN102144004B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP08163703 2008-09-04
EP08163703.5 2008-09-04
PCT/EP2009/061103 WO2010026102A1 (de) 2008-09-04 2009-08-28 Modifizierte partikel und diese enthaltende dispersionen

Publications (2)

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CN102144004A CN102144004A (zh) 2011-08-03
CN102144004B true CN102144004B (zh) 2014-11-26

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Country Link
US (1) US8734899B2 (enExample)
EP (1) EP2321373A1 (enExample)
JP (1) JP5599797B2 (enExample)
KR (1) KR20110066162A (enExample)
CN (1) CN102144004B (enExample)
TW (1) TWI488815B (enExample)
WO (1) WO2010026102A1 (enExample)

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US8377312B2 (en) 2008-12-11 2013-02-19 Basf Se Enrichment of ores from mine tailings
WO2010066768A2 (de) * 2008-12-12 2010-06-17 Basf Se Dispersionen enthaltend funktionalisierte oxidische nanopartikel
ES2437415T3 (es) 2009-03-04 2014-01-10 Basf Se Separación magnética de minerales de metal no ferroso mediante acondicionamiento de varias etapas
CN102612406A (zh) * 2009-11-20 2012-07-25 巴斯夫欧洲公司 用于制备羧酸和/或羧酸酐的在至少一个催化剂层中具有锑酸钒的多层催化剂及具有低热点温度的制备邻苯二甲酸酐的方法
EP2513971A1 (de) 2009-12-18 2012-10-24 Basf Se Metalloxid-feldeffekttransistoren auf mechanisch flexiblem polymersubstrat mit aus lösung prozessierbarem dielektrikum bei niedrigen temperaturen
US20110230668A1 (en) * 2010-03-19 2011-09-22 Basf Se Catalyst for gas phase oxidations based on low-sulfur and low-calcium titanium dioxide
TW201206896A (en) 2010-04-13 2012-02-16 Basf Se Process for controlling a gas phase oxidation reactor for preparation of phthalic anhydride
WO2011133228A2 (en) 2010-04-23 2011-10-27 Pixelligent Technologies, Llc Synthesis, capping and dispersion of nanocrystals
EP2563719A4 (en) 2010-04-28 2017-03-08 Basf Se Process for preparing a zinc complex in solution
US8865000B2 (en) 2010-06-11 2014-10-21 Basf Se Utilization of the naturally occurring magnetic constituents of ores
US8859459B2 (en) 2010-06-30 2014-10-14 Basf Se Multilayer catalyst for preparing phthalic anhydride and process for preparing phthalic anhydride
US9212157B2 (en) 2010-07-30 2015-12-15 Basf Se Catalyst for the oxidation of o-xylene and/or naphthalene to phthalic anhydride
US9376457B2 (en) 2010-09-03 2016-06-28 Basf Se Hydrophobic, functionalized particles
CN107416764A (zh) 2010-10-27 2017-12-01 皮瑟莱根特科技有限责任公司 纳米晶体的合成、盖帽和分散
US9359689B2 (en) 2011-10-26 2016-06-07 Pixelligent Technologies, Llc Synthesis, capping and dispersion of nanocrystals
KR101978835B1 (ko) * 2012-03-16 2019-05-15 한국전자통신연구원 박막 트랜지스터
JP6108563B2 (ja) * 2013-02-04 2017-04-05 国立研究開発法人産業技術総合研究所 抵抗体、誘電体等の電子部品用無機材料ペースト及び該無機材料ペーストの製造方法
FI130559B (en) * 2021-06-23 2023-11-21 Turun Yliopisto Semiconductor structure, semiconductor device, and method
KR102756449B1 (ko) * 2022-02-11 2025-01-21 한인정밀화학(주) 양자점 조성물, 이로부터 형성된 경화 패턴, 및 이를 포함하는 디스플레이 장치
CN118039856A (zh) * 2024-02-19 2024-05-14 贵州大学 锂电池用包覆及掺杂改性的高镍正极材料和低温电解液

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CN1652997A (zh) * 2002-06-12 2005-08-10 日本板硝子株式会社 薄片形式的多孔金属氧化物材料、其生产方法和包含它的化妆品、涂布材料、树脂组合物、油墨组合物和纸张
JP2007012590A (ja) * 2005-05-30 2007-01-18 Sumitomo Electric Ind Ltd 金属被膜とその形成方法および金属配線
CN101124166A (zh) * 2004-10-04 2008-02-13 布勒潘泰克有限公司 制备具有定制的表面化学性能的纳米粒子的方法及相应的胶体
EP1900426A2 (de) * 2003-02-06 2008-03-19 Bühler PARTEC GmbH Chemomechanisch oberflächenmodifizierte Partikel und deren Herstellung

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JP2004010807A (ja) * 2002-06-10 2004-01-15 Toyo Ink Mfg Co Ltd 水性分散体の製造方法
CN1652997A (zh) * 2002-06-12 2005-08-10 日本板硝子株式会社 薄片形式的多孔金属氧化物材料、其生产方法和包含它的化妆品、涂布材料、树脂组合物、油墨组合物和纸张
EP1900426A2 (de) * 2003-02-06 2008-03-19 Bühler PARTEC GmbH Chemomechanisch oberflächenmodifizierte Partikel und deren Herstellung
CN101124166A (zh) * 2004-10-04 2008-02-13 布勒潘泰克有限公司 制备具有定制的表面化学性能的纳米粒子的方法及相应的胶体
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Publication number Publication date
JP5599797B2 (ja) 2014-10-01
TW201016614A (en) 2010-05-01
EP2321373A1 (de) 2011-05-18
TWI488815B (zh) 2015-06-21
JP2012501941A (ja) 2012-01-26
CN102144004A (zh) 2011-08-03
KR20110066162A (ko) 2011-06-16
US8734899B2 (en) 2014-05-27
WO2010026102A1 (de) 2010-03-11
US20110163278A1 (en) 2011-07-07

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