CN102076807B - 热熔粘合剂组合物以及它们的制备和使用方法 - Google Patents

热熔粘合剂组合物以及它们的制备和使用方法 Download PDF

Info

Publication number
CN102076807B
CN102076807B CN200980123821.1A CN200980123821A CN102076807B CN 102076807 B CN102076807 B CN 102076807B CN 200980123821 A CN200980123821 A CN 200980123821A CN 102076807 B CN102076807 B CN 102076807B
Authority
CN
China
Prior art keywords
hot melt
melt adhesive
adhesive composition
substrate
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200980123821.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN102076807A (zh
Inventor
D·比赫
G·戈登
L·洛厄
R·诺尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of CN102076807A publication Critical patent/CN102076807A/zh
Application granted granted Critical
Publication of CN102076807B publication Critical patent/CN102076807B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/10—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an adhesive surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B32B2037/1215—Hot-melt adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B32B2037/1215—Hot-melt adhesive
    • B32B2037/1223—Hot-melt adhesive film-shaped
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/20—Compositions for hot melt adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • C08L2666/44—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • C08L2666/52—Metal-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
CN200980123821.1A 2008-06-24 2009-06-18 热熔粘合剂组合物以及它们的制备和使用方法 Active CN102076807B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7503008P 2008-06-24 2008-06-24
US61/075,030 2008-06-24
PCT/US2009/047721 WO2010008749A1 (en) 2008-06-24 2009-06-18 Hot melt adhesive compositions and methods for their preparation and use

Publications (2)

Publication Number Publication Date
CN102076807A CN102076807A (zh) 2011-05-25
CN102076807B true CN102076807B (zh) 2014-09-17

Family

ID=41009873

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980123821.1A Active CN102076807B (zh) 2008-06-24 2009-06-18 热熔粘合剂组合物以及它们的制备和使用方法

Country Status (9)

Country Link
US (1) US8580073B2 (enExample)
EP (1) EP2291482A1 (enExample)
JP (1) JP5620373B2 (enExample)
KR (1) KR101624522B1 (enExample)
CN (1) CN102076807B (enExample)
AU (1) AU2009271424B2 (enExample)
CA (1) CA2727081C (enExample)
MX (1) MX2010013887A (enExample)
WO (1) WO2010008749A1 (enExample)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX340091B (es) * 2009-06-04 2016-06-27 Dow Corning Corp * Composición adhesiva aplicable mediante una pistola para uso en membranas de construcción.
US9593209B2 (en) 2009-10-22 2017-03-14 Dow Corning Corporation Process for preparing clustered functional polyorganosiloxanes, and methods for their use
CN103781823B (zh) * 2011-09-07 2016-08-17 道康宁公司 含钛络合物和缩合反应催化剂、制备该催化剂的方法以及包含该催化剂的组合物
US9550919B2 (en) * 2012-01-17 2017-01-24 Illinois Tool Works Inc. Anti-blocking adhesive-coated substrate, and a method for making the same
WO2014100652A1 (en) 2012-12-21 2014-06-26 Dow Corning Corporation Layered polymer structures and methods
CN105189685B (zh) 2013-02-11 2017-08-08 道康宁公司 用于形成导热热自由基固化有机硅组合物的方法
WO2014124388A1 (en) 2013-02-11 2014-08-14 Dow Corning Corporation Alkoxy-functional organopolysiloxane resin and polymer and related methods for forming same
US9718925B2 (en) 2013-02-11 2017-08-01 Dow Corning Corporation Curable silicone compositions comprising clustered functional polyorganosiloxanes and silicone reactive diluents
EP2954022B1 (en) 2013-02-11 2019-05-01 Dow Silicones Corporation Clustered functional polyorganosiloxanes, processes for forming same and methods for their use
ES2895424T3 (es) * 2013-02-11 2022-02-21 Dow Silicones Corp Composiciones adhesivas de silicona termofusibles curables por humedad que incluyen una resina reactiva de siloxano con grupos alcoxi funcionales
US9670392B2 (en) 2013-02-11 2017-06-06 Dow Corning Corporation Stable thermal radical curable silicone adhesive compositions
US9593275B2 (en) 2013-02-11 2017-03-14 Dow Corning Corporation In situ method for forming thermally conductive thermal radical cure silicone composition
KR102495932B1 (ko) * 2015-08-07 2023-02-02 에스케이온 주식회사 리튬 이차 전지
EP3196229B1 (en) 2015-11-05 2018-09-26 Dow Silicones Corporation Branched polyorganosiloxanes and related curable compositions, methods, uses and devices
WO2017102888A1 (de) * 2015-12-15 2017-06-22 Lisa Dräxlmaier GmbH Verfahren zum beschichten eines kunststoffbauteils mit einem schmelzklebstoff
GB2549955A (en) 2016-05-03 2017-11-08 4A Mfg Gmbh Membrane plate structure for generating sound waves
WO2018111365A1 (en) 2016-12-15 2018-06-21 Dow Silicones Corporation Condensation-curable electrically conductive silicone adhesive composition
EP3583155B1 (en) * 2017-02-20 2024-05-08 Dow Silicones Corporation Room-temperature-curable silicone composition and electric/electronic apparatus
TWI859121B (zh) * 2017-07-27 2024-10-21 美商杜邦電子材料國際有限責任公司 光電裝置及其製造方法、以及其用途
KR102553390B1 (ko) 2017-10-19 2023-07-11 다우 실리콘즈 코포레이션 압력에 민감한 접착제 조성물 및 그것을 준비하기 위한 제조 방법과 유연한 유기 발광 다이오드 애플리케이션에서의 사용
CA3093558A1 (en) 2018-03-19 2019-09-26 Dow Silicones Corporation Polyorganosiloxane hot melt adhesive compositions containing polyolefin - polydiorganoosiloxane copolymers and methods for the preparation and use thereof
CN111918904B (zh) 2018-03-19 2022-08-19 美国陶氏有机硅公司 聚烯烃-聚二有机硅氧烷嵌段共聚物和其合成方法
CA3101628A1 (en) * 2018-03-19 2019-09-26 Dow Silicones Corporation Hot melt adhesive composition containing a polyolefin - polydiorganoosiloxane copolymer and methods for the preparation and use thereof
CN112204113B (zh) 2018-06-29 2022-06-17 美国陶氏有机硅公司 固着添加剂及其制备方法和用途
US20210246337A1 (en) 2018-06-29 2021-08-12 Dow Silicones Corporation Solventless silicone pressure sensitive adhesive and methods for making and using same
JP7334195B2 (ja) 2018-07-17 2023-08-28 ダウ シリコーンズ コーポレーション ポリシロキサン樹脂－ポリオレフィンコポリマー並びにその調製方法及び使用方法
KR102673412B1 (ko) 2018-09-14 2024-06-11 다우 실리콘즈 코포레이션 감압성 접착제, 이의 제조 및 용도
KR102873949B1 (ko) 2018-10-30 2025-10-22 다우 도레이 캄파니 리미티드 경화 반응성 실리콘 조성물 및 그 경화물 및 이들의 용도
FR3089849B1 (fr) 2018-12-18 2020-12-25 Plastic Omnium Cie Procédé de recouvrement d’une surface plastique par un revêtement permanent
CN110028909A (zh) * 2018-12-25 2019-07-19 瑞声科技(新加坡)有限公司 玻璃软膜结构及其制作方法
CN110028908A (zh) * 2018-12-25 2019-07-19 瑞声科技(新加坡)有限公司 玻璃软膜结构及其制作方法
JP7644604B2 (ja) 2018-12-27 2025-03-12 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
CN113396042A (zh) 2018-12-27 2021-09-14 陶氏东丽株式会社 具有热熔性的固化性有机硅片材的制造方法
CN113348210B (zh) 2018-12-27 2023-01-03 陶氏东丽株式会社 固化性有机硅组合物、其固化物及其制造方法
CN113631659B (zh) 2019-03-29 2023-05-05 陶氏东丽株式会社 固化性有机硅组合物、其固化物及其制造方法
WO2020203306A1 (ja) 2019-03-29 2020-10-08 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
CN113490722B (zh) 2019-03-29 2025-07-15 陶氏东丽株式会社 固化性有机硅组合物、其固化物及其制造方法
WO2021006898A1 (en) * 2019-07-10 2021-01-14 Hewlett-Packard Development Company, L.P. Reworkable optically clear adhesive compositions
CN114341278B (zh) 2019-08-22 2023-05-02 美国陶氏有机硅公司 聚有机硅氧烷防粘涂料组合物
EP4051748A4 (en) 2019-10-31 2023-08-16 Dow Silicones Corporation Silicone pressure sensitive adhesive composition and methods for the preparation and use thereof
TWI877282B (zh) 2019-12-27 2025-03-21 日商陶氏東麗股份有限公司 硬化性熱熔聚矽氧組成物、其硬化物、及含有上述組成物或硬化物之積層體
CN113474437B (zh) 2020-01-15 2022-10-28 美国陶氏有机硅公司 有机硅压敏粘合剂组合物及其制备方法和用途
EP4153656A1 (en) 2020-05-19 2023-03-29 Dow Silicones Corporation Silicone adhesive composition and methods for its preparation and use for electronic device fabrication
US12503631B2 (en) 2020-05-27 2025-12-23 Dow Global Technologies Llc Curable silicone pressure sensitive adhesive emulsion and method for its preparation
US20230137279A1 (en) 2020-06-22 2023-05-04 Dow Silicones Corporation Low intensity radiation curable silicone release coating composition and method for its preparation and use
KR102184968B1 (ko) 2020-07-21 2020-12-02 (주)명신기연 반응성 열용융 접착제의 제조방법 및 이에 의해 제조된 접착제
CN116261565A (zh) 2020-10-13 2023-06-13 美国陶氏有机硅公司 具有醛官能团的有机硅化合物的制备
CN112592690B (zh) * 2020-12-30 2022-03-22 长盈新材料(烟台)有限公司 一种正硅酸乙酯粘结剂制备方法
US12624264B2 (en) 2021-02-09 2026-05-12 Dow Silicones Corporation Solventless pressure sensitive adhesive composition
JP2024515526A (ja) 2021-04-09 2024-04-10 ダウ シリコーンズ コーポレーション 感圧接着剤組成物及びその調製方法及びフレキシブル有機発光ダイオードにおける使用
EP4330341A4 (en) 2021-04-27 2025-01-22 Dow Silicones Corporation Radical cured silicone pressure sensitive adhesive and composition and method for its preparation and use in flexible display device
WO2022226797A1 (en) 2021-04-27 2022-11-03 Dow Silicones Corporation Hydrosilylation reaction cured silicone pressure sensitive adhesive, composition and method for its preparation, and use in flexible display device
WO2022246681A1 (en) 2021-05-26 2022-12-01 Dow Silicones Corporation Silicone pressure sensitive adhesive composition containing a fluorosilicone additive and methods for the preparation and use thereof
US12384948B2 (en) 2021-06-16 2025-08-12 Dow Silicones Corporation Silicone pressure sensitive adhesive composition containing a fluoro-containing polyorganohydrogensiloxane crosslinker and methods for the preparation and use of said composition
WO2022261853A1 (en) 2021-06-16 2022-12-22 Dow Silicones Corporation Silicone pressure sensitive adhesive composition containing a polyfluoropolyether silane additive and methods for the preparation and use of said composition
CN117480229A (zh) 2021-07-08 2024-01-30 美国陶氏有机硅公司 含有氰酸酯官能化硅烷添加剂的有机硅压敏粘合剂组合物及其制备方法和所述组合物的用途
KR20240074835A (ko) 2021-10-06 2024-05-28 다우 글로벌 테크놀로지스 엘엘씨 아미노-작용성 유기규소 화합물의 제조
CN118019747A (zh) 2021-10-06 2024-05-10 陶氏环球技术有限责任公司 丙基亚胺官能化有机硅化合物和伯氨基丙基官能化有机硅化合物的制备
JP2024536286A (ja) 2021-10-06 2024-10-04 ダウ グローバル テクノロジーズ エルエルシー プロピルイミン官能性有機ケイ素化合物及び一級アミノプロピル官能性有機ケイ素化合物の調製
US12454125B2 (en) 2021-11-01 2025-10-28 Dow Silicones Corporation Method for preparation of a laminate article including a silicone pressure sensitive adhesive adhered to silicone rubber
US20240424527A1 (en) * 2021-11-10 2024-12-26 Dow Silicones Corporation Silicone compositions and their applications
US20250122229A1 (en) 2021-11-22 2025-04-17 Dow Silicones Corporation Preparation of organosilicon compounds with carbinol functionality
US20250051524A1 (en) 2022-03-21 2025-02-13 Dow Silicones Corporation Preparation of organosilicon compounds with carboxy functionality
KR20240026214A (ko) 2022-03-30 2024-02-27 다우 실리콘즈 코포레이션 실리콘 감압성 접착제용 경화성 조성물
US20250215162A1 (en) 2022-04-13 2025-07-03 Dow Global Technologies Llc Preparation of polyether-functional organosilicon compounds
JP2025514660A (ja) 2022-04-13 2025-05-09 ダウ グローバル テクノロジーズ エルエルシー ビニルエステル官能性を有する有機ケイ素化合物の調製
CN119923443A (zh) * 2022-09-28 2025-05-02 美国陶氏有机硅公司 密封剂组合物
WO2025010126A1 (en) 2023-07-06 2025-01-09 Dow Silicones Corporation Silicone - polyether copolymer for use in foam control formulations
WO2025029496A1 (en) 2023-08-01 2025-02-06 Dow Global Technologies Llc Radiation curable siloxane compositions and methods for their preparation and use
CN121605144A (zh) 2023-08-14 2026-03-03 陶氏环球技术有限责任公司 乙烯基官能化聚有机硅氧烷的钴催化的加氢甲酰化

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0628617A2 (en) * 1993-06-11 1994-12-14 Dow Corning Corporation Moisture-curable hot melt silicone pressure-sensitivie adhesives

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2676182A (en) 1950-09-13 1954-04-20 Dow Corning Copolymeric siloxanes and methods of preparing them
US4611042A (en) * 1985-10-03 1986-09-09 Dow Corning Corporation Resinous copolymeric siloxanes containing alkenyldimethylsiloxanes
GB8615862D0 (en) * 1986-06-28 1986-08-06 Dow Corning Ltd Making siloxane resins
US5340887A (en) * 1993-06-11 1994-08-23 Dow Corning Corporation Oxime-functional moisture-curable hot melt silicone pressure-sensitive adhesives
US5561203A (en) * 1994-06-20 1996-10-01 Dow Corning Corporation Silicone pressure sensitive adhesive composition
US5508360A (en) * 1995-03-31 1996-04-16 Dow Corning Corporation Moisture-curable hot melt silicone pressure-sensitive adhesives
US6433055B1 (en) * 2000-09-13 2002-08-13 Dow Corning Corporation Electrically conductive hot-melt silicone adhesive composition
JP2003213838A (ja) * 2002-01-17 2003-07-30 Achilles Corp 接合発泡成形板およびこれを用いたサンドイッチ構造板
JP2006503958A (ja) * 2002-10-22 2006-02-02 ダウ・コーニング・コーポレイション ホットメルト接着剤組成物を製造するための連続プロセス
WO2009091463A1 (en) * 2008-01-18 2009-07-23 Dow Corning Corporation Hot melt adhesive composition and methods for its preparation and use

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0628617A2 (en) * 1993-06-11 1994-12-14 Dow Corning Corporation Moisture-curable hot melt silicone pressure-sensitivie adhesives

Also Published As

Publication number Publication date
WO2010008749A1 (en) 2010-01-21
KR20110022070A (ko) 2011-03-04
US20110104506A1 (en) 2011-05-05
CA2727081C (en) 2016-07-26
EP2291482A1 (en) 2011-03-09
MX2010013887A (es) 2011-02-15
AU2009271424B2 (en) 2014-05-08
CA2727081A1 (en) 2010-01-21
JP2011525444A (ja) 2011-09-22
US8580073B2 (en) 2013-11-12
KR101624522B1 (ko) 2016-05-26
JP5620373B2 (ja) 2014-11-05
CN102076807A (zh) 2011-05-25
AU2009271424A1 (en) 2010-01-21

Similar Documents

Publication Publication Date Title
JP5620373B2 (ja) ホットメルト接着剤組成物並びにそれらの製造及び使用のための方法
CN105008432B (zh) 包含烷氧基官能化硅氧烷反应性树脂的湿固化热熔有机硅粘合剂组合物
KR20050061554A (ko) 열용융 접착제 조성물의 연속제조방법
CN105229056B (zh) 有机硅氧烷组合物和涂层、制成品、方法及用途
KR100304994B1 (ko) 유리및금속에접착되는실리콘고무
US5281455A (en) Laminate article comprising moisture-curable silicone pressure sensitive adhesive and release liner
JP5130995B2 (ja) 無溶剤型シリコーン粘着剤組成物
JP3602202B2 (ja) 水分硬化性のシリコーンホットメルト感圧接着剤組成物
KR101682053B1 (ko) 건축용 막 어플리케이션에 사용하기 위한 발포가능한 접착제 조성물
JP3625491B2 (ja) 溶融した湿分反応性オルガノシロキサン組成物を用いた支持体の接着方法
JP4043532B2 (ja) 溶融オルガノシロキサン組成物を用いた塗布方法
CN107873042A (zh) 有机硅压敏粘合剂组合物和包含其的保护膜
KR20100096159A (ko) 실리콘계 감압 접착제 조성물, 감압 접착 시트 및 실리콘 고무 적층체
EP2300515A1 (en) Release modifier and release coating organopolysiloxane composition
JPH08209068A (ja) 硬化可能なコーティング組成物
JP2021500417A (ja) 感圧接着剤組成物およびその調製方法ならびにフレキシブル有機発光ダイオード用途での使用
JPH08325552A (ja) 湿分硬化性シリコーン感圧接着剤組成物
WO2009091463A1 (en) Hot melt adhesive composition and methods for its preparation and use
FI94059C (fi) Silloittuvien paineherkkien liimojen välituotekoostumukset, jotka sisältävät nestemäistä kopolymeeristä organopolysiloksaania
JPS63355A (ja) メンブレンキ−ボ−ド用ポリオルガノシロキサン組成物
WO2023076871A1 (en) Method for preparation of a laminate article including a silicone pressure sensitive adhesive adhered to silicone rubber

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: michigan

Patentee after: Dow organosilicon company

Address before: Michigan

Patentee before: Dow Corning Corporation