KR101624522B1 - 열 용융 접착제 조성물, 이의 제조방법 및 용도 - Google Patents
열 용융 접착제 조성물, 이의 제조방법 및 용도 Download PDFInfo
- Publication number
- KR101624522B1 KR101624522B1 KR1020117001577A KR20117001577A KR101624522B1 KR 101624522 B1 KR101624522 B1 KR 101624522B1 KR 1020117001577 A KR1020117001577 A KR 1020117001577A KR 20117001577 A KR20117001577 A KR 20117001577A KR 101624522 B1 KR101624522 B1 KR 101624522B1
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- KR
- South Korea
- Prior art keywords
- hot melt
- melt adhesive
- adhesive composition
- substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/10—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an adhesive surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
- B32B2037/1215—Hot-melt adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
- B32B2037/1215—Hot-melt adhesive
- B32B2037/1223—Hot-melt adhesive film-shaped
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
- C08G2170/20—Compositions for hot melt adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/28—Non-macromolecular organic substances
- C08L2666/44—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/28—Non-macromolecular organic substances
- C08L2666/52—Metal-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7503008P | 2008-06-24 | 2008-06-24 | |
| US61/075,030 | 2008-06-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20110022070A KR20110022070A (ko) | 2011-03-04 |
| KR101624522B1 true KR101624522B1 (ko) | 2016-05-26 |
Family
ID=41009873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117001577A Active KR101624522B1 (ko) | 2008-06-24 | 2009-06-18 | 열 용융 접착제 조성물, 이의 제조방법 및 용도 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US8580073B2 (enExample) |
| EP (1) | EP2291482A1 (enExample) |
| JP (1) | JP5620373B2 (enExample) |
| KR (1) | KR101624522B1 (enExample) |
| CN (1) | CN102076807B (enExample) |
| AU (1) | AU2009271424B2 (enExample) |
| CA (1) | CA2727081C (enExample) |
| MX (1) | MX2010013887A (enExample) |
| WO (1) | WO2010008749A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102184968B1 (ko) | 2020-07-21 | 2020-12-02 | (주)명신기연 | 반응성 열용융 접착제의 제조방법 및 이에 의해 제조된 접착제 |
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| MX340091B (es) * | 2009-06-04 | 2016-06-27 | Dow Corning Corp * | Composición adhesiva aplicable mediante una pistola para uso en membranas de construcción. |
| US9593209B2 (en) | 2009-10-22 | 2017-03-14 | Dow Corning Corporation | Process for preparing clustered functional polyorganosiloxanes, and methods for their use |
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| CN105189685B (zh) | 2013-02-11 | 2017-08-08 | 道康宁公司 | 用于形成导热热自由基固化有机硅组合物的方法 |
| WO2014124388A1 (en) | 2013-02-11 | 2014-08-14 | Dow Corning Corporation | Alkoxy-functional organopolysiloxane resin and polymer and related methods for forming same |
| US9718925B2 (en) | 2013-02-11 | 2017-08-01 | Dow Corning Corporation | Curable silicone compositions comprising clustered functional polyorganosiloxanes and silicone reactive diluents |
| EP2954022B1 (en) | 2013-02-11 | 2019-05-01 | Dow Silicones Corporation | Clustered functional polyorganosiloxanes, processes for forming same and methods for their use |
| ES2895424T3 (es) * | 2013-02-11 | 2022-02-21 | Dow Silicones Corp | Composiciones adhesivas de silicona termofusibles curables por humedad que incluyen una resina reactiva de siloxano con grupos alcoxi funcionales |
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| KR20240026214A (ko) | 2022-03-30 | 2024-02-27 | 다우 실리콘즈 코포레이션 | 실리콘 감압성 접착제용 경화성 조성물 |
| US20250215162A1 (en) | 2022-04-13 | 2025-07-03 | Dow Global Technologies Llc | Preparation of polyether-functional organosilicon compounds |
| JP2025514660A (ja) | 2022-04-13 | 2025-05-09 | ダウ グローバル テクノロジーズ エルエルシー | ビニルエステル官能性を有する有機ケイ素化合物の調製 |
| CN119923443A (zh) * | 2022-09-28 | 2025-05-02 | 美国陶氏有机硅公司 | 密封剂组合物 |
| WO2025010126A1 (en) | 2023-07-06 | 2025-01-09 | Dow Silicones Corporation | Silicone - polyether copolymer for use in foam control formulations |
| WO2025029496A1 (en) | 2023-08-01 | 2025-02-06 | Dow Global Technologies Llc | Radiation curable siloxane compositions and methods for their preparation and use |
| CN121605144A (zh) | 2023-08-14 | 2026-03-03 | 陶氏环球技术有限责任公司 | 乙烯基官能化聚有机硅氧烷的钴催化的加氢甲酰化 |
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| US2676182A (en) | 1950-09-13 | 1954-04-20 | Dow Corning | Copolymeric siloxanes and methods of preparing them |
| US4611042A (en) * | 1985-10-03 | 1986-09-09 | Dow Corning Corporation | Resinous copolymeric siloxanes containing alkenyldimethylsiloxanes |
| GB8615862D0 (en) * | 1986-06-28 | 1986-08-06 | Dow Corning Ltd | Making siloxane resins |
| US5905123A (en) * | 1993-06-11 | 1999-05-18 | Dow Corning Corporation | Moisture-curable hot melt silicone pressure-sensitive adhesives |
| US5340887A (en) * | 1993-06-11 | 1994-08-23 | Dow Corning Corporation | Oxime-functional moisture-curable hot melt silicone pressure-sensitive adhesives |
| US5561203A (en) * | 1994-06-20 | 1996-10-01 | Dow Corning Corporation | Silicone pressure sensitive adhesive composition |
| US5508360A (en) * | 1995-03-31 | 1996-04-16 | Dow Corning Corporation | Moisture-curable hot melt silicone pressure-sensitive adhesives |
| US6433055B1 (en) * | 2000-09-13 | 2002-08-13 | Dow Corning Corporation | Electrically conductive hot-melt silicone adhesive composition |
| JP2003213838A (ja) * | 2002-01-17 | 2003-07-30 | Achilles Corp | 接合発泡成形板およびこれを用いたサンドイッチ構造板 |
| JP2006503958A (ja) * | 2002-10-22 | 2006-02-02 | ダウ・コーニング・コーポレイション | ホットメルト接着剤組成物を製造するための連続プロセス |
| WO2009091463A1 (en) * | 2008-01-18 | 2009-07-23 | Dow Corning Corporation | Hot melt adhesive composition and methods for its preparation and use |
-
2009
- 2009-06-18 MX MX2010013887A patent/MX2010013887A/es active IP Right Grant
- 2009-06-18 CA CA2727081A patent/CA2727081C/en active Active
- 2009-06-18 AU AU2009271424A patent/AU2009271424B2/en active Active
- 2009-06-18 EP EP09789841A patent/EP2291482A1/en not_active Ceased
- 2009-06-18 WO PCT/US2009/047721 patent/WO2010008749A1/en not_active Ceased
- 2009-06-18 US US13/000,751 patent/US8580073B2/en active Active
- 2009-06-18 CN CN200980123821.1A patent/CN102076807B/zh active Active
- 2009-06-18 JP JP2011516458A patent/JP5620373B2/ja active Active
- 2009-06-18 KR KR1020117001577A patent/KR101624522B1/ko active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102184968B1 (ko) | 2020-07-21 | 2020-12-02 | (주)명신기연 | 반응성 열용융 접착제의 제조방법 및 이에 의해 제조된 접착제 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010008749A1 (en) | 2010-01-21 |
| KR20110022070A (ko) | 2011-03-04 |
| US20110104506A1 (en) | 2011-05-05 |
| CA2727081C (en) | 2016-07-26 |
| EP2291482A1 (en) | 2011-03-09 |
| MX2010013887A (es) | 2011-02-15 |
| AU2009271424B2 (en) | 2014-05-08 |
| CA2727081A1 (en) | 2010-01-21 |
| JP2011525444A (ja) | 2011-09-22 |
| US8580073B2 (en) | 2013-11-12 |
| JP5620373B2 (ja) | 2014-11-05 |
| CN102076807A (zh) | 2011-05-25 |
| AU2009271424A1 (en) | 2010-01-21 |
| CN102076807B (zh) | 2014-09-17 |
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