CN102024727B - 加载器 - Google Patents

加载器 Download PDF

Info

Publication number
CN102024727B
CN102024727B CN2010102875090A CN201010287509A CN102024727B CN 102024727 B CN102024727 B CN 102024727B CN 2010102875090 A CN2010102875090 A CN 2010102875090A CN 201010287509 A CN201010287509 A CN 201010287509A CN 102024727 B CN102024727 B CN 102024727B
Authority
CN
China
Prior art keywords
wafer
carrier
loader
wafers
moving body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2010102875090A
Other languages
English (en)
Chinese (zh)
Other versions
CN102024727A (zh
Inventor
长坂旨俊
小笠原郁男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN102024727A publication Critical patent/CN102024727A/zh
Application granted granted Critical
Publication of CN102024727B publication Critical patent/CN102024727B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN2010102875090A 2009-09-21 2010-09-17 加载器 Active CN102024727B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009218244A JP5384270B2 (ja) 2009-09-21 2009-09-21 ローダ
JP2009-218244 2009-09-21

Publications (2)

Publication Number Publication Date
CN102024727A CN102024727A (zh) 2011-04-20
CN102024727B true CN102024727B (zh) 2013-04-17

Family

ID=43865868

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010102875090A Active CN102024727B (zh) 2009-09-21 2010-09-17 加载器

Country Status (4)

Country Link
JP (1) JP5384270B2 (https=)
KR (1) KR101250135B1 (https=)
CN (1) CN102024727B (https=)
TW (1) TWI487054B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101923531B1 (ko) 2011-12-23 2018-11-30 삼성전자주식회사 반도체 칩 본딩 장치
JP6689539B2 (ja) * 2016-08-12 2020-04-28 株式会社ディスコ 判定装置
JP7082274B2 (ja) * 2017-11-06 2022-06-08 シンフォニアテクノロジー株式会社 ロードポート、及びロードポートにおけるマッピング処理方法
JP7184620B2 (ja) * 2018-12-11 2022-12-06 株式会社ディスコ 切削装置
JP7493878B2 (ja) * 2020-07-08 2024-06-03 株式会社ディスコ テープ貼着装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1328777C (zh) * 2002-05-29 2007-07-25 东京毅力科创株式会社 探测片搬送装置及被接合体移动机构
CN100397091C (zh) * 2002-08-07 2008-06-25 东京毅力科创株式会社 装载台驱动装置与探查方法
CN101276771A (zh) * 2007-03-29 2008-10-01 东京毅力科创株式会社 被检查体的搬送装置和检查装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1064972A (ja) * 1996-08-14 1998-03-06 Miyazaki Oki Electric Co Ltd ウエハ搬送装置
JP4091380B2 (ja) * 2002-08-29 2008-05-28 東京エレクトロン株式会社 被処理体基板を収容した複数種類のカセットに対応可能なロードポート
JP2006120766A (ja) * 2004-10-20 2006-05-11 Olympus Corp ウェハ搬送装置及びカセット設置用アダプタ
JP2009170726A (ja) * 2008-01-17 2009-07-30 Rorze Corp ロードポートおよびカセット位置調整方法
JP5381118B2 (ja) * 2009-01-21 2014-01-08 東京エレクトロン株式会社 プローブ装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1328777C (zh) * 2002-05-29 2007-07-25 东京毅力科创株式会社 探测片搬送装置及被接合体移动机构
CN100397091C (zh) * 2002-08-07 2008-06-25 东京毅力科创株式会社 装载台驱动装置与探查方法
CN101276771A (zh) * 2007-03-29 2008-10-01 东京毅力科创株式会社 被检查体的搬送装置和检查装置

Also Published As

Publication number Publication date
CN102024727A (zh) 2011-04-20
KR101250135B1 (ko) 2013-04-04
JP2011066368A (ja) 2011-03-31
JP5384270B2 (ja) 2014-01-08
TWI487054B (zh) 2015-06-01
TW201135862A (en) 2011-10-16
KR20110031884A (ko) 2011-03-29

Similar Documents

Publication Publication Date Title
CN104183521B (zh) 基板搬运机器人、基板搬运系统和基板配置状态的检测方法
KR100880462B1 (ko) 검사장치 및 검사방법
JP4740414B2 (ja) 基板搬送装置
CN102024727B (zh) 加载器
JP4166813B2 (ja) 検査装置及び検査方法
TWI517951B (zh) 機器人系統
CN106891226A (zh) 基板输送用移载机及移载方法、半导体器件制造装置、斜面研磨装置及研磨方法、存储介质
KR100909494B1 (ko) 처리장치
JP4146495B1 (ja) 処理装置
KR20170091526A (ko) 기판 주고받음 위치의 교시 방법 및 기판 처리 시스템
JP2015060988A (ja) 基板搬送装置
WO2018139244A1 (ja) アライメント装置
JPH11284059A (ja) 半導体ウェハ把持装置
WO2022097754A1 (ja) 産業用ロボット
TWI493644B (zh) Built-in adjustment unit type loading room
JP2008311391A (ja) ウエハ供給機能を有するウエハ位置合わせ装置
CN1790168A (zh) 模版处理系统
KR20150006512A (ko) 디스플레이 셀들을 검사하기 위한 장치
JP2016134527A (ja) 移載装置および移載方法
JP2016192484A (ja) プローバ
CN223566598U (zh) 晶圆巡边装置及检测设备
CN105415158B (zh) 中框抛光生产线系统
KR102837595B1 (ko) 반송 시스템
JP2012156422A (ja) 板状部材の支持装置
JPH10321706A (ja) キャリア載置機構

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant