JP2011066368A - ローダ - Google Patents
ローダ Download PDFInfo
- Publication number
- JP2011066368A JP2011066368A JP2009218244A JP2009218244A JP2011066368A JP 2011066368 A JP2011066368 A JP 2011066368A JP 2009218244 A JP2009218244 A JP 2009218244A JP 2009218244 A JP2009218244 A JP 2009218244A JP 2011066368 A JP2011066368 A JP 2011066368A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- cassette
- loader
- dicing frame
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 235000012431 wafers Nutrition 0.000 claims abstract description 146
- 230000007246 mechanism Effects 0.000 claims abstract description 46
- 238000007689 inspection Methods 0.000 claims abstract description 13
- 230000007723 transport mechanism Effects 0.000 claims abstract 3
- 238000013507 mapping Methods 0.000 claims description 23
- 238000001514 detection method Methods 0.000 description 2
- 230000009191 jumping Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】本発明のローダ10は、複数のウエハWが収納された第1のカセットC1と複数のダイシングフレーム付きウエハDFWが収納された第2のカセットC2の双方を載置し得るロードポート12と、ウエハWとダイシングフレーム付きウエハDFWの双方を搬送し得るウエハ搬送機構14と、を備え、それぞれのウエハWの電気的特性検査を行う検査装置に用いられるローダ10であって、ロードポート12は、第1、第2のカセットC1、C2の双方を載置し得る移動体12Bと、第1のカセットC1が載置された時にのみ移動体12Bを初期位置からウエハ搬送機構14とのウエハWの受け渡し位置へ移動させる移動駆動機構12Cと、を有する。
【選択図】図1
Description
12 ロードポート
12B 移動体
12C 移動体駆動機構(駆動機構)
14 ウエハ搬送機構(搬送機構)
15 マッピングセンサ
W ウエハ
DFW ダイシングフレーム付きウエハ
Claims (4)
- 複数のウエハが収納された第1のカセットと複数のダイシングフレーム付きウエハが収納された第2のカセットの双方を載置し得るロードポートと、上記第1のカセット内のウエハと上記第2のカセット内のダイシングフレーム付きウエハの双方を搬送し得る搬送機構と、を備え、上記各ウエハの電気的特性検査を行う検査装置に用いられるローダであって、上記ロードポートは、上記第1、第2のカセットの双方を載置し得る移動体と、上記第1のカセットが載置された時に上記移動体を初期位置から上記搬送機構との上記ウエハの受け渡し位置へ移動させる駆動機構と、を有することを特徴とするローダ機構。
- 上記第2のカセットが上記移動体に載置された時には、上記移動体の初期位置が上記第2のカセット内のダイシングフレーム付きウエハの受け渡し位置になり、上記ダイシングフレーム付きウエハの受け渡し位置が上記ウエハの受け渡し位置と一致することを特徴とする請求項1に記載のローダ。
- 上記駆動機構は、シリンダ機構からなることを特徴とする請求項1または請求項2に記載のローダ。
- 上記受け渡し位置で上記第1のカセット内のウエハまたは上記第2のカセット内のダイシングフレーム付きウエハをマッピングするマッピングセンサを設けたことを特徴とする請求項1〜請求項3のいずれか1項に記載のローダ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009218244A JP5384270B2 (ja) | 2009-09-21 | 2009-09-21 | ローダ |
KR1020100089380A KR101250135B1 (ko) | 2009-09-21 | 2010-09-13 | 로더 |
CN2010102875090A CN102024727B (zh) | 2009-09-21 | 2010-09-17 | 加载器 |
TW099131854A TWI487054B (zh) | 2009-09-21 | 2010-09-20 | Loader |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009218244A JP5384270B2 (ja) | 2009-09-21 | 2009-09-21 | ローダ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011066368A true JP2011066368A (ja) | 2011-03-31 |
JP2011066368A5 JP2011066368A5 (ja) | 2012-09-13 |
JP5384270B2 JP5384270B2 (ja) | 2014-01-08 |
Family
ID=43865868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009218244A Active JP5384270B2 (ja) | 2009-09-21 | 2009-09-21 | ローダ |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5384270B2 (ja) |
KR (1) | KR101250135B1 (ja) |
CN (1) | CN102024727B (ja) |
TW (1) | TWI487054B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9704732B2 (en) | 2011-12-23 | 2017-07-11 | Samsung Electronics Co., Ltd. | Apparatuses for bonding semiconductor chips |
JP2018026486A (ja) * | 2016-08-12 | 2018-02-15 | 株式会社ディスコ | 判定装置 |
JP2019087598A (ja) * | 2017-11-06 | 2019-06-06 | シンフォニアテクノロジー株式会社 | ロードポート、及びロードポートにおけるマッピング処理方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7184620B2 (ja) * | 2018-12-11 | 2022-12-06 | 株式会社ディスコ | 切削装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004088017A (ja) * | 2002-08-29 | 2004-03-18 | Tokyo Electron Ltd | 被処理体基板を収容した複数種類のカセットに対応可能なロードポート |
JP2006120766A (ja) * | 2004-10-20 | 2006-05-11 | Olympus Corp | ウェハ搬送装置及びカセット設置用アダプタ |
JP2009170726A (ja) * | 2008-01-17 | 2009-07-30 | Rorze Corp | ロードポートおよびカセット位置調整方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1064972A (ja) * | 1996-08-14 | 1998-03-06 | Miyazaki Oki Electric Co Ltd | ウエハ搬送装置 |
JP4134289B2 (ja) * | 2002-05-29 | 2008-08-20 | 東京エレクトロン株式会社 | プローブカード搬送装置及びアダプタ |
JP4300003B2 (ja) * | 2002-08-07 | 2009-07-22 | 東京エレクトロン株式会社 | 載置台の駆動装置及びプローブ方法 |
JP4767896B2 (ja) * | 2007-03-29 | 2011-09-07 | 東京エレクトロン株式会社 | 被検査体の搬送装置及び検査装置 |
JP5381118B2 (ja) * | 2009-01-21 | 2014-01-08 | 東京エレクトロン株式会社 | プローブ装置 |
-
2009
- 2009-09-21 JP JP2009218244A patent/JP5384270B2/ja active Active
-
2010
- 2010-09-13 KR KR1020100089380A patent/KR101250135B1/ko active IP Right Grant
- 2010-09-17 CN CN2010102875090A patent/CN102024727B/zh active Active
- 2010-09-20 TW TW099131854A patent/TWI487054B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004088017A (ja) * | 2002-08-29 | 2004-03-18 | Tokyo Electron Ltd | 被処理体基板を収容した複数種類のカセットに対応可能なロードポート |
JP2006120766A (ja) * | 2004-10-20 | 2006-05-11 | Olympus Corp | ウェハ搬送装置及びカセット設置用アダプタ |
JP2009170726A (ja) * | 2008-01-17 | 2009-07-30 | Rorze Corp | ロードポートおよびカセット位置調整方法 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9704732B2 (en) | 2011-12-23 | 2017-07-11 | Samsung Electronics Co., Ltd. | Apparatuses for bonding semiconductor chips |
US10083846B2 (en) | 2011-12-23 | 2018-09-25 | Samsung Electronics Co., Ltd. | Apparatuses for bonding semiconductor chips |
US10629461B2 (en) | 2011-12-23 | 2020-04-21 | Samsung Electronics Co., Ltd. | Apparatuses for bonding semiconductor chips |
JP2018026486A (ja) * | 2016-08-12 | 2018-02-15 | 株式会社ディスコ | 判定装置 |
KR20180018362A (ko) * | 2016-08-12 | 2018-02-21 | 가부시기가이샤 디스코 | 판정 장치 |
KR102190336B1 (ko) | 2016-08-12 | 2020-12-11 | 가부시기가이샤 디스코 | 판정 장치 |
TWI724194B (zh) * | 2016-08-12 | 2021-04-11 | 日商迪思科股份有限公司 | 判定裝置 |
JP2019087598A (ja) * | 2017-11-06 | 2019-06-06 | シンフォニアテクノロジー株式会社 | ロードポート、及びロードポートにおけるマッピング処理方法 |
JP7082274B2 (ja) | 2017-11-06 | 2022-06-08 | シンフォニアテクノロジー株式会社 | ロードポート、及びロードポートにおけるマッピング処理方法 |
JP2022103434A (ja) * | 2017-11-06 | 2022-07-07 | シンフォニアテクノロジー株式会社 | マッピング方法、efem |
JP7385151B2 (ja) | 2017-11-06 | 2023-11-22 | シンフォニアテクノロジー株式会社 | マッピング方法、efem |
Also Published As
Publication number | Publication date |
---|---|
KR101250135B1 (ko) | 2013-04-04 |
JP5384270B2 (ja) | 2014-01-08 |
KR20110031884A (ko) | 2011-03-29 |
CN102024727B (zh) | 2013-04-17 |
TWI487054B (zh) | 2015-06-01 |
CN102024727A (zh) | 2011-04-20 |
TW201135862A (en) | 2011-10-16 |
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