KR101250135B1 - 로더 - Google Patents

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Publication number
KR101250135B1
KR101250135B1 KR1020100089380A KR20100089380A KR101250135B1 KR 101250135 B1 KR101250135 B1 KR 101250135B1 KR 1020100089380 A KR1020100089380 A KR 1020100089380A KR 20100089380 A KR20100089380 A KR 20100089380A KR 101250135 B1 KR101250135 B1 KR 101250135B1
Authority
KR
South Korea
Prior art keywords
wafer
cassette
loader
dicing frame
movable body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020100089380A
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English (en)
Korean (ko)
Other versions
KR20110031884A (ko
Inventor
무네토시 나가사카
이쿠오 오가사와라
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20110031884A publication Critical patent/KR20110031884A/ko
Application granted granted Critical
Publication of KR101250135B1 publication Critical patent/KR101250135B1/ko
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020100089380A 2009-09-21 2010-09-13 로더 Active KR101250135B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009218244A JP5384270B2 (ja) 2009-09-21 2009-09-21 ローダ
JPJP-P-2009-218244 2009-09-21

Publications (2)

Publication Number Publication Date
KR20110031884A KR20110031884A (ko) 2011-03-29
KR101250135B1 true KR101250135B1 (ko) 2013-04-04

Family

ID=43865868

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100089380A Active KR101250135B1 (ko) 2009-09-21 2010-09-13 로더

Country Status (4)

Country Link
JP (1) JP5384270B2 (https=)
KR (1) KR101250135B1 (https=)
CN (1) CN102024727B (https=)
TW (1) TWI487054B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101923531B1 (ko) 2011-12-23 2018-11-30 삼성전자주식회사 반도체 칩 본딩 장치
JP6689539B2 (ja) * 2016-08-12 2020-04-28 株式会社ディスコ 判定装置
JP7082274B2 (ja) * 2017-11-06 2022-06-08 シンフォニアテクノロジー株式会社 ロードポート、及びロードポートにおけるマッピング処理方法
JP7184620B2 (ja) * 2018-12-11 2022-12-06 株式会社ディスコ 切削装置
JP7493878B2 (ja) * 2020-07-08 2024-06-03 株式会社ディスコ テープ貼着装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1064972A (ja) * 1996-08-14 1998-03-06 Miyazaki Oki Electric Co Ltd ウエハ搬送装置
KR20100085877A (ko) * 2009-01-21 2010-07-29 도쿄엘렉트론가부시키가이샤 프로브 장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4134289B2 (ja) * 2002-05-29 2008-08-20 東京エレクトロン株式会社 プローブカード搬送装置及びアダプタ
JP4300003B2 (ja) * 2002-08-07 2009-07-22 東京エレクトロン株式会社 載置台の駆動装置及びプローブ方法
JP4091380B2 (ja) * 2002-08-29 2008-05-28 東京エレクトロン株式会社 被処理体基板を収容した複数種類のカセットに対応可能なロードポート
JP2006120766A (ja) * 2004-10-20 2006-05-11 Olympus Corp ウェハ搬送装置及びカセット設置用アダプタ
JP4767896B2 (ja) * 2007-03-29 2011-09-07 東京エレクトロン株式会社 被検査体の搬送装置及び検査装置
JP2009170726A (ja) * 2008-01-17 2009-07-30 Rorze Corp ロードポートおよびカセット位置調整方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1064972A (ja) * 1996-08-14 1998-03-06 Miyazaki Oki Electric Co Ltd ウエハ搬送装置
KR20100085877A (ko) * 2009-01-21 2010-07-29 도쿄엘렉트론가부시키가이샤 프로브 장치

Also Published As

Publication number Publication date
CN102024727A (zh) 2011-04-20
JP2011066368A (ja) 2011-03-31
CN102024727B (zh) 2013-04-17
JP5384270B2 (ja) 2014-01-08
TWI487054B (zh) 2015-06-01
TW201135862A (en) 2011-10-16
KR20110031884A (ko) 2011-03-29

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