WO2022097754A1 - 産業用ロボット - Google Patents
産業用ロボット Download PDFInfo
- Publication number
- WO2022097754A1 WO2022097754A1 PCT/JP2021/041102 JP2021041102W WO2022097754A1 WO 2022097754 A1 WO2022097754 A1 WO 2022097754A1 JP 2021041102 W JP2021041102 W JP 2021041102W WO 2022097754 A1 WO2022097754 A1 WO 2022097754A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hand
- wafer
- detection
- industrial robot
- detection mechanism
- Prior art date
Links
- 238000001514 detection method Methods 0.000 claims abstract description 78
- 230000007246 mechanism Effects 0.000 claims abstract description 69
- 230000003287 optical effect Effects 0.000 claims abstract description 12
- 235000012431 wafers Nutrition 0.000 description 112
- 239000004065 semiconductor Substances 0.000 description 13
- 230000005540 biological transmission Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/905—Control arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J13/00—Controls for manipulators
- B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0028—Gripping heads and other end effectors with movable, e.g. pivoting gripping jaw surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/08—Gripping heads and other end effectors having finger members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/02—Sensing devices
- B25J19/021—Optical sensing devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1679—Programme controls characterised by the tasks executed
- B25J9/1692—Calibration of manipulator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
Description
図1は、本発明の実施の形態にかかる産業用ロボット1の概略構成を説明するための平面図である。
図2は、図1に示すハンド11の平面図である。図3は、図2に示す検知機構22の構成を説明するための側面図である。
以上説明したように、本形態の検知機構22は、透過型の光学式センサである。そのため、本形態では、ウエハ2の表面の光の反射状態がばらついても、検知機構22によるウエハ2の検知精度が低下することはない。したがって、本形態では、ウエハ2の表面の光の反射状態がばらついても、検知機構22によるウエハ2の検知精度を確保することが可能になる。
上述した形態は、本発明の好適な形態の一例ではあるが、これに限定されるものではなく本発明の要旨を変更しない範囲において種々変形実施が可能である。
2 ウエハ(半導体ウエハ、搬送対象物)
11 ハンド
12 アーム(支持部材)
13 本体部
19 連結部
20 ウエハ搭載部(搭載部)
22 検知機構
23 発光部
24 受光部
Claims (3)
- 薄板状に形成される搬送対象物が搭載されるハンドと、前記ハンドを支持する支持部材とを備え、
前記ハンドは、前記ハンドの基端側部分を構成するとともに前記支持部材に連結される連結部と、前記ハンドの先端側部分を構成するとともに前記搬送対象物が搭載される搭載部と、前記搬送対象物を検知して前記ハンドの位置を補正するための複数の検知機構とを備え、
前記検知機構は、上下方向において隙間を介して対向配置される発光部と受光部とを有する透過型の光学式センサであり、前記搭載部の基端側に配置されていることを特徴とする産業用ロボット。 - 前記搬送対象物は、円板状に形成され、
前記ハンドは、3個以上の前記検知機構を備えることを特徴とする請求項1記載の産業用ロボット。 - 前記支持部材として、前記ハンドが先端側に回動可能に連結されるアームを備えるとともに、前記アームの基端側が回動可能に連結される本体部を備えることを特徴とする請求項1または2記載の産業用ロボット。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202180074487.6A CN116367976A (zh) | 2020-11-09 | 2021-11-09 | 工业用机器人 |
KR1020237014948A KR20230082037A (ko) | 2020-11-09 | 2021-11-09 | 산업용 로봇 |
US18/035,289 US20230416019A1 (en) | 2020-11-09 | 2021-11-09 | Industrial robot |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020186270A JP2022076061A (ja) | 2020-11-09 | 2020-11-09 | 産業用ロボット |
JP2020-186270 | 2020-11-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022097754A1 true WO2022097754A1 (ja) | 2022-05-12 |
Family
ID=81458315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2021/041102 WO2022097754A1 (ja) | 2020-11-09 | 2021-11-09 | 産業用ロボット |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230416019A1 (ja) |
JP (1) | JP2022076061A (ja) |
KR (1) | KR20230082037A (ja) |
CN (1) | CN116367976A (ja) |
WO (1) | WO2022097754A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10175734A (ja) * | 1996-12-18 | 1998-06-30 | Hitachi Ltd | 基板搬送機構 |
JP2001217303A (ja) * | 2000-02-02 | 2001-08-10 | Assist Japan Kk | ガラス基板の基板端検出装置 |
JP2002076097A (ja) * | 2000-08-30 | 2002-03-15 | Hirata Corp | ウェハ転送装置およびウェハアライメント方法 |
JP2006060135A (ja) * | 2004-08-23 | 2006-03-02 | Kawasaki Heavy Ind Ltd | 基板状態検出装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006272526A (ja) | 2005-03-30 | 2006-10-12 | Nidec Sankyo Corp | 搬送用ロボットのハンド及びそのハンドを有する搬送用ロボット |
-
2020
- 2020-11-09 JP JP2020186270A patent/JP2022076061A/ja active Pending
-
2021
- 2021-11-09 US US18/035,289 patent/US20230416019A1/en active Pending
- 2021-11-09 KR KR1020237014948A patent/KR20230082037A/ko unknown
- 2021-11-09 CN CN202180074487.6A patent/CN116367976A/zh active Pending
- 2021-11-09 WO PCT/JP2021/041102 patent/WO2022097754A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10175734A (ja) * | 1996-12-18 | 1998-06-30 | Hitachi Ltd | 基板搬送機構 |
JP2001217303A (ja) * | 2000-02-02 | 2001-08-10 | Assist Japan Kk | ガラス基板の基板端検出装置 |
JP2002076097A (ja) * | 2000-08-30 | 2002-03-15 | Hirata Corp | ウェハ転送装置およびウェハアライメント方法 |
JP2006060135A (ja) * | 2004-08-23 | 2006-03-02 | Kawasaki Heavy Ind Ltd | 基板状態検出装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2022076061A (ja) | 2022-05-19 |
US20230416019A1 (en) | 2023-12-28 |
KR20230082037A (ko) | 2023-06-08 |
CN116367976A (zh) | 2023-06-30 |
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