CN101992598B - 液体排出头以及用于制造液体排出头的方法 - Google Patents

液体排出头以及用于制造液体排出头的方法 Download PDF

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Publication number
CN101992598B
CN101992598B CN201010260865.3A CN201010260865A CN101992598B CN 101992598 B CN101992598 B CN 101992598B CN 201010260865 A CN201010260865 A CN 201010260865A CN 101992598 B CN101992598 B CN 101992598B
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China
Prior art keywords
flow path
substrate
cavity
wall member
path wall
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Chinese (zh)
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CN101992598A (zh
Inventor
藤井谦儿
浅井和宏
渡边诚
田川义则
今仲良行
田丸勇治
久保康祐
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Canon Inc
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Canon Inc
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1601Production of bubble jet print heads
    • B41J2/1603Production of bubble jet print heads of the front shooter type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1623Manufacturing processes bonding and adhesion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1631Manufacturing processes photolithography
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1632Manufacturing processes machining
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1635Manufacturing processes dividing the wafer into individual chips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1637Manufacturing processes molding
    • B41J2/1639Manufacturing processes molding sacrificial molding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1645Manufacturing processes thin film formation thin film formation by spincoating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/544Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54406Marks applied to semiconductor devices or parts comprising alphanumeric information
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54433Marks applied to semiconductor devices or parts containing identification or tracking information
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54473Marks applied to semiconductor devices or parts for use after dicing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49401Fluid pattern dispersing device making, e.g., ink jet

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
CN201010260865.3A 2009-08-25 2010-08-20 液体排出头以及用于制造液体排出头的方法 Active CN101992598B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-194455 2009-08-25
JP2009194455 2009-08-25

Publications (2)

Publication Number Publication Date
CN101992598A CN101992598A (zh) 2011-03-30
CN101992598B true CN101992598B (zh) 2014-05-07

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ID=43070447

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Country Status (7)

Country Link
US (1) US8342659B2 (enExample)
EP (1) EP2289700B1 (enExample)
JP (1) JP5679737B2 (enExample)
KR (1) KR101331318B1 (enExample)
CN (1) CN101992598B (enExample)
BR (1) BRPI1003190B1 (enExample)
RU (1) RU2427470C1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5393423B2 (ja) * 2009-12-10 2014-01-22 キヤノン株式会社 インク吐出ヘッド及びその製造方法
JP5791368B2 (ja) 2011-05-20 2015-10-07 キヤノン株式会社 インクジェット記録ヘッドの製造方法
JP6000715B2 (ja) 2011-09-29 2016-10-05 キヤノン株式会社 液体吐出ヘッドの製造方法
JP5955082B2 (ja) 2012-04-26 2016-07-20 キヤノン株式会社 記録ヘッド及びインクジェット記録装置
JP6929639B2 (ja) * 2016-01-08 2021-09-01 キヤノン株式会社 液体吐出ヘッド、液体吐出装置及び液体の供給方法
US10040290B2 (en) 2016-01-08 2018-08-07 Canon Kabushiki Kaisha Liquid ejection head, liquid ejection apparatus, and method of supplying liquid
EP4230506A1 (en) 2018-06-25 2023-08-23 Autotech Engineering, S.L. Method for manufacturing an unitary body side structural frame of a vehicle and corresponding unitary body side structural frame
JP2024049554A (ja) * 2022-09-29 2024-04-10 キヤノン株式会社 液体吐出ヘッドおよび記録装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1293343A2 (en) * 2001-09-12 2003-03-19 Canon Kabushiki Kaisha Liquid discharge recording head and method for manufacturing the same
EP1477316A1 (en) * 2002-02-19 2004-11-17 Brother Kogyo Kabushiki Kaisha Ink jet head and ink jet printer
JP2005181560A (ja) * 2003-12-18 2005-07-07 Nippon Hoso Kyokai <Nhk> 光導波路デバイス
JP2006082329A (ja) * 2004-09-15 2006-03-30 Canon Inc インクジェット記録ヘッドの製造方法
EP1844938A2 (en) * 2006-04-12 2007-10-17 Seiko Epson Corporation Liquid container

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235351A (en) * 1984-03-31 1993-08-10 Canon Kabushiki Kaisha Liquid ejection recording head including a symbol indicating information used for changing the operation of the head
JPH0574748A (ja) 1991-09-12 1993-03-26 Hitachi Ltd 来歴情報記録方式、及び半導体集積回路
JP3459703B2 (ja) * 1995-06-20 2003-10-27 キヤノン株式会社 インクジェットヘッドの製造方法、およびインクジェットヘッド
ATE475537T1 (de) * 1998-08-31 2010-08-15 Seiko Epson Corp Druckvorrichtung und druckkopfeinheit
JP3928681B2 (ja) * 1999-02-18 2007-06-13 富士ゼロックス株式会社 半導体装置およびその製造方法
US7171748B2 (en) * 2002-08-30 2007-02-06 Canon Kabushiki Kaisha Method of manufacturing a liquid jet recording head
JP2005111976A (ja) 2003-09-18 2005-04-28 Ricoh Co Ltd 消耗部品、部品装着構造、及び画像形成装置
JP4235820B2 (ja) * 2004-05-07 2009-03-11 ブラザー工業株式会社 インクジェット記録ヘッド、ヘッドユニット及びインクジェット記録ヘッドの製造方法
JP4194580B2 (ja) 2004-06-02 2008-12-10 キヤノン株式会社 ヘッド基板、記録ヘッド、ヘッドカートリッジ、及び記録装置
JP2006351772A (ja) * 2005-06-15 2006-12-28 Fujifilm Holdings Corp 半導体チップの識別情報記録方法及び撮像装置
FR2906646B1 (fr) 2006-10-03 2009-01-30 Microcomposants De Haute Secur Procede de marquage individuel de circuits integres et circuit integre marque selon ce procede.
US7571970B2 (en) * 2007-07-13 2009-08-11 Xerox Corporation Self-aligned precision datums for array die placement
JP2009274266A (ja) 2008-05-13 2009-11-26 Canon Inc 半導体チップ及び、インクジェット記録ヘッド

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1293343A2 (en) * 2001-09-12 2003-03-19 Canon Kabushiki Kaisha Liquid discharge recording head and method for manufacturing the same
EP1477316A1 (en) * 2002-02-19 2004-11-17 Brother Kogyo Kabushiki Kaisha Ink jet head and ink jet printer
JP2005181560A (ja) * 2003-12-18 2005-07-07 Nippon Hoso Kyokai <Nhk> 光導波路デバイス
JP2006082329A (ja) * 2004-09-15 2006-03-30 Canon Inc インクジェット記録ヘッドの製造方法
EP1844938A2 (en) * 2006-04-12 2007-10-17 Seiko Epson Corporation Liquid container

Also Published As

Publication number Publication date
RU2427470C1 (ru) 2011-08-27
JP5679737B2 (ja) 2015-03-04
BRPI1003190A2 (pt) 2012-05-02
BRPI1003190B1 (pt) 2019-11-05
US8342659B2 (en) 2013-01-01
KR101331318B1 (ko) 2013-11-20
CN101992598A (zh) 2011-03-30
EP2289700A8 (en) 2011-04-27
JP2011068129A (ja) 2011-04-07
EP2289700B1 (en) 2013-07-03
EP2289700A1 (en) 2011-03-02
US20110050828A1 (en) 2011-03-03
KR20110021659A (ko) 2011-03-04

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