BRPI1003190B1 - cabeça de descarga de líquido e método para fabricar a mesma - Google Patents

cabeça de descarga de líquido e método para fabricar a mesma Download PDF

Info

Publication number
BRPI1003190B1
BRPI1003190B1 BRPI1003190-1A BRPI1003190A BRPI1003190B1 BR PI1003190 B1 BRPI1003190 B1 BR PI1003190B1 BR PI1003190 A BRPI1003190 A BR PI1003190A BR PI1003190 B1 BRPI1003190 B1 BR PI1003190B1
Authority
BR
Brazil
Prior art keywords
flow path
substrate
liquid discharge
mold
discharge head
Prior art date
Application number
BRPI1003190-1A
Other languages
English (en)
Portuguese (pt)
Inventor
Kenji Fujii
Kazuhiro Asai
Makoto Watanabe
Yoshinori Tagawa
Yoshiyuki Imanaka
Yuuji Tamaru
Kousuke Kubo
Original Assignee
Canon Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kabushiki Kaisha filed Critical Canon Kabushiki Kaisha
Publication of BRPI1003190A2 publication Critical patent/BRPI1003190A2/pt
Publication of BRPI1003190B1 publication Critical patent/BRPI1003190B1/pt

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1601Production of bubble jet print heads
    • B41J2/1603Production of bubble jet print heads of the front shooter type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1623Manufacturing processes bonding and adhesion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1631Manufacturing processes photolithography
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1632Manufacturing processes machining
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1635Manufacturing processes dividing the wafer into individual chips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1637Manufacturing processes molding
    • B41J2/1639Manufacturing processes molding sacrificial molding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1645Manufacturing processes thin film formation thin film formation by spincoating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/544Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54406Marks applied to semiconductor devices or parts comprising alphanumeric information
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54433Marks applied to semiconductor devices or parts containing identification or tracking information
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54473Marks applied to semiconductor devices or parts for use after dicing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49401Fluid pattern dispersing device making, e.g., ink jet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
BRPI1003190-1A 2009-08-25 2010-08-23 cabeça de descarga de líquido e método para fabricar a mesma BRPI1003190B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-194455 2009-08-25
JP2009194455 2009-08-25

Publications (2)

Publication Number Publication Date
BRPI1003190A2 BRPI1003190A2 (pt) 2012-05-02
BRPI1003190B1 true BRPI1003190B1 (pt) 2019-11-05

Family

ID=43070447

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1003190-1A BRPI1003190B1 (pt) 2009-08-25 2010-08-23 cabeça de descarga de líquido e método para fabricar a mesma

Country Status (7)

Country Link
US (1) US8342659B2 (enExample)
EP (1) EP2289700B1 (enExample)
JP (1) JP5679737B2 (enExample)
KR (1) KR101331318B1 (enExample)
CN (1) CN101992598B (enExample)
BR (1) BRPI1003190B1 (enExample)
RU (1) RU2427470C1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5393423B2 (ja) * 2009-12-10 2014-01-22 キヤノン株式会社 インク吐出ヘッド及びその製造方法
JP5791368B2 (ja) 2011-05-20 2015-10-07 キヤノン株式会社 インクジェット記録ヘッドの製造方法
JP6000715B2 (ja) 2011-09-29 2016-10-05 キヤノン株式会社 液体吐出ヘッドの製造方法
JP5955082B2 (ja) 2012-04-26 2016-07-20 キヤノン株式会社 記録ヘッド及びインクジェット記録装置
JP6929639B2 (ja) 2016-01-08 2021-09-01 キヤノン株式会社 液体吐出ヘッド、液体吐出装置及び液体の供給方法
US10040290B2 (en) 2016-01-08 2018-08-07 Canon Kabushiki Kaisha Liquid ejection head, liquid ejection apparatus, and method of supplying liquid
EP3762278B1 (en) 2018-06-25 2021-10-27 Autotech Engineering S.L. A body side structural frame of a vehicle
JP2024049554A (ja) * 2022-09-29 2024-04-10 キヤノン株式会社 液体吐出ヘッドおよび記録装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235351A (en) * 1984-03-31 1993-08-10 Canon Kabushiki Kaisha Liquid ejection recording head including a symbol indicating information used for changing the operation of the head
JPH0574748A (ja) 1991-09-12 1993-03-26 Hitachi Ltd 来歴情報記録方式、及び半導体集積回路
JP3459703B2 (ja) * 1995-06-20 2003-10-27 キヤノン株式会社 インクジェットヘッドの製造方法、およびインクジェットヘッド
ATE475537T1 (de) * 1998-08-31 2010-08-15 Seiko Epson Corp Druckvorrichtung und druckkopfeinheit
JP3928681B2 (ja) * 1999-02-18 2007-06-13 富士ゼロックス株式会社 半導体装置およびその製造方法
JP4731763B2 (ja) 2001-09-12 2011-07-27 キヤノン株式会社 液体噴射記録ヘッドおよびその製造方法
WO2003070470A1 (en) 2002-02-19 2003-08-28 Brother Kogyo Kabushiki Kaisha Ink jet head and ink jet printer
US7171748B2 (en) * 2002-08-30 2007-02-06 Canon Kabushiki Kaisha Method of manufacturing a liquid jet recording head
JP2005111976A (ja) * 2003-09-18 2005-04-28 Ricoh Co Ltd 消耗部品、部品装着構造、及び画像形成装置
JP2005181560A (ja) 2003-12-18 2005-07-07 Nippon Hoso Kyokai <Nhk> 光導波路デバイス
JP4235820B2 (ja) * 2004-05-07 2009-03-11 ブラザー工業株式会社 インクジェット記録ヘッド、ヘッドユニット及びインクジェット記録ヘッドの製造方法
JP4194580B2 (ja) * 2004-06-02 2008-12-10 キヤノン株式会社 ヘッド基板、記録ヘッド、ヘッドカートリッジ、及び記録装置
JP2006082329A (ja) 2004-09-15 2006-03-30 Canon Inc インクジェット記録ヘッドの製造方法
JP2006351772A (ja) * 2005-06-15 2006-12-28 Fujifilm Holdings Corp 半導体チップの識別情報記録方法及び撮像装置
JP4341688B2 (ja) 2006-04-12 2009-10-07 セイコーエプソン株式会社 液体収容容器
FR2906646B1 (fr) 2006-10-03 2009-01-30 Microcomposants De Haute Secur Procede de marquage individuel de circuits integres et circuit integre marque selon ce procede.
US7571970B2 (en) * 2007-07-13 2009-08-11 Xerox Corporation Self-aligned precision datums for array die placement
JP2009274266A (ja) 2008-05-13 2009-11-26 Canon Inc 半導体チップ及び、インクジェット記録ヘッド

Also Published As

Publication number Publication date
JP2011068129A (ja) 2011-04-07
US8342659B2 (en) 2013-01-01
BRPI1003190A2 (pt) 2012-05-02
JP5679737B2 (ja) 2015-03-04
RU2427470C1 (ru) 2011-08-27
KR101331318B1 (ko) 2013-11-20
KR20110021659A (ko) 2011-03-04
EP2289700A1 (en) 2011-03-02
US20110050828A1 (en) 2011-03-03
EP2289700A8 (en) 2011-04-27
EP2289700B1 (en) 2013-07-03
CN101992598B (zh) 2014-05-07
CN101992598A (zh) 2011-03-30

Similar Documents

Publication Publication Date Title
BRPI1003190B1 (pt) cabeça de descarga de líquido e método para fabricar a mesma
ES2302134T3 (es) Boquilla de inyeccion de tinta con ranuras laterales y panel desplazable.
IT201600079679A1 (it) Scheda di misura di dispositivi elettronici
US10625506B2 (en) Method for manufacturing liquid discharge head
BRPI0407975B1 (pt) Ink cartridges, valve device, ink jet recording equipment and ink supply method
JP5202373B2 (ja) インクジェット記録ヘッド用基板、インクジェット記録ヘッド用基板の製造方法、インクジェット記録ヘッドおよびインクジェット記録装置
CN112997233A (zh) 介质
JP2011042167A (ja) シリコン基板の加工方法および液体吐出ヘッド用基板の製造方法
ES2343760T3 (es) Procedimiento, unidad de suministro de liquido y dispositivo de medicion para una indicacion de nivel de llenado.
JP7009225B2 (ja) 構造体の製造方法、液体吐出ヘッドの製造方法、保護部材、保護基板及び保護基板の製造方法
JP2017032315A (ja) 計器装置
US8408678B2 (en) Liquid ejection head and method for producing the same
CN115583108A (zh) 热敏打印头用发热基板及其制造方法和应用
JP2000243674A (ja) 半導体装置およびその製造方法、液体噴射記録ヘッド
CN219903811U (zh) 喷墨印刷装置
CN222354402U (zh) 基板及基板模组
TWI860603B (zh) 封蓋膜製法及其封蓋膜
JPH11342607A (ja) インクジェット式記録ヘッド、及びインクジェット式記録ヘッド用弾性板の製造方法
CN100501805C (zh) 排版线条检验方法
KR200407136Y1 (ko) 길이 및 각도 측정이 가능한 계측용 표면보호필름을 갖는 광학필름
TWI647098B (zh) Cover glass, display device with cover glass, and manufacturing method of cover glass
JP2000318167A (ja) インクジェット記録ヘッド及びその製造方法
JP2014172269A (ja) 液体吐出ヘッド
JPS61224421A (ja) パタ−ンの目合せ方法
SE465744B (sv) Sjaelvhaeftande etikett

Legal Events

Date Code Title Description
B03A Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette]
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 23/08/2010, OBSERVADAS AS CONDICOES LEGAIS.

B22E Other requirements [chapter 22.5 patent gazette]

Free format text: PARA QUE A PETICAO NO 870200052448 DE 27/04/2020, SEJA CONHECIDA, DEVERA SER APRESENTADO DOCUMENTO DE PROCURACAO OUTORGADO PELO DEPOSITANTE, NO ORIGINAL OU COPIA AUTENTICADA, DANDO-LHE PODERES PARA RENUNCIAR A PATENTE.

B22T Previous entry in chapter 22 of patent gazette cancelled [chapter 22.20 patent gazette]

Free format text: ANULADA A PUBLICACAO CODIGO 22.5 NA RPI NO 2582 DE 30/06/2020 POR TER SIDO INDEVIDA.

B22E Other requirements [chapter 22.5 patent gazette]

Free format text: PARA QUE A PETICAO NO 870200074004 DE 15/06/2020 SEJA CONHECIDA, DEVERA SER APRESENTADO DOCUMENTO DE PROCURACAO OUTORGADO PELO DEPOSITANTE, NO ORIGINAL OU COPIA AUTENTICADA, DANDO-LHE PODERES PARA RENUNCIAR A PATENTE.

B22B Petition not considered [chapter 22.2 patent gazette]

Free format text: NAO DEVE SER CONHECIDA A PETICAO NO 870200074004 DE 15/06/2020, EM VIRTUDE DO DISPOSTO NO ARTIGO 219 INCISO II DA LPI NO9.279/96, UMA VEZ QUE NAO TEVE SUA EXIGENCIA CUMPRIDA.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 11A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2634 DE 29-06-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.