BRPI1003190B1 - cabeça de descarga de líquido e método para fabricar a mesma - Google Patents
cabeça de descarga de líquido e método para fabricar a mesma Download PDFInfo
- Publication number
- BRPI1003190B1 BRPI1003190B1 BRPI1003190-1A BRPI1003190A BRPI1003190B1 BR PI1003190 B1 BRPI1003190 B1 BR PI1003190B1 BR PI1003190 A BRPI1003190 A BR PI1003190A BR PI1003190 B1 BRPI1003190 B1 BR PI1003190B1
- Authority
- BR
- Brazil
- Prior art keywords
- flow path
- substrate
- liquid discharge
- mold
- discharge head
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-194455 | 2009-08-25 | ||
| JP2009194455 | 2009-08-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| BRPI1003190A2 BRPI1003190A2 (pt) | 2012-05-02 |
| BRPI1003190B1 true BRPI1003190B1 (pt) | 2019-11-05 |
Family
ID=43070447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI1003190-1A BRPI1003190B1 (pt) | 2009-08-25 | 2010-08-23 | cabeça de descarga de líquido e método para fabricar a mesma |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8342659B2 (enExample) |
| EP (1) | EP2289700B1 (enExample) |
| JP (1) | JP5679737B2 (enExample) |
| KR (1) | KR101331318B1 (enExample) |
| CN (1) | CN101992598B (enExample) |
| BR (1) | BRPI1003190B1 (enExample) |
| RU (1) | RU2427470C1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5393423B2 (ja) * | 2009-12-10 | 2014-01-22 | キヤノン株式会社 | インク吐出ヘッド及びその製造方法 |
| JP5791368B2 (ja) | 2011-05-20 | 2015-10-07 | キヤノン株式会社 | インクジェット記録ヘッドの製造方法 |
| JP6000715B2 (ja) | 2011-09-29 | 2016-10-05 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
| JP5955082B2 (ja) | 2012-04-26 | 2016-07-20 | キヤノン株式会社 | 記録ヘッド及びインクジェット記録装置 |
| JP6929639B2 (ja) | 2016-01-08 | 2021-09-01 | キヤノン株式会社 | 液体吐出ヘッド、液体吐出装置及び液体の供給方法 |
| US10040290B2 (en) | 2016-01-08 | 2018-08-07 | Canon Kabushiki Kaisha | Liquid ejection head, liquid ejection apparatus, and method of supplying liquid |
| EP3762278B1 (en) | 2018-06-25 | 2021-10-27 | Autotech Engineering S.L. | A body side structural frame of a vehicle |
| JP2024049554A (ja) * | 2022-09-29 | 2024-04-10 | キヤノン株式会社 | 液体吐出ヘッドおよび記録装置 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5235351A (en) * | 1984-03-31 | 1993-08-10 | Canon Kabushiki Kaisha | Liquid ejection recording head including a symbol indicating information used for changing the operation of the head |
| JPH0574748A (ja) | 1991-09-12 | 1993-03-26 | Hitachi Ltd | 来歴情報記録方式、及び半導体集積回路 |
| JP3459703B2 (ja) * | 1995-06-20 | 2003-10-27 | キヤノン株式会社 | インクジェットヘッドの製造方法、およびインクジェットヘッド |
| ATE475537T1 (de) * | 1998-08-31 | 2010-08-15 | Seiko Epson Corp | Druckvorrichtung und druckkopfeinheit |
| JP3928681B2 (ja) * | 1999-02-18 | 2007-06-13 | 富士ゼロックス株式会社 | 半導体装置およびその製造方法 |
| JP4731763B2 (ja) | 2001-09-12 | 2011-07-27 | キヤノン株式会社 | 液体噴射記録ヘッドおよびその製造方法 |
| WO2003070470A1 (en) | 2002-02-19 | 2003-08-28 | Brother Kogyo Kabushiki Kaisha | Ink jet head and ink jet printer |
| US7171748B2 (en) * | 2002-08-30 | 2007-02-06 | Canon Kabushiki Kaisha | Method of manufacturing a liquid jet recording head |
| JP2005111976A (ja) * | 2003-09-18 | 2005-04-28 | Ricoh Co Ltd | 消耗部品、部品装着構造、及び画像形成装置 |
| JP2005181560A (ja) | 2003-12-18 | 2005-07-07 | Nippon Hoso Kyokai <Nhk> | 光導波路デバイス |
| JP4235820B2 (ja) * | 2004-05-07 | 2009-03-11 | ブラザー工業株式会社 | インクジェット記録ヘッド、ヘッドユニット及びインクジェット記録ヘッドの製造方法 |
| JP4194580B2 (ja) * | 2004-06-02 | 2008-12-10 | キヤノン株式会社 | ヘッド基板、記録ヘッド、ヘッドカートリッジ、及び記録装置 |
| JP2006082329A (ja) | 2004-09-15 | 2006-03-30 | Canon Inc | インクジェット記録ヘッドの製造方法 |
| JP2006351772A (ja) * | 2005-06-15 | 2006-12-28 | Fujifilm Holdings Corp | 半導体チップの識別情報記録方法及び撮像装置 |
| JP4341688B2 (ja) | 2006-04-12 | 2009-10-07 | セイコーエプソン株式会社 | 液体収容容器 |
| FR2906646B1 (fr) | 2006-10-03 | 2009-01-30 | Microcomposants De Haute Secur | Procede de marquage individuel de circuits integres et circuit integre marque selon ce procede. |
| US7571970B2 (en) * | 2007-07-13 | 2009-08-11 | Xerox Corporation | Self-aligned precision datums for array die placement |
| JP2009274266A (ja) | 2008-05-13 | 2009-11-26 | Canon Inc | 半導体チップ及び、インクジェット記録ヘッド |
-
2010
- 2010-08-06 US US12/851,704 patent/US8342659B2/en active Active
- 2010-08-17 KR KR1020100079246A patent/KR101331318B1/ko not_active Expired - Fee Related
- 2010-08-20 CN CN201010260865.3A patent/CN101992598B/zh active Active
- 2010-08-23 BR BRPI1003190-1A patent/BRPI1003190B1/pt not_active IP Right Cessation
- 2010-08-24 EP EP10008808.7A patent/EP2289700B1/en not_active Not-in-force
- 2010-08-24 RU RU2010135494/12A patent/RU2427470C1/ru not_active IP Right Cessation
- 2010-08-25 JP JP2010188487A patent/JP5679737B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011068129A (ja) | 2011-04-07 |
| US8342659B2 (en) | 2013-01-01 |
| BRPI1003190A2 (pt) | 2012-05-02 |
| JP5679737B2 (ja) | 2015-03-04 |
| RU2427470C1 (ru) | 2011-08-27 |
| KR101331318B1 (ko) | 2013-11-20 |
| KR20110021659A (ko) | 2011-03-04 |
| EP2289700A1 (en) | 2011-03-02 |
| US20110050828A1 (en) | 2011-03-03 |
| EP2289700A8 (en) | 2011-04-27 |
| EP2289700B1 (en) | 2013-07-03 |
| CN101992598B (zh) | 2014-05-07 |
| CN101992598A (zh) | 2011-03-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B03A | Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette] | ||
| B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
| B06T | Formal requirements before examination [chapter 6.20 patent gazette] | ||
| B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
| B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 23/08/2010, OBSERVADAS AS CONDICOES LEGAIS. |
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| B22E | Other requirements [chapter 22.5 patent gazette] |
Free format text: PARA QUE A PETICAO NO 870200052448 DE 27/04/2020, SEJA CONHECIDA, DEVERA SER APRESENTADO DOCUMENTO DE PROCURACAO OUTORGADO PELO DEPOSITANTE, NO ORIGINAL OU COPIA AUTENTICADA, DANDO-LHE PODERES PARA RENUNCIAR A PATENTE. |
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| B22T | Previous entry in chapter 22 of patent gazette cancelled [chapter 22.20 patent gazette] |
Free format text: ANULADA A PUBLICACAO CODIGO 22.5 NA RPI NO 2582 DE 30/06/2020 POR TER SIDO INDEVIDA. |
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| B22E | Other requirements [chapter 22.5 patent gazette] |
Free format text: PARA QUE A PETICAO NO 870200074004 DE 15/06/2020 SEJA CONHECIDA, DEVERA SER APRESENTADO DOCUMENTO DE PROCURACAO OUTORGADO PELO DEPOSITANTE, NO ORIGINAL OU COPIA AUTENTICADA, DANDO-LHE PODERES PARA RENUNCIAR A PATENTE. |
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Free format text: NAO DEVE SER CONHECIDA A PETICAO NO 870200074004 DE 15/06/2020, EM VIRTUDE DO DISPOSTO NO ARTIGO 219 INCISO II DA LPI NO9.279/96, UMA VEZ QUE NAO TEVE SUA EXIGENCIA CUMPRIDA. |
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| B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time |
Free format text: REFERENTE A 11A ANUIDADE. |
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| B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |
Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2634 DE 29-06-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |