KR101331318B1 - 액체 토출 헤드 및 그 제조 방법 - Google Patents

액체 토출 헤드 및 그 제조 방법 Download PDF

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Publication number
KR101331318B1
KR101331318B1 KR1020100079246A KR20100079246A KR101331318B1 KR 101331318 B1 KR101331318 B1 KR 101331318B1 KR 1020100079246 A KR1020100079246 A KR 1020100079246A KR 20100079246 A KR20100079246 A KR 20100079246A KR 101331318 B1 KR101331318 B1 KR 101331318B1
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South Korea
Prior art keywords
flow path
wall member
substrate
path wall
cavity
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Expired - Fee Related
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KR1020100079246A
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English (en)
Korean (ko)
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KR20110021659A (ko
Inventor
겐지 후지이
가즈히로 아사이
마꼬또 와따나베
요시노리 다가와
요시유끼 이마나까
유우지 다마루
고우스께 구보
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캐논 가부시끼가이샤
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Publication of KR20110021659A publication Critical patent/KR20110021659A/ko
Application granted granted Critical
Publication of KR101331318B1 publication Critical patent/KR101331318B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1635—Manufacturing processes dividing the wafer into individual chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B41J2/1639—Manufacturing processes molding sacrificial molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
KR1020100079246A 2009-08-25 2010-08-17 액체 토출 헤드 및 그 제조 방법 Expired - Fee Related KR101331318B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-194455 2009-08-25
JP2009194455 2009-08-25

Publications (2)

Publication Number Publication Date
KR20110021659A KR20110021659A (ko) 2011-03-04
KR101331318B1 true KR101331318B1 (ko) 2013-11-20

Family

ID=43070447

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100079246A Expired - Fee Related KR101331318B1 (ko) 2009-08-25 2010-08-17 액체 토출 헤드 및 그 제조 방법

Country Status (7)

Country Link
US (1) US8342659B2 (enExample)
EP (1) EP2289700B1 (enExample)
JP (1) JP5679737B2 (enExample)
KR (1) KR101331318B1 (enExample)
CN (1) CN101992598B (enExample)
BR (1) BRPI1003190B1 (enExample)
RU (1) RU2427470C1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5393423B2 (ja) * 2009-12-10 2014-01-22 キヤノン株式会社 インク吐出ヘッド及びその製造方法
JP5791368B2 (ja) 2011-05-20 2015-10-07 キヤノン株式会社 インクジェット記録ヘッドの製造方法
JP6000715B2 (ja) 2011-09-29 2016-10-05 キヤノン株式会社 液体吐出ヘッドの製造方法
JP5955082B2 (ja) 2012-04-26 2016-07-20 キヤノン株式会社 記録ヘッド及びインクジェット記録装置
JP6929639B2 (ja) * 2016-01-08 2021-09-01 キヤノン株式会社 液体吐出ヘッド、液体吐出装置及び液体の供給方法
US10040290B2 (en) 2016-01-08 2018-08-07 Canon Kabushiki Kaisha Liquid ejection head, liquid ejection apparatus, and method of supplying liquid
EP4230506A1 (en) 2018-06-25 2023-08-23 Autotech Engineering, S.L. Method for manufacturing an unitary body side structural frame of a vehicle and corresponding unitary body side structural frame
JP2024049554A (ja) * 2022-09-29 2024-04-10 キヤノン株式会社 液体吐出ヘッドおよび記録装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1477316A1 (en) * 2002-02-19 2004-11-17 Brother Kogyo Kabushiki Kaisha Ink jet head and ink jet printer
US20090014413A1 (en) 2007-07-13 2009-01-15 Xerox Corporation Self-aligned precision datums for array die placement
JP2009274266A (ja) 2008-05-13 2009-11-26 Canon Inc 半導体チップ及び、インクジェット記録ヘッド

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235351A (en) * 1984-03-31 1993-08-10 Canon Kabushiki Kaisha Liquid ejection recording head including a symbol indicating information used for changing the operation of the head
JPH0574748A (ja) 1991-09-12 1993-03-26 Hitachi Ltd 来歴情報記録方式、及び半導体集積回路
JP3459703B2 (ja) * 1995-06-20 2003-10-27 キヤノン株式会社 インクジェットヘッドの製造方法、およびインクジェットヘッド
ATE475537T1 (de) * 1998-08-31 2010-08-15 Seiko Epson Corp Druckvorrichtung und druckkopfeinheit
JP3928681B2 (ja) * 1999-02-18 2007-06-13 富士ゼロックス株式会社 半導体装置およびその製造方法
JP4731763B2 (ja) 2001-09-12 2011-07-27 キヤノン株式会社 液体噴射記録ヘッドおよびその製造方法
US7171748B2 (en) * 2002-08-30 2007-02-06 Canon Kabushiki Kaisha Method of manufacturing a liquid jet recording head
JP2005111976A (ja) 2003-09-18 2005-04-28 Ricoh Co Ltd 消耗部品、部品装着構造、及び画像形成装置
JP2005181560A (ja) 2003-12-18 2005-07-07 Nippon Hoso Kyokai <Nhk> 光導波路デバイス
JP4235820B2 (ja) * 2004-05-07 2009-03-11 ブラザー工業株式会社 インクジェット記録ヘッド、ヘッドユニット及びインクジェット記録ヘッドの製造方法
JP4194580B2 (ja) 2004-06-02 2008-12-10 キヤノン株式会社 ヘッド基板、記録ヘッド、ヘッドカートリッジ、及び記録装置
JP2006082329A (ja) 2004-09-15 2006-03-30 Canon Inc インクジェット記録ヘッドの製造方法
JP2006351772A (ja) * 2005-06-15 2006-12-28 Fujifilm Holdings Corp 半導体チップの識別情報記録方法及び撮像装置
JP4341688B2 (ja) 2006-04-12 2009-10-07 セイコーエプソン株式会社 液体収容容器
FR2906646B1 (fr) 2006-10-03 2009-01-30 Microcomposants De Haute Secur Procede de marquage individuel de circuits integres et circuit integre marque selon ce procede.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1477316A1 (en) * 2002-02-19 2004-11-17 Brother Kogyo Kabushiki Kaisha Ink jet head and ink jet printer
US20090014413A1 (en) 2007-07-13 2009-01-15 Xerox Corporation Self-aligned precision datums for array die placement
JP2009274266A (ja) 2008-05-13 2009-11-26 Canon Inc 半導体チップ及び、インクジェット記録ヘッド

Also Published As

Publication number Publication date
RU2427470C1 (ru) 2011-08-27
JP5679737B2 (ja) 2015-03-04
BRPI1003190A2 (pt) 2012-05-02
BRPI1003190B1 (pt) 2019-11-05
US8342659B2 (en) 2013-01-01
CN101992598B (zh) 2014-05-07
CN101992598A (zh) 2011-03-30
EP2289700A8 (en) 2011-04-27
JP2011068129A (ja) 2011-04-07
EP2289700B1 (en) 2013-07-03
EP2289700A1 (en) 2011-03-02
US20110050828A1 (en) 2011-03-03
KR20110021659A (ko) 2011-03-04

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