CN101960929A - 挠性基板用层叠体以及热传导性聚酰亚胺膜 - Google Patents
挠性基板用层叠体以及热传导性聚酰亚胺膜 Download PDFInfo
- Publication number
- CN101960929A CN101960929A CN2009801078941A CN200980107894A CN101960929A CN 101960929 A CN101960929 A CN 101960929A CN 2009801078941 A CN2009801078941 A CN 2009801078941A CN 200980107894 A CN200980107894 A CN 200980107894A CN 101960929 A CN101960929 A CN 101960929A
- Authority
- CN
- China
- Prior art keywords
- polyimide resin
- resin layer
- polyimide
- heat conductivity
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/12—Mixture of at least two particles made of different materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/582—Tearability
- B32B2307/5825—Tear resistant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008056321 | 2008-03-06 | ||
JP2008-056321 | 2008-03-06 | ||
PCT/JP2009/053724 WO2009110387A1 (ja) | 2008-03-06 | 2009-02-27 | フレキシブル基板用積層体及び熱伝導性ポリイミドフィルム |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101960929A true CN101960929A (zh) | 2011-01-26 |
CN101960929B CN101960929B (zh) | 2012-10-03 |
Family
ID=41055947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009801078941A Active CN101960929B (zh) | 2008-03-06 | 2009-02-27 | 挠性基板用层叠体以及热传导性聚酰亚胺膜 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5235211B2 (zh) |
KR (1) | KR101370559B1 (zh) |
CN (1) | CN101960929B (zh) |
TW (1) | TWI454375B (zh) |
WO (1) | WO2009110387A1 (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102951873A (zh) * | 2011-08-31 | 2013-03-06 | 深圳光启高等理工研究院 | 一种超材料介质基板材料及其制备方法 |
CN103732403A (zh) * | 2011-12-26 | 2014-04-16 | 三井化学株式会社 | 多层成型体及其制造方法以及电磁波屏蔽构件及散热性构件 |
KR20170066531A (ko) * | 2014-10-10 | 2017-06-14 | 닛산 가가쿠 고교 가부시키 가이샤 | 수지 박막 형성용 조성물 및 수지 박막 |
CN106928705A (zh) * | 2015-12-30 | 2017-07-07 | 广东生益科技股份有限公司 | 一种含填料的聚酰亚胺复合材料、片材以及含有它的电路基板 |
TWI593550B (zh) * | 2011-03-30 | 2017-08-01 | 宇部興產股份有限公司 | 聚醯亞胺膜及使用此聚醯亞胺膜之金屬疊層板 |
CN111630088A (zh) * | 2018-01-22 | 2020-09-04 | 韩国爱思开希可隆Pi股份有限公司 | 包含两种以上的填料的高导热性聚酰亚胺薄膜 |
CN114316792A (zh) * | 2020-09-30 | 2022-04-12 | 日铁化学材料株式会社 | 树脂组合物、树脂膜、层叠体、覆盖膜、带树脂的铜箔、覆金属层叠板及电路基板 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010201625A (ja) * | 2009-02-27 | 2010-09-16 | Nippon Steel Chem Co Ltd | フレキシブル基板用積層体及び熱伝導性ポリイミドフィルム |
JP5665846B2 (ja) * | 2010-03-10 | 2015-02-04 | 新日鉄住金化学株式会社 | 熱伝導性ポリイミドフィルム及びそれを用いた熱伝導性積層体 |
JP5643536B2 (ja) * | 2010-04-16 | 2014-12-17 | 三井化学株式会社 | 熱伝導性接着樹脂組成物、それを含む積層体および半導体装置 |
CN103261277B (zh) | 2010-12-17 | 2015-12-02 | 积水化学工业株式会社 | 聚酰胺酸粒子的制造方法、聚酰亚胺粒子的制造方法、聚酰亚胺粒子及电子部件用接合材料 |
KR101567645B1 (ko) | 2013-12-17 | 2015-11-23 | 현대자동차주식회사 | 연료 전지 시스템 및 그 운전 제어 방법 |
USRE49929E1 (en) | 2017-08-08 | 2024-04-16 | Sumitomo Electric Industries, Ltd. | Substrate for high-frequency printed wiring board |
KR102119752B1 (ko) * | 2018-10-02 | 2020-06-05 | 주식회사 이엠따블유 | 연성회로기판 모듈 및 이의 제조방법 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60243120A (ja) * | 1984-05-18 | 1985-12-03 | Hitachi Ltd | フレキシブルプリント基板の製造方法 |
JPH01245586A (ja) * | 1988-03-28 | 1989-09-29 | Nippon Steel Chem Co Ltd | フレキシブルプリント基板 |
US4937133A (en) * | 1988-03-28 | 1990-06-26 | Nippon Steel Chemical Co., Ltd. | Flexible base materials for printed circuits |
JP2001185853A (ja) | 1999-12-27 | 2001-07-06 | Matsushita Electric Ind Co Ltd | 回路基板用基材とそれを用いたプリント回路基板 |
JP4508441B2 (ja) * | 2001-02-16 | 2010-07-21 | 新日鐵化学株式会社 | 積層体及びその製造方法 |
US20060124693A1 (en) * | 2004-12-15 | 2006-06-15 | Meloni Paul A | Thermally conductive polyimide film composites having high mechanical elongation useful as a heat conducting portion of an electronic device |
JP4876396B2 (ja) * | 2005-01-05 | 2012-02-15 | 東洋紡績株式会社 | プリント配線板 |
JP2006274040A (ja) * | 2005-03-29 | 2006-10-12 | Du Pont Toray Co Ltd | ポリイミドフィルムおよびそれを用いたフレキシブル回路基板 |
JP4692139B2 (ja) | 2005-08-10 | 2011-06-01 | 宇部興産株式会社 | 片面或いは両面金属箔積層ポリイミドフィルム及びこれらの製造方法 |
JP2007055165A (ja) * | 2005-08-26 | 2007-03-08 | Shin Etsu Chem Co Ltd | フレキシブル銅張積層板及びその製造方法 |
WO2007037192A1 (ja) * | 2005-09-29 | 2007-04-05 | Kaneka Corporation | ポリイミド樹脂積層フィルム |
-
2009
- 2009-02-17 TW TW98104971A patent/TWI454375B/zh active
- 2009-02-27 CN CN2009801078941A patent/CN101960929B/zh active Active
- 2009-02-27 JP JP2010501876A patent/JP5235211B2/ja active Active
- 2009-02-27 WO PCT/JP2009/053724 patent/WO2009110387A1/ja active Application Filing
- 2009-02-27 KR KR1020107020640A patent/KR101370559B1/ko active IP Right Grant
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI593550B (zh) * | 2011-03-30 | 2017-08-01 | 宇部興產股份有限公司 | 聚醯亞胺膜及使用此聚醯亞胺膜之金屬疊層板 |
CN102951873A (zh) * | 2011-08-31 | 2013-03-06 | 深圳光启高等理工研究院 | 一种超材料介质基板材料及其制备方法 |
CN102951873B (zh) * | 2011-08-31 | 2015-07-15 | 深圳光启高等理工研究院 | 一种超材料介质基板材料及其制备方法 |
CN103732403B (zh) * | 2011-12-26 | 2015-12-02 | 三井化学株式会社 | 电磁波屏蔽构件 |
CN103732403A (zh) * | 2011-12-26 | 2014-04-16 | 三井化学株式会社 | 多层成型体及其制造方法以及电磁波屏蔽构件及散热性构件 |
KR20170066531A (ko) * | 2014-10-10 | 2017-06-14 | 닛산 가가쿠 고교 가부시키 가이샤 | 수지 박막 형성용 조성물 및 수지 박막 |
CN107109056A (zh) * | 2014-10-10 | 2017-08-29 | 日产化学工业株式会社 | 树脂薄膜形成用组合物及树脂薄膜 |
CN107109056B (zh) * | 2014-10-10 | 2019-09-03 | 日产化学工业株式会社 | 树脂薄膜形成用组合物及树脂薄膜 |
KR102362019B1 (ko) | 2014-10-10 | 2022-02-10 | 닛산 가가쿠 가부시키가이샤 | 수지 박막 형성용 조성물 및 수지 박막 |
CN106928705A (zh) * | 2015-12-30 | 2017-07-07 | 广东生益科技股份有限公司 | 一种含填料的聚酰亚胺复合材料、片材以及含有它的电路基板 |
CN111630088A (zh) * | 2018-01-22 | 2020-09-04 | 韩国爱思开希可隆Pi股份有限公司 | 包含两种以上的填料的高导热性聚酰亚胺薄膜 |
CN111630088B (zh) * | 2018-01-22 | 2023-02-17 | 聚酰亚胺先端材料有限公司 | 包含两种以上的填料的高导热性聚酰亚胺薄膜 |
CN114316792A (zh) * | 2020-09-30 | 2022-04-12 | 日铁化学材料株式会社 | 树脂组合物、树脂膜、层叠体、覆盖膜、带树脂的铜箔、覆金属层叠板及电路基板 |
Also Published As
Publication number | Publication date |
---|---|
CN101960929B (zh) | 2012-10-03 |
TW201000306A (en) | 2010-01-01 |
KR20100125324A (ko) | 2010-11-30 |
JPWO2009110387A1 (ja) | 2011-07-14 |
TWI454375B (zh) | 2014-10-01 |
WO2009110387A1 (ja) | 2009-09-11 |
KR101370559B1 (ko) | 2014-03-06 |
JP5235211B2 (ja) | 2013-07-10 |
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Owner name: NIPPON STEEL + SUMITOMO METAL CORPORATION Free format text: FORMER NAME: NIPPON SEEL CHEMICAL CO., LTD. |
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Address after: Tokyo, Japan Patentee after: Nippon Steel Chemical Co. Address before: Tokyo, Japan Patentee before: Nippon Seel Chemical Co., Ltd. |
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Effective date of registration: 20191211 Address after: No.13-1, No.1, No.1, No Patentee after: Nippon Iron Chemical Materials Co., Ltd. Address before: Tokyo, Japan Patentee before: Nippon Steel Chemical Co. |
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TR01 | Transfer of patent right |