CN100566503C - 线路板用积层体 - Google Patents
线路板用积层体 Download PDFInfo
- Publication number
- CN100566503C CN100566503C CNB200580005515XA CN200580005515A CN100566503C CN 100566503 C CN100566503 C CN 100566503C CN B200580005515X A CNB200580005515X A CN B200580005515XA CN 200580005515 A CN200580005515 A CN 200580005515A CN 100566503 C CN100566503 C CN 100566503C
- Authority
- CN
- China
- Prior art keywords
- polyimide resin
- resin layer
- laminate
- wiring board
- dianhydride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
Abstract
Description
实施例 | 积层体 | 层结构 | 粘接性(kN/m) | CTE(ppm/℃) |
2 | M1 | R/E/R | 1.4 | 17 |
3 | M2 | R/O/R | 1.5 | 16 |
4 | M3 | R/Q/R | 1.4 | 20 |
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004051167 | 2004-02-26 | ||
JP051167/2004 | 2004-02-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1943285A CN1943285A (zh) | 2007-04-04 |
CN100566503C true CN100566503C (zh) | 2009-12-02 |
Family
ID=34908624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200580005515XA Expired - Fee Related CN100566503C (zh) | 2004-02-26 | 2005-02-21 | 线路板用积层体 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4768606B2 (zh) |
KR (1) | KR101077405B1 (zh) |
CN (1) | CN100566503C (zh) |
TW (1) | TW200528490A (zh) |
WO (1) | WO2005084088A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4907142B2 (ja) * | 2005-10-13 | 2012-03-28 | 新日鐵化学株式会社 | 芳香族ポリアミド酸、ポリイミド及び配線基板用積層体 |
JP4962056B2 (ja) * | 2007-03-09 | 2012-06-27 | 東洋紡績株式会社 | 銅張り積層フィルム及びその製造方法 |
TWI422645B (zh) * | 2007-03-30 | 2014-01-11 | Nippon Steel & Sumikin Chem Co | 聚醯亞胺膜 |
JP6839594B2 (ja) * | 2016-04-27 | 2021-03-10 | 日鉄ケミカル&マテリアル株式会社 | ポリイミドフィルム及び銅張積層板 |
JP7248394B2 (ja) * | 2017-09-29 | 2023-03-29 | 日鉄ケミカル&マテリアル株式会社 | ポリイミドフィルム及び金属張積層体 |
CN110241389A (zh) * | 2018-03-08 | 2019-09-17 | 日铁化学材料株式会社 | 蒸镀掩模、蒸镀掩模形成用聚酰胺酸、蒸镀掩模形成用层叠体及蒸镀掩模的制造方法 |
CN109575831A (zh) * | 2018-11-20 | 2019-04-05 | 深圳市弘海电子材料技术有限公司 | 低反弹力覆盖膜及其制备方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60250031A (ja) * | 1984-05-28 | 1985-12-10 | Hitachi Ltd | 低熱膨張性樹脂材料 |
JPH06234916A (ja) * | 1993-02-09 | 1994-08-23 | Central Glass Co Ltd | 低応力ポリイミド組成物および前駆体組成物溶液 |
JP4094062B2 (ja) * | 1996-08-19 | 2008-06-04 | 新日鐵化学株式会社 | Hddサスペンション用積層体及びその製造方法 |
JP3794446B2 (ja) * | 1997-08-05 | 2006-07-05 | 株式会社カネカ | ハードディスクサスペンション配線基材用ポリイミドフィルム |
JP3704920B2 (ja) * | 1997-11-21 | 2005-10-12 | 宇部興産株式会社 | 磁気ヘッドサスペンションの製造方法 |
JP3486357B2 (ja) * | 1998-12-28 | 2004-01-13 | 日本電信電話株式会社 | 光学用ポリイミド基板 |
JP2002338710A (ja) * | 2001-03-16 | 2002-11-27 | Sumitomo Bakelite Co Ltd | 表示素子用プラスチック基板 |
-
2005
- 2005-02-21 KR KR1020067017525A patent/KR101077405B1/ko active IP Right Grant
- 2005-02-21 JP JP2006510413A patent/JP4768606B2/ja not_active Expired - Fee Related
- 2005-02-21 CN CNB200580005515XA patent/CN100566503C/zh not_active Expired - Fee Related
- 2005-02-21 WO PCT/JP2005/002729 patent/WO2005084088A1/ja active Application Filing
- 2005-02-24 TW TW094105641A patent/TW200528490A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR101077405B1 (ko) | 2011-10-26 |
CN1943285A (zh) | 2007-04-04 |
TW200528490A (en) | 2005-09-01 |
JP4768606B2 (ja) | 2011-09-07 |
JPWO2005084088A1 (ja) | 2008-01-17 |
TWI372156B (zh) | 2012-09-11 |
WO2005084088A1 (ja) | 2005-09-09 |
KR20070007296A (ko) | 2007-01-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: NIPPON STEEL + SUMITOMO METAL CORPORATION Free format text: FORMER NAME: NIPPON SEEL CHEMICAL CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: Nippon Steel Chemical Co. Address before: Tokyo, Japan Patentee before: Nippon Seel Chemical Co., Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191213 Address after: No.13-1, No.1, No.1, No Patentee after: Nippon Iron Chemical Materials Co., Ltd. Address before: Tokyo, Japan Patentee before: Nippon Steel Chemical Co. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091202 Termination date: 20210221 |