TWI372156B - - Google Patents

Info

Publication number
TWI372156B
TWI372156B TW094105641A TW94105641A TWI372156B TW I372156 B TWI372156 B TW I372156B TW 094105641 A TW094105641 A TW 094105641A TW 94105641 A TW94105641 A TW 94105641A TW I372156 B TWI372156 B TW I372156B
Authority
TW
Taiwan
Application number
TW094105641A
Other versions
TW200528490A (en
Inventor
Hongyuan Wang
Noriko Chikaraishi
Naoko Osawa
Hironobu Kawasato
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200528490A publication Critical patent/TW200528490A/zh
Application granted granted Critical
Publication of TWI372156B publication Critical patent/TWI372156B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
TW094105641A 2004-02-26 2005-02-24 Aminate for wiring board TW200528490A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004051167 2004-02-26

Publications (2)

Publication Number Publication Date
TW200528490A TW200528490A (en) 2005-09-01
TWI372156B true TWI372156B (zh) 2012-09-11

Family

ID=34908624

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094105641A TW200528490A (en) 2004-02-26 2005-02-24 Aminate for wiring board

Country Status (5)

Country Link
JP (1) JP4768606B2 (zh)
KR (1) KR101077405B1 (zh)
CN (1) CN100566503C (zh)
TW (1) TW200528490A (zh)
WO (1) WO2005084088A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4907142B2 (ja) * 2005-10-13 2012-03-28 新日鐵化学株式会社 芳香族ポリアミド酸、ポリイミド及び配線基板用積層体
JP4962056B2 (ja) * 2007-03-09 2012-06-27 東洋紡績株式会社 銅張り積層フィルム及びその製造方法
TWI422645B (zh) * 2007-03-30 2014-01-11 Nippon Steel & Sumikin Chem Co 聚醯亞胺膜
JP6839594B2 (ja) * 2016-04-27 2021-03-10 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム及び銅張積層板
JP7248394B2 (ja) * 2017-09-29 2023-03-29 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム及び金属張積層体
CN110241389A (zh) * 2018-03-08 2019-09-17 日铁化学材料株式会社 蒸镀掩模、蒸镀掩模形成用聚酰胺酸、蒸镀掩模形成用层叠体及蒸镀掩模的制造方法
CN109575831A (zh) * 2018-11-20 2019-04-05 深圳市弘海电子材料技术有限公司 低反弹力覆盖膜及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60250031A (ja) * 1984-05-28 1985-12-10 Hitachi Ltd 低熱膨張性樹脂材料
JPH06234916A (ja) * 1993-02-09 1994-08-23 Central Glass Co Ltd 低応力ポリイミド組成物および前駆体組成物溶液
JP4094062B2 (ja) * 1996-08-19 2008-06-04 新日鐵化学株式会社 Ｈｄｄサスペンション用積層体及びその製造方法
JP3794446B2 (ja) * 1997-08-05 2006-07-05 株式会社カネカ ハードディスクサスペンション配線基材用ポリイミドフィルム
JP3704920B2 (ja) * 1997-11-21 2005-10-12 宇部興産株式会社 磁気ヘッドサスペンションの製造方法
JP3486357B2 (ja) * 1998-12-28 2004-01-13 日本電信電話株式会社 光学用ポリイミド基板
JP2002338710A (ja) * 2001-03-16 2002-11-27 Sumitomo Bakelite Co Ltd 表示素子用プラスチック基板

Also Published As

Publication number Publication date
CN1943285A (zh) 2007-04-04
KR101077405B1 (ko) 2011-10-26
CN100566503C (zh) 2009-12-02
TW200528490A (en) 2005-09-01
JPWO2005084088A1 (ja) 2008-01-17
WO2005084088A1 (ja) 2005-09-09
JP4768606B2 (ja) 2011-09-07
KR20070007296A (ko) 2007-01-15

Similar Documents

Publication Publication Date Title
BE2020C513I2 (zh)
BE2016C020I2 (zh)
BE2016C014I2 (zh)
BE2015C041I2 (zh)
BE2015C038I2 (zh)
BE2015C066I2 (zh)
BE2015C014I2 (zh)
BE2014C071I2 (zh)
BE2014C064I2 (zh)
BE2014C063I2 (zh)
BE2014C010I2 (zh)
BE2015C065I2 (zh)
JP2005110666A5 (zh)
IN2007DE05701A (zh)
JP2005102138A5 (zh)
BRPI0508002A (zh)
JP2005216601A5 (zh)
BE2015C012I2 (zh)
BE2016C035I2 (zh)
BE2015C033I2 (zh)
BE2015C011I2 (zh)
JP2005029259A5 (zh)
BE2015C035I2 (zh)
JP2005100327A5 (zh)
JP2004347601A5 (zh)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees