CN101944518A - 半导体结构体及其制造方法、半导体器件及其制造方法 - Google Patents
半导体结构体及其制造方法、半导体器件及其制造方法 Download PDFInfo
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- CN101944518A CN101944518A CN2010102227863A CN201010222786A CN101944518A CN 101944518 A CN101944518 A CN 101944518A CN 2010102227863 A CN2010102227863 A CN 2010102227863A CN 201010222786 A CN201010222786 A CN 201010222786A CN 101944518 A CN101944518 A CN 101944518A
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- semiconductor structure
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- columnar electrode
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Landscapes
- Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
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JP2009158618A JP4811619B2 (ja) | 2009-07-03 | 2009-07-03 | 半導体構成体およびその製造方法並びに半導体装置およびその製造方法 |
JP2009158622A JP2011014764A (ja) | 2009-07-03 | 2009-07-03 | 半導体装置およびその製造方法 |
JP158622/2009 | 2009-07-03 | ||
JP158629/2009 | 2009-07-03 | ||
JP2009158629A JP2011014765A (ja) | 2009-07-03 | 2009-07-03 | 半導体構成体およびその製造方法並びに半導体装置およびその製造方法 |
JP158618/2009 | 2009-07-03 |
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CN101944518A true CN101944518A (zh) | 2011-01-12 |
CN101944518B CN101944518B (zh) | 2012-08-22 |
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CN2010102227863A Expired - Fee Related CN101944518B (zh) | 2009-07-03 | 2010-07-02 | 半导体结构体及其制造方法、半导体器件及其制造方法 |
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US (4) | US8525335B2 (zh) |
KR (1) | KR101169531B1 (zh) |
CN (1) | CN101944518B (zh) |
HK (1) | HK1153039A1 (zh) |
TW (1) | TW201118993A (zh) |
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CN103715108A (zh) * | 2012-10-02 | 2014-04-09 | 新科金朋有限公司 | 半导体装置和将密封剂沉积在嵌入式wlcsp中的方法 |
US10181423B2 (en) | 2012-10-02 | 2019-01-15 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of using a standardized carrier in semiconductor packaging |
US10658330B2 (en) | 2013-01-03 | 2020-05-19 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages |
US10777528B2 (en) | 2013-01-03 | 2020-09-15 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming embedded wafer level chip scale packages |
CN112534553A (zh) * | 2018-07-02 | 2021-03-19 | Qorvo美国公司 | Rf半导体装置及其制造方法 |
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US8525335B2 (en) * | 2009-07-03 | 2013-09-03 | Teramikros, Inc. | Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof |
JP2015056452A (ja) | 2013-09-10 | 2015-03-23 | 株式会社東芝 | 半導体記憶装置及びその製造方法 |
JP2015135869A (ja) * | 2014-01-16 | 2015-07-27 | 株式会社テラプローブ | 半導体装置、及び半導体装置の製造方法 |
US9380697B2 (en) * | 2014-01-28 | 2016-06-28 | Panasonic Intellectual Property Management Co., Ltd. | Electronic device and manufacturing method for same |
US10109502B2 (en) | 2016-09-12 | 2018-10-23 | Qorvo Us, Inc. | Semiconductor package with reduced parasitic coupling effects and process for making the same |
JP6663340B2 (ja) * | 2016-10-28 | 2020-03-11 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US11152363B2 (en) | 2018-03-28 | 2021-10-19 | Qorvo Us, Inc. | Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process |
US10804246B2 (en) | 2018-06-11 | 2020-10-13 | Qorvo Us, Inc. | Microelectronics package with vertically stacked dies |
US11069590B2 (en) | 2018-10-10 | 2021-07-20 | Qorvo Us, Inc. | Wafer-level fan-out package with enhanced performance |
US10964554B2 (en) | 2018-10-10 | 2021-03-30 | Qorvo Us, Inc. | Wafer-level fan-out package with enhanced performance |
US11646242B2 (en) | 2018-11-29 | 2023-05-09 | Qorvo Us, Inc. | Thermally enhanced semiconductor package with at least one heat extractor and process for making the same |
US20200235040A1 (en) | 2019-01-23 | 2020-07-23 | Qorvo Us, Inc. | Rf devices with enhanced performance and methods of forming the same |
US11387157B2 (en) * | 2019-01-23 | 2022-07-12 | Qorvo Us, Inc. | RF devices with enhanced performance and methods of forming the same |
US20200235066A1 (en) | 2019-01-23 | 2020-07-23 | Qorvo Us, Inc. | Rf devices with enhanced performance and methods of forming the same |
KR20210129656A (ko) | 2019-01-23 | 2021-10-28 | 코르보 유에스, 인크. | Rf 반도체 디바이스 및 이를 형성하는 방법 |
US11462501B2 (en) * | 2019-10-25 | 2022-10-04 | Shinko Electric Industries Co., Ltd. | Interconnect substrate and method of making the same |
US11646289B2 (en) | 2019-12-02 | 2023-05-09 | Qorvo Us, Inc. | RF devices with enhanced performance and methods of forming the same |
US11923238B2 (en) * | 2019-12-12 | 2024-03-05 | Qorvo Us, Inc. | Method of forming RF devices with enhanced performance including attaching a wafer to a support carrier by a bonding technique without any polymer adhesive |
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Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103715108A (zh) * | 2012-10-02 | 2014-04-09 | 新科金朋有限公司 | 半导体装置和将密封剂沉积在嵌入式wlcsp中的方法 |
US10181423B2 (en) | 2012-10-02 | 2019-01-15 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of using a standardized carrier in semiconductor packaging |
US10515828B2 (en) | 2012-10-02 | 2019-12-24 | STATS ChipPAC Pte. Ltd. | Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP |
US11011423B2 (en) | 2012-10-02 | 2021-05-18 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of using a standardized carrier in semiconductor packaging |
US11222793B2 (en) | 2012-10-02 | 2022-01-11 | STATS ChipPAC Pte. Ltd. | Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP |
US11961764B2 (en) | 2012-10-02 | 2024-04-16 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of making a wafer-level chip-scale package |
US10658330B2 (en) | 2013-01-03 | 2020-05-19 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages |
US10777528B2 (en) | 2013-01-03 | 2020-09-15 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming embedded wafer level chip scale packages |
US11488933B2 (en) | 2013-01-03 | 2022-11-01 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming embedded wafer level chip scale packages |
US11488932B2 (en) | 2013-01-03 | 2022-11-01 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages |
CN112534553A (zh) * | 2018-07-02 | 2021-03-19 | Qorvo美国公司 | Rf半导体装置及其制造方法 |
CN112534553B (zh) * | 2018-07-02 | 2024-03-29 | Qorvo美国公司 | Rf半导体装置及其制造方法 |
Also Published As
Publication number | Publication date |
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US20150097302A1 (en) | 2015-04-09 |
US8946079B2 (en) | 2015-02-03 |
CN101944518B (zh) | 2012-08-22 |
US20130320526A1 (en) | 2013-12-05 |
US20140239511A1 (en) | 2014-08-28 |
HK1153039A1 (en) | 2012-03-16 |
KR101169531B1 (ko) | 2012-07-27 |
US8754525B2 (en) | 2014-06-17 |
US9406637B2 (en) | 2016-08-02 |
KR20110003274A (ko) | 2011-01-11 |
TW201118993A (en) | 2011-06-01 |
US8525335B2 (en) | 2013-09-03 |
US20110001238A1 (en) | 2011-01-06 |
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