CN101862906B - 激光加工方法、激光加工装置以及加工产品 - Google Patents

激光加工方法、激光加工装置以及加工产品 Download PDF

Info

Publication number
CN101862906B
CN101862906B CN201010165735.1A CN201010165735A CN101862906B CN 101862906 B CN101862906 B CN 101862906B CN 201010165735 A CN201010165735 A CN 201010165735A CN 101862906 B CN101862906 B CN 101862906B
Authority
CN
China
Prior art keywords
region
laser
semiconductor substrate
workpiece
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201010165735.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN101862906A (zh
Inventor
福满宪志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34074622&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN101862906(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Publication of CN101862906A publication Critical patent/CN101862906A/zh
Application granted granted Critical
Publication of CN101862906B publication Critical patent/CN101862906B/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/361Removing material for deburring or mechanical trimming
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • B23K26/402Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/53Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/55Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/40Semiconductor devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
CN201010165735.1A 2003-07-18 2004-07-16 激光加工方法、激光加工装置以及加工产品 Expired - Lifetime CN101862906B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003-277039 2003-07-18
JP2003277039 2003-07-18

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2004800207868A Division CN1826207B (zh) 2003-07-18 2004-07-16 激光加工方法、激光加工装置以及加工产品

Publications (2)

Publication Number Publication Date
CN101862906A CN101862906A (zh) 2010-10-20
CN101862906B true CN101862906B (zh) 2014-01-15

Family

ID=34074622

Family Applications (3)

Application Number Title Priority Date Filing Date
CN201010165735.1A Expired - Lifetime CN101862906B (zh) 2003-07-18 2004-07-16 激光加工方法、激光加工装置以及加工产品
CN201010165964.3A Expired - Lifetime CN101862907B (zh) 2003-07-18 2004-07-16 激光加工方法、激光加工装置以及加工产品
CN2004800207868A Expired - Lifetime CN1826207B (zh) 2003-07-18 2004-07-16 激光加工方法、激光加工装置以及加工产品

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201010165964.3A Expired - Lifetime CN101862907B (zh) 2003-07-18 2004-07-16 激光加工方法、激光加工装置以及加工产品
CN2004800207868A Expired - Lifetime CN1826207B (zh) 2003-07-18 2004-07-16 激光加工方法、激光加工装置以及加工产品

Country Status (9)

Country Link
US (3) US7605344B2 (enExample)
EP (4) EP2269765B1 (enExample)
JP (3) JP5015294B2 (enExample)
KR (3) KR101119289B1 (enExample)
CN (3) CN101862906B (enExample)
ES (1) ES2523432T3 (enExample)
MY (1) MY157824A (enExample)
TW (4) TWI590902B (enExample)
WO (1) WO2005007335A1 (enExample)

Families Citing this family (163)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
EP2216128B1 (en) 2002-03-12 2016-01-27 Hamamatsu Photonics K.K. Method of cutting object to be processed
EP1494271B1 (en) 2002-03-12 2011-11-16 Hamamatsu Photonics K.K. Method for dicing substrate
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
TWI520269B (zh) 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
FR2852250B1 (fr) 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
US8685838B2 (en) 2003-03-12 2014-04-01 Hamamatsu Photonics K.K. Laser beam machining method
CN101862906B (zh) 2003-07-18 2014-01-15 浜松光子学株式会社 激光加工方法、激光加工装置以及加工产品
JP4563097B2 (ja) 2003-09-10 2010-10-13 浜松ホトニクス株式会社 半導体基板の切断方法
JP4601965B2 (ja) * 2004-01-09 2010-12-22 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4509578B2 (ja) 2004-01-09 2010-07-21 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4598407B2 (ja) * 2004-01-09 2010-12-15 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
CN100527360C (zh) 2004-03-30 2009-08-12 浜松光子学株式会社 激光加工方法及半导体芯片
JP4200177B2 (ja) * 2004-08-06 2008-12-24 浜松ホトニクス株式会社 レーザ加工方法及び半導体装置
JP4917257B2 (ja) * 2004-11-12 2012-04-18 浜松ホトニクス株式会社 レーザ加工方法
JP2006315017A (ja) * 2005-05-11 2006-11-24 Canon Inc レーザ切断方法および被切断部材
JP4749799B2 (ja) 2005-08-12 2011-08-17 浜松ホトニクス株式会社 レーザ加工方法
DE102006042280A1 (de) 2005-09-08 2007-06-06 IMRA America, Inc., Ann Arbor Bearbeitung von transparentem Material mit einem Ultrakurzpuls-Laser
US9138913B2 (en) 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
JP4762653B2 (ja) * 2005-09-16 2011-08-31 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
WO2007055010A1 (ja) 2005-11-10 2007-05-18 Renesas Technology Corp. 半導体装置の製造方法および半導体装置
JP2007165850A (ja) 2005-11-16 2007-06-28 Denso Corp ウェハおよびウェハの分断方法
JP4907965B2 (ja) * 2005-11-25 2012-04-04 浜松ホトニクス株式会社 レーザ加工方法
JP4804911B2 (ja) * 2005-12-22 2011-11-02 浜松ホトニクス株式会社 レーザ加工装置
JP4907984B2 (ja) * 2005-12-27 2012-04-04 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップ
US20070298529A1 (en) * 2006-05-31 2007-12-27 Toyoda Gosei, Co., Ltd. Semiconductor light-emitting device and method for separating semiconductor light-emitting devices
ES2428826T3 (es) 2006-07-03 2013-11-11 Hamamatsu Photonics K.K. Procedimiento de procesamiento por láser y chip
JP5183892B2 (ja) 2006-07-03 2013-04-17 浜松ホトニクス株式会社 レーザ加工方法
CN102489883B (zh) * 2006-09-19 2015-12-02 浜松光子学株式会社 激光加工方法和激光加工装置
JP4954653B2 (ja) * 2006-09-19 2012-06-20 浜松ホトニクス株式会社 レーザ加工方法
JP5101073B2 (ja) * 2006-10-02 2012-12-19 浜松ホトニクス株式会社 レーザ加工装置
JP5132911B2 (ja) * 2006-10-03 2013-01-30 浜松ホトニクス株式会社 レーザ加工方法
JP4964554B2 (ja) * 2006-10-03 2012-07-04 浜松ホトニクス株式会社 レーザ加工方法
EP2070636B1 (en) * 2006-10-04 2015-08-05 Hamamatsu Photonics K.K. Laser processing method
US8486742B2 (en) * 2006-11-21 2013-07-16 Epistar Corporation Method for manufacturing high efficiency light-emitting diodes
JP5336054B2 (ja) * 2007-07-18 2013-11-06 浜松ホトニクス株式会社 加工情報供給装置を備える加工情報供給システム
JP5449665B2 (ja) 2007-10-30 2014-03-19 浜松ホトニクス株式会社 レーザ加工方法
JP5134928B2 (ja) * 2007-11-30 2013-01-30 浜松ホトニクス株式会社 加工対象物研削方法
JP5054496B2 (ja) * 2007-11-30 2012-10-24 浜松ホトニクス株式会社 加工対象物切断方法
US8900715B2 (en) * 2008-06-11 2014-12-02 Infineon Technologies Ag Semiconductor device
JP5692969B2 (ja) 2008-09-01 2015-04-01 浜松ホトニクス株式会社 収差補正方法、この収差補正方法を用いたレーザ加工方法、この収差補正方法を用いたレーザ照射方法、収差補正装置、及び、収差補正プログラム
WO2010048733A1 (en) * 2008-10-29 2010-05-06 Oerlikon Solar Ip Ag, Trübbach Method for dividing a semiconductor film formed on a substrate into plural regions by multiple laser beam irradiation
JP5254761B2 (ja) 2008-11-28 2013-08-07 浜松ホトニクス株式会社 レーザ加工装置
JP5241527B2 (ja) 2009-01-09 2013-07-17 浜松ホトニクス株式会社 レーザ加工装置
JP5241525B2 (ja) 2009-01-09 2013-07-17 浜松ホトニクス株式会社 レーザ加工装置
WO2010090111A1 (ja) 2009-02-09 2010-08-12 浜松ホトニクス株式会社 加工対象物切断方法
US8347651B2 (en) * 2009-02-19 2013-01-08 Corning Incorporated Method of separating strengthened glass
KR101769158B1 (ko) 2009-04-07 2017-08-17 하마마츠 포토닉스 가부시키가이샤 레이저 가공 장치 및 레이저 가공 방법
JP5491761B2 (ja) 2009-04-20 2014-05-14 浜松ホトニクス株式会社 レーザ加工装置
JP5476063B2 (ja) 2009-07-28 2014-04-23 浜松ホトニクス株式会社 加工対象物切断方法
KR20120073249A (ko) * 2009-08-28 2012-07-04 코닝 인코포레이티드 화학적으로 강화된 유리 기판으로부터 제품을 레이저 절단하기 위한 방법
JP5446631B2 (ja) * 2009-09-10 2014-03-19 アイシン精機株式会社 レーザ加工方法及びレーザ加工装置
JP5410250B2 (ja) 2009-11-25 2014-02-05 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
US20110127242A1 (en) * 2009-11-30 2011-06-02 Xinghua Li Methods for laser scribing and separating glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
US20120234807A1 (en) * 2009-12-07 2012-09-20 J.P. Sercel Associates Inc. Laser scribing with extended depth affectation into a workplace
US20130256286A1 (en) * 2009-12-07 2013-10-03 Ipg Microsystems Llc Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths
KR20120098869A (ko) * 2009-12-07 2012-09-05 제이피 서셀 어소시에트, 인코퍼레이티드 레이저 가공과 스크라이빙 시스템 및 방법
JP2011201759A (ja) * 2010-03-05 2011-10-13 Namiki Precision Jewel Co Ltd 多層膜付き単結晶基板、多層膜付き単結晶基板の製造方法および素子製造方法
JP5770436B2 (ja) * 2010-07-08 2015-08-26 株式会社ディスコ レーザー加工装置およびレーザー加工方法
US9296066B2 (en) 2010-07-12 2016-03-29 Rofin-Sinar Technologies Inc. Method of material processing by laser filamentation
WO2012014722A1 (ja) * 2010-07-26 2012-02-02 浜松ホトニクス株式会社 基板加工方法
US8722516B2 (en) 2010-09-28 2014-05-13 Hamamatsu Photonics K.K. Laser processing method and method for manufacturing light-emitting device
US8748236B2 (en) * 2010-11-10 2014-06-10 Toyota Jidosha Kabushiki Kaisha Method for manufacturing semiconductor device
JP4945835B1 (ja) * 2010-11-16 2012-06-06 株式会社東京精密 レーザダイシング装置及び方法、割断装置及び方法、並びに、ウェーハ処理方法
JP5480169B2 (ja) * 2011-01-13 2014-04-23 浜松ホトニクス株式会社 レーザ加工方法
JP2013042119A (ja) * 2011-07-21 2013-02-28 Hamamatsu Photonics Kk 発光素子の製造方法
TWI476064B (zh) * 2011-11-07 2015-03-11 Metal Ind Res & Dev Ct 硬脆材料切割方法
US8624348B2 (en) 2011-11-11 2014-01-07 Invensas Corporation Chips with high fracture toughness through a metal ring
KR101276637B1 (ko) * 2011-12-13 2013-06-19 한국표준과학연구원 레이저 다중 선로 공정에서의 가공 중 평가 방법 및 장치
US10357850B2 (en) 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
US9828278B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
KR20140138134A (ko) * 2012-02-28 2014-12-03 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 강화 유리를 분리하는 방법과 장치 및 이에 의해 제조된 물품
US8652940B2 (en) * 2012-04-10 2014-02-18 Applied Materials, Inc. Wafer dicing used hybrid multi-step laser scribing process with plasma etch
US8842358B2 (en) 2012-08-01 2014-09-23 Gentex Corporation Apparatus, method, and process with laser induced channel edge
KR20140019549A (ko) * 2012-08-06 2014-02-17 주성엔지니어링(주) 유기발광장치의 제조방법
JP6003496B2 (ja) * 2012-10-02 2016-10-05 三星ダイヤモンド工業株式会社 パターン付き基板の加工方法
JP6036173B2 (ja) * 2012-10-31 2016-11-30 三星ダイヤモンド工業株式会社 レーザー加工装置
US8785234B2 (en) 2012-10-31 2014-07-22 Infineon Technologies Ag Method for manufacturing a plurality of chips
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US9102011B2 (en) 2013-08-02 2015-08-11 Rofin-Sinar Technologies Inc. Method and apparatus for non-ablative, photoacoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses
JP6241174B2 (ja) * 2013-09-25 2017-12-06 三星ダイヤモンド工業株式会社 レーザー加工装置、および、パターン付き基板の加工条件設定方法
US10017410B2 (en) 2013-10-25 2018-07-10 Rofin-Sinar Technologies Llc Method of fabricating a glass magnetic hard drive disk platter using filamentation by burst ultrafast laser pulses
US11053156B2 (en) 2013-11-19 2021-07-06 Rofin-Sinar Technologies Llc Method of closed form release for brittle materials using burst ultrafast laser pulses
US9517929B2 (en) 2013-11-19 2016-12-13 Rofin-Sinar Technologies Inc. Method of fabricating electromechanical microchips with a burst ultrafast laser pulses
US10005152B2 (en) 2013-11-19 2018-06-26 Rofin-Sinar Technologies Llc Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
US10252507B2 (en) 2013-11-19 2019-04-09 Rofin-Sinar Technologies Llc Method and apparatus for forward deposition of material onto a substrate using burst ultrafast laser pulse energy
US10144088B2 (en) 2013-12-03 2018-12-04 Rofin-Sinar Technologies Llc Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9938187B2 (en) 2014-02-28 2018-04-10 Rofin-Sinar Technologies Llc Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses
US11041558B2 (en) 2014-03-14 2021-06-22 ZPE Licensing Inc. Super charger components
EP3166895B1 (en) 2014-07-08 2021-11-24 Corning Incorporated Methods and apparatuses for laser processing materials
US10335902B2 (en) 2014-07-14 2019-07-02 Corning Incorporated Method and system for arresting crack propagation
EP3552753A3 (en) 2014-07-14 2019-12-11 Corning Incorporated System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter
CN107073641B (zh) 2014-07-14 2020-11-10 康宁股份有限公司 接口块;用于使用这种接口块切割在波长范围内透明的衬底的系统和方法
CN208586209U (zh) 2014-07-14 2019-03-08 康宁股份有限公司 一种用于在工件中形成限定轮廓的多个缺陷的系统
US9757815B2 (en) 2014-07-21 2017-09-12 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser curved filamentation within transparent materials
JP6390898B2 (ja) * 2014-08-22 2018-09-19 アイシン精機株式会社 基板の製造方法、加工対象物の切断方法、及び、レーザ加工装置
US10017411B2 (en) 2014-11-19 2018-07-10 Corning Incorporated Methods of separating a glass web
US9873628B1 (en) 2014-12-02 2018-01-23 Coherent Kaiserslautern GmbH Filamentary cutting of brittle materials using a picosecond pulsed laser
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
KR20170105562A (ko) 2015-01-12 2017-09-19 코닝 인코포레이티드 다중 광자 흡수 방법을 사용한 열적 템퍼링된 기판의 레이저 절단
KR101972466B1 (ko) 2015-01-13 2019-04-25 로핀-시나르 테크놀로지스 엘엘씨 취성 재료를 묘각하고 화학 식각하는 방법 및 시스템
JP7292006B2 (ja) 2015-03-24 2023-06-16 コーニング インコーポレイテッド ディスプレイガラス組成物のレーザ切断及び加工
KR20170131638A (ko) 2015-03-27 2017-11-29 코닝 인코포레이티드 가스 투과성 유리창 및 이의 제작방법
WO2017011296A1 (en) 2015-07-10 2017-01-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
JP2017081804A (ja) * 2015-10-30 2017-05-18 日本電気硝子株式会社 管ガラスの切断方法及び切断装置、並びに管ガラス製品の製造方法
US10518358B1 (en) 2016-01-28 2019-12-31 AdlOptica Optical Systems GmbH Multi-focus optics
JP2017152569A (ja) * 2016-02-25 2017-08-31 株式会社ディスコ ウエーハの加工方法
CN109311725B (zh) 2016-05-06 2022-04-26 康宁股份有限公司 从透明基材激光切割及移除轮廓形状
CN107398644A (zh) * 2016-05-18 2017-11-28 南京魔迪多维数码科技有限公司 一种切割脆性材料的方法
CN107398640A (zh) * 2016-05-18 2017-11-28 南京魔迪多维数码科技有限公司 一种切割脆性材料的方法及系统
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
US20180015569A1 (en) * 2016-07-18 2018-01-18 Nanya Technology Corporation Chip and method of manufacturing chips
WO2018022476A1 (en) 2016-07-29 2018-02-01 Corning Incorporated Apparatuses and methods for laser processing
EP3507057A1 (en) 2016-08-30 2019-07-10 Corning Incorporated Laser processing of transparent materials
KR102566170B1 (ko) * 2016-09-12 2023-08-10 삼성전자주식회사 웨이퍼 타공 장치
KR102078294B1 (ko) 2016-09-30 2020-02-17 코닝 인코포레이티드 비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법
EP3529214B1 (en) 2016-10-24 2020-12-23 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10668561B2 (en) 2016-11-15 2020-06-02 Coherent, Inc. Laser apparatus for cutting brittle material
CN114654082A (zh) 2016-12-30 2022-06-24 伊雷克托科学工业股份有限公司 用于延长镭射处理设备中的光学器件生命期的方法和系统
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
CN110678423B (zh) 2017-03-22 2022-05-13 康宁股份有限公司 分离玻璃板条的方法
US10794663B2 (en) 2017-05-11 2020-10-06 ZPE Licensing Inc. Laser induced friction surface on firearm
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
JP6903532B2 (ja) * 2017-09-20 2021-07-14 キオクシア株式会社 半導体装置およびその製造方法
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
JP7184455B2 (ja) * 2018-06-27 2022-12-06 株式会社ディスコ ウェーハの加工方法
US11075496B2 (en) 2018-06-28 2021-07-27 Samsung Electronics Co., Ltd. Laser dicing device, method of laser beam modulation, and method of dicing a substrate
JP7118804B2 (ja) * 2018-08-17 2022-08-16 キオクシア株式会社 半導体装置の製造方法
US10589445B1 (en) * 2018-10-29 2020-03-17 Semivation, LLC Method of cleaving a single crystal substrate parallel to its active planar surface and method of using the cleaved daughter substrate
WO2020130165A1 (ko) * 2018-12-18 2020-06-25 이석준 취성재료의 레이저 절단 가공방법
US10562130B1 (en) 2018-12-29 2020-02-18 Cree, Inc. Laser-assisted method for parting crystalline material
US10576585B1 (en) 2018-12-29 2020-03-03 Cree, Inc. Laser-assisted method for parting crystalline material
US11024501B2 (en) 2018-12-29 2021-06-01 Cree, Inc. Carrier-assisted method for parting crystalline material along laser damage region
KR20200111421A (ko) 2019-03-19 2020-09-29 삼성전자주식회사 레이저 장치 및 이를 이용한 기판 다이싱 장치 및 방법
US10611052B1 (en) 2019-05-17 2020-04-07 Cree, Inc. Silicon carbide wafers with relaxed positive bow and related methods
JP7326053B2 (ja) * 2019-07-11 2023-08-15 株式会社ディスコ 被加工物の加工方法
KR102216298B1 (ko) 2020-04-28 2021-02-18 주식회사 아이티아이 세라믹 절단법 및 장비
WO2021221378A1 (ko) 2020-04-28 2021-11-04 주식회사 아이티아이 세라믹 절단법 및 장비
KR102216294B1 (ko) 2020-07-22 2021-02-18 주식회사 아이티아이 세라믹 절단법 및 장비
DE112021003795T5 (de) 2020-07-15 2023-05-04 Hamamatsu Photonics K.K. Laserbearbeitungsvorrichtung, Laserbearbeitungsverfahren und Verfahren zur Herstellung eines Halbleiterelements
JP7629925B2 (ja) * 2020-07-15 2025-02-14 浜松ホトニクス株式会社 レーザ加工装置、及び、レーザ加工方法
KR102241518B1 (ko) 2020-11-17 2021-04-19 주식회사 아이티아이 세라믹 절단방법 및 장치
CN113618261B (zh) * 2021-10-11 2022-01-07 武汉锐科光纤激光技术股份有限公司 一种激光切割玻璃的切割方法
US12209619B2 (en) 2022-04-20 2025-01-28 ZPE Licensing Inc. Electromagnetic clutch
JP2024057889A (ja) * 2022-10-13 2024-04-25 浜松ホトニクス株式会社 光検出器
US12384009B2 (en) 2022-11-15 2025-08-12 ZPE Licensing Inc. Socket with laser induced friction surfaces
WO2024147672A1 (ko) * 2023-01-05 2024-07-11 주식회사 아큐레이저 기판 처리 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1310073A (zh) * 1994-02-24 2001-08-29 三菱电机株式会社 激光切割方法和装置
CN1826207B (zh) * 2003-07-18 2010-06-16 浜松光子学株式会社 激光加工方法、激光加工装置以及加工产品

Family Cites Families (106)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1000000A (en) * 1910-04-25 1911-08-08 Francis H Holton Vehicle-tire.
JPS4624989Y1 (enExample) 1967-08-31 1971-08-28
US3629545A (en) * 1967-12-19 1971-12-21 Western Electric Co Laser substrate parting
JPH0611071B2 (ja) 1983-09-07 1994-02-09 三洋電機株式会社 化合物半導体基板の分割方法
US4546231A (en) * 1983-11-14 1985-10-08 Group Ii Manufacturing Ltd. Creation of a parting zone in a crystal structure
US4562333A (en) * 1984-09-04 1985-12-31 General Electric Company Stress assisted cutting of high temperature embrittled materials
JPS61112345A (ja) 1984-11-07 1986-05-30 Toshiba Corp 半導体装置の製造方法
JP2891264B2 (ja) 1990-02-09 1999-05-17 ローム 株式会社 半導体装置の製造方法
JP3024990B2 (ja) 1990-08-31 2000-03-27 日本石英硝子株式会社 石英ガラス材料の切断加工方法
US5211805A (en) * 1990-12-19 1993-05-18 Rangaswamy Srinivasan Cutting of organic solids by continuous wave ultraviolet irradiation
JPH0639572A (ja) * 1991-01-11 1994-02-15 Souei Tsusho Kk ウェハ割断装置
JP3165192B2 (ja) 1991-03-28 2001-05-14 株式会社東芝 半導体集積回路装置の製造方法
DK0564093T3 (da) 1992-04-01 2000-03-27 Pfizer Hydroxylerede metabolitter og derivater af doxazosin som antiatherosklerosemidler
US5637244A (en) * 1993-05-13 1997-06-10 Podarok International, Inc. Method and apparatus for creating an image by a pulsed laser beam inside a transparent material
JP2616247B2 (ja) 1993-07-24 1997-06-04 日本電気株式会社 半導体装置の製造方法
JPH0740336A (ja) 1993-07-30 1995-02-10 Sumitomo Electric Ind Ltd ダイヤモンドの加工方法
US5622540A (en) * 1994-09-19 1997-04-22 Corning Incorporated Method for breaking a glass sheet
US5776220A (en) * 1994-09-19 1998-07-07 Corning Incorporated Method and apparatus for breaking brittle materials
US5543365A (en) * 1994-12-02 1996-08-06 Texas Instruments Incorporated Wafer scribe technique using laser by forming polysilicon
DE69629704T2 (de) * 1995-08-31 2004-07-08 Corning Inc. Verfahren und vorrichtung zum zerbrechen von sprödem material
KR0171947B1 (ko) 1995-12-08 1999-03-20 김주용 반도체소자 제조를 위한 노광 방법 및 그를 이용한 노광장치
JPH10163780A (ja) 1996-12-04 1998-06-19 Ngk Insulators Ltd 圧電単結晶からなる振動子の製造方法
JPH10305420A (ja) * 1997-03-04 1998-11-17 Ngk Insulators Ltd 酸化物単結晶からなる母材の加工方法、機能性デバイスの製造方法
DE19728766C1 (de) * 1997-07-07 1998-12-17 Schott Rohrglas Gmbh Verwendung eines Verfahrens zur Herstellung einer Sollbruchstelle bei einem Glaskörper
JP3292294B2 (ja) 1997-11-07 2002-06-17 住友重機械工業株式会社 レーザを用いたマーキング方法及びマーキング装置
JP3231708B2 (ja) * 1997-09-26 2001-11-26 住友重機械工業株式会社 透明材料のマーキング方法
JP3208730B2 (ja) * 1998-01-16 2001-09-17 住友重機械工業株式会社 光透過性材料のマーキング方法
JP3449201B2 (ja) 1997-11-28 2003-09-22 日亜化学工業株式会社 窒化物半導体素子の製造方法
JP3604550B2 (ja) 1997-12-16 2004-12-22 日亜化学工業株式会社 窒化物半導体素子の製造方法
JP4132172B2 (ja) 1998-02-06 2008-08-13 浜松ホトニクス株式会社 パルスレーザ加工装置
JP2000015467A (ja) 1998-07-01 2000-01-18 Shin Meiwa Ind Co Ltd 光による被加工材の加工方法および加工装置
JP3605651B2 (ja) 1998-09-30 2004-12-22 日立化成工業株式会社 半導体装置の製造方法
JP3178524B2 (ja) * 1998-11-26 2001-06-18 住友重機械工業株式会社 レーザマーキング方法と装置及びマーキングされた部材
US6252197B1 (en) * 1998-12-01 2001-06-26 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
US6259058B1 (en) * 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
JP2000195828A (ja) 1998-12-25 2000-07-14 Denso Corp ウエハの切断分離方法およびウエハの切断分離装置
JP2000219528A (ja) 1999-01-18 2000-08-08 Samsung Sdi Co Ltd ガラス基板の切断方法及びその装置
KR100578309B1 (ko) * 1999-08-13 2006-05-11 삼성전자주식회사 레이저 커팅 장치 및 이를 이용한 유리 기판 커팅 방법
CN1413136A (zh) * 1999-11-24 2003-04-23 应用光子学公司 非金属材料的分离方法和装置
JP2001250798A (ja) 2000-03-06 2001-09-14 Sony Corp ケガキ線で材料を分割する方法及び装置
US20020006765A1 (en) * 2000-05-11 2002-01-17 Thomas Michel System for cutting brittle materials
DE60139620D1 (de) * 2000-06-15 2009-10-01 3M Innovative Properties Co Methode und gerät zur erzielung wiederholter multiphotonabsorption
JP2002050589A (ja) 2000-08-03 2002-02-15 Sony Corp 半導体ウェーハの延伸分離方法及び装置
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JP3626442B2 (ja) * 2000-09-13 2005-03-09 浜松ホトニクス株式会社 レーザ加工方法
JP2003001462A (ja) * 2000-09-13 2003-01-08 Hamamatsu Photonics Kk レーザ加工装置
JP2003001458A (ja) 2000-09-13 2003-01-08 Hamamatsu Photonics Kk レーザ加工方法
JP4964376B2 (ja) 2000-09-13 2012-06-27 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
JP4762458B2 (ja) * 2000-09-13 2011-08-31 浜松ホトニクス株式会社 レーザ加工装置
JP2003001473A (ja) 2000-09-13 2003-01-08 Hamamatsu Photonics Kk レーザ加工装置
JP3408805B2 (ja) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
JP2002158276A (ja) 2000-11-20 2002-05-31 Hitachi Chem Co Ltd ウエハ貼着用粘着シートおよび半導体装置
JP2002226796A (ja) 2001-01-29 2002-08-14 Hitachi Chem Co Ltd ウェハ貼着用粘着シート及び半導体装置
GB2394712B (en) * 2001-03-09 2005-10-26 Crystal Fibre As Fabrication of microstructured fibres
JP2003154517A (ja) * 2001-11-21 2003-05-27 Seiko Epson Corp 脆性材料の割断加工方法およびその装置、並びに電子部品の製造方法
EP1494271B1 (en) * 2002-03-12 2011-11-16 Hamamatsu Photonics K.K. Method for dicing substrate
EP2216128B1 (en) * 2002-03-12 2016-01-27 Hamamatsu Photonics K.K. Method of cutting object to be processed
TWI326626B (en) * 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
TWI520269B (zh) * 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
JP3683580B2 (ja) * 2002-12-05 2005-08-17 浜松ホトニクス株式会社 レーザ加工装置
JP2004188422A (ja) * 2002-12-06 2004-07-08 Hamamatsu Photonics Kk レーザ加工装置及びレーザ加工方法
FR2852250B1 (fr) * 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
US8685838B2 (en) * 2003-03-12 2014-04-01 Hamamatsu Photonics K.K. Laser beam machining method
JP2005012203A (ja) 2003-05-29 2005-01-13 Hamamatsu Photonics Kk レーザ加工方法
JP2005028438A (ja) 2003-07-11 2005-02-03 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
JP4563097B2 (ja) * 2003-09-10 2010-10-13 浜松ホトニクス株式会社 半導体基板の切断方法
JP2005086175A (ja) * 2003-09-11 2005-03-31 Hamamatsu Photonics Kk 半導体薄膜の製造方法、半導体薄膜、半導体薄膜チップ、電子管、及び光検出素子
WO2005067113A1 (ja) * 2004-01-07 2005-07-21 Hamamatsu Photonics K.K. 半導体発光素子及びその製造方法
JP4598407B2 (ja) * 2004-01-09 2010-12-15 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4509578B2 (ja) * 2004-01-09 2010-07-21 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4601965B2 (ja) * 2004-01-09 2010-12-22 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
CN100527360C (zh) * 2004-03-30 2009-08-12 浜松光子学株式会社 激光加工方法及半导体芯片
JP4536407B2 (ja) * 2004-03-30 2010-09-01 浜松ホトニクス株式会社 レーザ加工方法及び加工対象物
EP1748474B1 (en) * 2004-03-30 2015-05-06 Hamamatsu Photonics K.K. Laser processing method
JP4634089B2 (ja) * 2004-07-30 2011-02-16 浜松ホトニクス株式会社 レーザ加工方法
JP4200177B2 (ja) * 2004-08-06 2008-12-24 浜松ホトニクス株式会社 レーザ加工方法及び半導体装置
JP4754801B2 (ja) * 2004-10-13 2011-08-24 浜松ホトニクス株式会社 レーザ加工方法
JP4917257B2 (ja) * 2004-11-12 2012-04-18 浜松ホトニクス株式会社 レーザ加工方法
JP4781661B2 (ja) * 2004-11-12 2011-09-28 浜松ホトニクス株式会社 レーザ加工方法
JP4198123B2 (ja) * 2005-03-22 2008-12-17 浜松ホトニクス株式会社 レーザ加工方法
JP4776994B2 (ja) * 2005-07-04 2011-09-21 浜松ホトニクス株式会社 加工対象物切断方法
JP4749799B2 (ja) * 2005-08-12 2011-08-17 浜松ホトニクス株式会社 レーザ加工方法
JP4762653B2 (ja) * 2005-09-16 2011-08-31 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4237745B2 (ja) * 2005-11-18 2009-03-11 浜松ホトニクス株式会社 レーザ加工方法
JP4907965B2 (ja) * 2005-11-25 2012-04-04 浜松ホトニクス株式会社 レーザ加工方法
JP4804911B2 (ja) * 2005-12-22 2011-11-02 浜松ホトニクス株式会社 レーザ加工装置
JP4907984B2 (ja) * 2005-12-27 2012-04-04 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップ
JP4804183B2 (ja) * 2006-03-20 2011-11-02 株式会社デンソー 半導体基板の分断方法およびその分断方法で作製された半導体チップ
ES2428826T3 (es) * 2006-07-03 2013-11-11 Hamamatsu Photonics K.K. Procedimiento de procesamiento por láser y chip
JP5183892B2 (ja) * 2006-07-03 2013-04-17 浜松ホトニクス株式会社 レーザ加工方法
CN102489883B (zh) * 2006-09-19 2015-12-02 浜松光子学株式会社 激光加工方法和激光加工装置
JP4954653B2 (ja) * 2006-09-19 2012-06-20 浜松ホトニクス株式会社 レーザ加工方法
JP5101073B2 (ja) * 2006-10-02 2012-12-19 浜松ホトニクス株式会社 レーザ加工装置
JP5132911B2 (ja) * 2006-10-03 2013-01-30 浜松ホトニクス株式会社 レーザ加工方法
JP4964554B2 (ja) * 2006-10-03 2012-07-04 浜松ホトニクス株式会社 レーザ加工方法
EP2070636B1 (en) * 2006-10-04 2015-08-05 Hamamatsu Photonics K.K. Laser processing method
JP5336054B2 (ja) * 2007-07-18 2013-11-06 浜松ホトニクス株式会社 加工情報供給装置を備える加工情報供給システム
JP4402708B2 (ja) * 2007-08-03 2010-01-20 浜松ホトニクス株式会社 レーザ加工方法、レーザ加工装置及びその製造方法
JP5225639B2 (ja) * 2007-09-06 2013-07-03 浜松ホトニクス株式会社 半導体レーザ素子の製造方法
JP5342772B2 (ja) * 2007-10-12 2013-11-13 浜松ホトニクス株式会社 加工対象物切断方法
JP5449665B2 (ja) * 2007-10-30 2014-03-19 浜松ホトニクス株式会社 レーザ加工方法
JP5054496B2 (ja) * 2007-11-30 2012-10-24 浜松ホトニクス株式会社 加工対象物切断方法
JP5134928B2 (ja) * 2007-11-30 2013-01-30 浜松ホトニクス株式会社 加工対象物研削方法
JP5241525B2 (ja) * 2009-01-09 2013-07-17 浜松ホトニクス株式会社 レーザ加工装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1310073A (zh) * 1994-02-24 2001-08-29 三菱电机株式会社 激光切割方法和装置
CN1826207B (zh) * 2003-07-18 2010-06-16 浜松光子学株式会社 激光加工方法、激光加工装置以及加工产品

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特開2003-154517A 2003.05.27
JP特開平11-138896A 1999.05.25

Also Published As

Publication number Publication date
TW201041680A (en) 2010-12-01
EP2324950B1 (en) 2013-11-06
US8852698B2 (en) 2014-10-07
EP1649965A4 (en) 2008-10-29
US20100327416A1 (en) 2010-12-30
US7605344B2 (en) 2009-10-20
CN101862906A (zh) 2010-10-20
TWI406726B (zh) 2013-09-01
KR20110063871A (ko) 2011-06-14
JP2012192459A (ja) 2012-10-11
JP2010239163A (ja) 2010-10-21
TWI340676B (en) 2011-04-21
EP2324950A1 (en) 2011-05-25
JP5015294B2 (ja) 2012-08-29
CN101862907B (zh) 2014-01-22
JP5554378B2 (ja) 2014-07-23
KR20100110377A (ko) 2010-10-12
EP2269765A1 (en) 2011-01-05
ES2523432T3 (es) 2014-11-25
TWI590902B (zh) 2017-07-11
CN1826207A (zh) 2006-08-30
CN1826207B (zh) 2010-06-16
JP5122611B2 (ja) 2013-01-16
TW200515966A (en) 2005-05-16
TWI376284B (en) 2012-11-11
KR20060054322A (ko) 2006-05-22
MY157824A (en) 2016-07-29
WO2005007335A1 (ja) 2005-01-27
KR101119289B1 (ko) 2012-03-15
TW201249577A (en) 2012-12-16
KR101193723B1 (ko) 2012-10-22
US20070170159A1 (en) 2007-07-26
TW201121690A (en) 2011-07-01
EP1649965A1 (en) 2006-04-26
US20100151202A1 (en) 2010-06-17
EP2332687A1 (en) 2011-06-15
EP1649965B1 (en) 2012-10-24
KR101119387B1 (ko) 2012-03-07
EP2269765B1 (en) 2014-10-15
CN101862907A (zh) 2010-10-20
JP2010267995A (ja) 2010-11-25
EP2332687B1 (en) 2015-02-18

Similar Documents

Publication Publication Date Title
CN101862906B (zh) 激光加工方法、激光加工装置以及加工产品
US10796959B2 (en) Laser processing method and laser processing apparatus
KR101408491B1 (ko) 레이저 가공방법 및 레이저 가공장치
JP2002192371A (ja) レーザ加工方法及びレーザ加工装置
JP4703983B2 (ja) 切断方法
JP2006179941A (ja) 半導体材料基板の切断方法
JP2006165593A (ja) 半導体材料基板の切断方法
JP2006216943A (ja) 半導体チップ

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20140115

CX01 Expiry of patent term