CN101821823A - 壳体模制型电容器及其制造方法 - Google Patents
壳体模制型电容器及其制造方法 Download PDFInfo
- Publication number
- CN101821823A CN101821823A CN200880111232A CN200880111232A CN101821823A CN 101821823 A CN101821823 A CN 101821823A CN 200880111232 A CN200880111232 A CN 200880111232A CN 200880111232 A CN200880111232 A CN 200880111232A CN 101821823 A CN101821823 A CN 101821823A
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- CN
- China
- Prior art keywords
- mold type
- case mold
- type capacitor
- capacitor
- hygroscopic agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 94
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 title claims description 5
- 229920005989 resin Polymers 0.000 claims abstract description 80
- 239000011347 resin Substances 0.000 claims abstract description 80
- 239000011256 inorganic filler Substances 0.000 claims abstract description 26
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 26
- 239000003822 epoxy resin Substances 0.000 claims abstract description 24
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 24
- 239000003230 hygroscopic agent Substances 0.000 claims description 53
- 239000002808 molecular sieve Substances 0.000 claims description 39
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 claims description 39
- 229920001971 elastomer Polymers 0.000 claims description 25
- 239000000806 elastomer Substances 0.000 claims description 25
- 239000011148 porous material Substances 0.000 claims description 23
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 20
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 20
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 14
- 229910021536 Zeolite Inorganic materials 0.000 claims description 11
- 239000010457 zeolite Substances 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 4
- 229910000323 aluminium silicate Inorganic materials 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 abstract description 6
- 230000002745 absorbent Effects 0.000 abstract 1
- 239000002250 absorbent Substances 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 22
- 239000000463 material Substances 0.000 description 19
- 239000010408 film Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 11
- 230000035939 shock Effects 0.000 description 10
- 230000007423 decrease Effects 0.000 description 6
- 230000002950 deficient Effects 0.000 description 6
- 230000001133 acceleration Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 238000004062 sedimentation Methods 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000004087 circulation Effects 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 238000001883 metal evaporation Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000001351 cycling effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000012074 hearing test Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000011104 metalized film Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000005382 thermal cycling Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 208000034189 Sclerosis Diseases 0.000 description 1
- 230000009102 absorption Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000007115 recruitment Effects 0.000 description 1
- 239000011257 shell material Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
- H01G9/10—Sealing, e.g. of lead-in wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
- H01G2/106—Fixing the capacitor in a housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
添加量(重量份) | 振动加速度(G) | 听感试验 | 弹性率(MPa) |
0 | 0.15 | 能听到 | 17000 |
0.5 | 0.14 | 能听到 | 16000 |
0.9 | 0.11 | 隐约能听到 | 15100 |
1.0 | 0.10 | 不能听到 | 15000 |
3.0 | 0.07 | 不能听到 | 13000 |
8.0 | 0.04 | 不能听到 | 9500 |
10.0 | 0.035 | 不能听到 | 8000 |
10.5 | 0.034 | 不能听到 | 7800 |
15 | 0.03 | 不能听到 | 6500 |
添加量(重量份) | 损失系数 | 高温高湿试验 | 冷热冲击试验 |
0 | 0.0028 | 合格(-1.1%) | 不合格 |
0.5 | 0.0034 | 合格(-1.3%) | 不合格 |
0.9 | 0.0045 | 合格(-1.8%) | 合格 |
1.0 | 0.0050 | 合格(-1.9%) | 合格 |
3.0 | 0.0070 | 合格(-2.2%) | 合格 |
8.0 | 0.0100 | 合格(-3.6%) | 合格 |
添加量(重量份) | 损失系数 | 高温高湿试验 | 冷热冲击试验 |
10.0 | 0.0110 | 合格(-4.0%) | 合格 |
10.5 | 0.0112 | 不合格(-5.3%) | 合格 |
15 | 0.0130 | 不合格(-8.0%) | 合格 |
Claims (13)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007266354 | 2007-10-12 | ||
JP2007-266354 | 2007-10-12 | ||
JP2008-032870 | 2008-02-14 | ||
JP2008032870 | 2008-02-14 | ||
PCT/JP2008/002764 WO2009047886A1 (ja) | 2007-10-12 | 2008-10-02 | ケースモールド型コンデンサとその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101821823A true CN101821823A (zh) | 2010-09-01 |
CN101821823B CN101821823B (zh) | 2013-03-06 |
Family
ID=40549039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008801112327A Active CN101821823B (zh) | 2007-10-12 | 2008-10-02 | 壳体模制型电容器及其制造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8315031B2 (zh) |
EP (1) | EP2234130B1 (zh) |
JP (1) | JP4973735B2 (zh) |
KR (1) | KR101148419B1 (zh) |
CN (1) | CN101821823B (zh) |
WO (1) | WO2009047886A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104752058A (zh) * | 2013-12-31 | 2015-07-01 | 现代摩比斯株式会社 | 电容器模块、制造其的方法以及具有其的车用逆变器 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101767411B (zh) * | 2010-01-18 | 2013-06-19 | 漳州市科泰精密科技有限公司 | 自动顶退电容壳成型装置 |
EP2623709A1 (de) * | 2011-10-27 | 2013-08-07 | Siemens Aktiengesellschaft | Kondensatorvorrichtung für eine Leiterschleife einer Vorrichtung zur "in situ"-Förderung von Schweröl und Bitumen aus Ölsand-Lagerstätten. |
JP6352740B2 (ja) * | 2014-09-11 | 2018-07-04 | 株式会社ケーヒン | 電力変換装置 |
CN105702458B (zh) * | 2014-11-28 | 2018-03-13 | 比亚迪股份有限公司 | 三电平用薄膜电容器 |
US10926649B2 (en) * | 2014-12-22 | 2021-02-23 | Flex Power Control, Inc. | Method to reduce losses in a high voltage DC link converter |
JP2019502260A (ja) * | 2016-02-04 | 2019-01-24 | 株式会社村田製作所 | 巻回型コンデンサおよびその製造方法 |
CN109196611B (zh) * | 2016-05-31 | 2021-03-23 | 松下知识产权经营株式会社 | 电解电容器及其制造方法 |
JP6933479B2 (ja) * | 2017-03-22 | 2021-09-08 | ニチコン株式会社 | ケースレスフィルムコンデンサ |
WO2019087259A1 (ja) * | 2017-10-30 | 2019-05-09 | 日立化成株式会社 | 樹脂組成物、硬化物、成形体及びその製造方法、並びに、フィルムコンデンサ及びその製造方法 |
JP2019117038A (ja) * | 2017-12-27 | 2019-07-18 | ユニオン昭和株式会社 | サブクールコンデンサ |
JP7057923B2 (ja) * | 2018-01-25 | 2022-04-21 | 株式会社村田製作所 | フィルムコンデンサ、及び、フィルムコンデンサ用の外装ケース |
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JPS5522842A (en) | 1978-08-03 | 1980-02-18 | Sanyo Electric Co | Resin sealed electronic part |
JPS59117213A (ja) | 1982-12-24 | 1984-07-06 | 日本電気株式会社 | 電子部品 |
JPH0611864B2 (ja) * | 1986-01-18 | 1994-02-16 | 松下電工株式会社 | ポリフエニレンスルフイド樹脂組成物 |
DE3639791A1 (de) * | 1986-02-15 | 1987-08-27 | Licentia Gmbh | Elektrischer kondensator mit abreisssicherung |
US4760494A (en) * | 1987-07-22 | 1988-07-26 | General Electric Company | Capacitor containing an adsorbent material |
JPH01294476A (ja) | 1988-05-07 | 1989-11-28 | Fujitsu Ltd | 樹脂封止電子部品の収納容器 |
US5264393A (en) * | 1988-11-25 | 1993-11-23 | Fuji Photo Film Co., Ltd. | Solid state image pickup device and method of manufacturing the same |
JPH03122114A (ja) * | 1989-10-06 | 1991-05-24 | Somar Corp | 硬化剤組成物、その製造方法及び熱硬化性エポキシ樹脂組成物 |
JPH05171041A (ja) * | 1991-12-25 | 1993-07-09 | Tosoh Corp | ポリフェニレンスルフィド樹脂組成物 |
US5827908A (en) * | 1994-01-26 | 1998-10-27 | Shin-Etsu Chemical Co., Ltd. | Naphthalene and or biphenyl skeleton containing epoxy resin composition |
JPH0995527A (ja) | 1995-09-29 | 1997-04-08 | Sumitomo Bakelite Co Ltd | 電子部品封止用樹脂組成物 |
JP3197872B2 (ja) * | 1998-09-07 | 2001-08-13 | 岡谷電機産業株式会社 | ケース外装型電子部品及びその製造方法 |
JP2000230110A (ja) | 1999-02-15 | 2000-08-22 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2000281876A (ja) | 1999-03-30 | 2000-10-10 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2000281869A (ja) | 1999-03-30 | 2000-10-10 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2000281872A (ja) | 1999-03-31 | 2000-10-10 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
DE19918090A1 (de) * | 1999-04-21 | 2000-11-02 | Epcos Ag | Leistungselektronik-Bauelement mit verbesserten thermischen Eigenschaften |
KR20070101408A (ko) * | 1999-09-02 | 2007-10-16 | 이비덴 가부시키가이샤 | 프린트배선판 및 프린트배선판의 제조방법 |
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JP3780975B2 (ja) * | 2002-05-22 | 2006-05-31 | 松下電器産業株式会社 | コンデンサの製造方法およびコンデンサ |
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JP2004168974A (ja) | 2002-11-22 | 2004-06-17 | Sumitomo Bakelite Co Ltd | フェノール樹脂成形材料 |
JP2004277635A (ja) | 2003-03-18 | 2004-10-07 | Sumitomo Bakelite Co Ltd | フェノール樹脂成形材料 |
JP2004303934A (ja) | 2003-03-31 | 2004-10-28 | Okaya Electric Ind Co Ltd | コンデンサの製造方法 |
JP2005093515A (ja) | 2003-09-12 | 2005-04-07 | Matsushita Electric Ind Co Ltd | 金属化フィルムコンデンサとその製造方法、および自動車駆動用インバータ回路とそれを用いた自動車 |
JP2005146157A (ja) | 2003-11-18 | 2005-06-09 | Mitsui Chemicals Inc | エポキシ樹脂組成物および半導体素子収納用中空パッケージ |
JP4747560B2 (ja) * | 2004-11-17 | 2011-08-17 | パナソニック株式会社 | フィルムコンデンサおよびその製造方法 |
JP2006265370A (ja) | 2005-03-24 | 2006-10-05 | Sumitomo Bakelite Co Ltd | 光半導体封止用エポキシ樹脂組成物及び光半導体装置 |
JP4774784B2 (ja) | 2005-03-30 | 2011-09-14 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP5288150B2 (ja) | 2005-10-24 | 2013-09-11 | 株式会社スリーボンド | 有機el素子封止用熱硬化型組成物 |
JP4973097B2 (ja) * | 2005-12-16 | 2012-07-11 | 東レ株式会社 | ポリフェニレンスルフィド樹脂組成物および成形品 |
-
2008
- 2008-10-02 US US12/678,425 patent/US8315031B2/en active Active
- 2008-10-02 CN CN2008801112327A patent/CN101821823B/zh active Active
- 2008-10-02 EP EP08837527.4A patent/EP2234130B1/en active Active
- 2008-10-02 WO PCT/JP2008/002764 patent/WO2009047886A1/ja active Application Filing
- 2008-10-02 JP JP2009536917A patent/JP4973735B2/ja active Active
- 2008-10-02 KR KR1020107006664A patent/KR101148419B1/ko active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104752058A (zh) * | 2013-12-31 | 2015-07-01 | 现代摩比斯株式会社 | 电容器模块、制造其的方法以及具有其的车用逆变器 |
CN104752058B (zh) * | 2013-12-31 | 2018-06-08 | 现代摩比斯株式会社 | 电容器模块、制造其的方法以及具有其的车用逆变器 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009047886A1 (ja) | 2011-02-17 |
EP2234130A4 (en) | 2013-01-23 |
EP2234130B1 (en) | 2015-12-23 |
US8315031B2 (en) | 2012-11-20 |
JP4973735B2 (ja) | 2012-07-11 |
EP2234130A1 (en) | 2010-09-29 |
WO2009047886A1 (ja) | 2009-04-16 |
US20100202095A1 (en) | 2010-08-12 |
KR20100047336A (ko) | 2010-05-07 |
CN101821823B (zh) | 2013-03-06 |
KR101148419B1 (ko) | 2012-05-25 |
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Application publication date: 20100901 Assignee: PANASONIC ELECTRONIC DEVICES (JIANGMEN) CO.,LTD. Assignor: Matsushita Electric Industrial Co.,Ltd. Contract record no.: 2018990000203 Denomination of invention: Case mold type capacitor and method for manufacturing the same Granted publication date: 20130306 License type: Common License Record date: 20180808 |
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