CN101794715A - 半导体装置的作标记方法和具有标记的半导体装置 - Google Patents

半导体装置的作标记方法和具有标记的半导体装置 Download PDF

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CN101794715A
CN101794715A CN200910215400A CN200910215400A CN101794715A CN 101794715 A CN101794715 A CN 101794715A CN 200910215400 A CN200910215400 A CN 200910215400A CN 200910215400 A CN200910215400 A CN 200910215400A CN 101794715 A CN101794715 A CN 101794715A
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山路英明
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Rohm Co Ltd
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Abstract

提供了一种用于在封装的半导体装置的表面上设置标记的作标记方法。半导体装置包括半导体芯片和用于覆盖半导体芯片的树脂封装。该方法包括在树脂封装的正面形成槽的步骤，和使用与树脂封装在视觉上可区分开的树脂填充槽的步骤。

Description

半导体装置的作标记方法和具有标记的半导体装置
技术领域
本发明涉及一种在半导体装置的表面上做标记的方法。本发明还涉及一种利用作标记方法做标记的半导体装置。
背景技术
常规地，已经提出了各种类型的半导体装置。这种半导体装置可在其上表面上印有一些表示装置的型号名称等的字符或标记。
例如，在日本特开2002-134660号中说明了一种用于在半导体装置上印刷的常规方法。如附图的图6A和6B中所示，利用该方法，在半导体装置的表面中嵌入数个标记部件。
具体地，参照图6A，半导体芯片91安装在由下成型部件90支撑的衬底92上，上成型部件93布置在上方，并且面向下成型部件90。携载标记部件94的转印膜95附着在上成型部件93的下表面上。密封树脂97装填到下成型部件90与上成型部件93之间的空间中，以密封半导体芯片91和衬底92。
然后，如图6B中所示，将转印膜95与硬化的密封树脂97分离，同时使标记部件94留在密封树脂97中。嵌入的标记部件94被布置成提供用于识别半导体装置的信息，因而可以识别装置的型号名称。
然而，该常规印刷方法可能会造成如下不便。通过上述参照图6A的说明可知，标记部件94需要足够牢固地附着在转印膜95上，以便不会被正在装填的密封树脂97带走。另一方面，在将转印膜95从密封树脂97上移除时，相同的标记部件94应该与转印膜95分离并保留在密封树脂97中(参见图6B)。可能不能总是预期标记部件94的这种理想行为，在某些情况下，由于一个或多个标记部件94的缺失可能会导致不完整的印刷。随着半导体装置(且因此每个标记部件94)尺寸变得更小，这种不完整的印刷可能会更经常地出现。此外，根据该常规印刷方法，各个标记部件94需要在转印膜95上精确地定位。然而，随着个体标记部件94变得更小，这种精确定位变得更加困难。
发明内容
已在上述情况下提出了本发明。因此本发明的目的在于提供一种能够在半导体装置上容易并可靠地作标记的作标记方法。本发明的另一目的在于提供一种具有利用该作标记方法所做标记的半导体装置。
根据本发明的第一方面，提供了一种用于包括半导体芯片和覆盖该半导体芯片的树脂封装的半导体装置的作标记方法。该作标记方法包括以下步骤：在树脂封装的正面形成槽；和利用与树脂封装可区分开的标记树脂填充槽。
优选地，本发明的作标记方法可进一步包括在利用标记树脂填充槽的步骤之后，从树脂封装的正面去除多余的树脂的步骤。
优选地，可通过将激光束照射在树脂封装的正面上而形成槽。
优选地，树脂封装可以是黑色或深灰色的，而标记树脂是白色或浅灰色的热固性树脂。
根据本发明的第二方面，提供了一种半导体装置，包括：半导体芯片；覆盖半导体芯片并形成有包括不规则内表面的槽的树脂封装；和填充在槽中并与树脂封装可区分开的标记树脂。
优选地，树脂封装可以是黑色或深灰色的，而标记树脂可以是白色或浅灰色的。
通过以下参照附图给出的详细说明，本发明的其它特征和优点将变得更加显而易见。
附图说明
图1是示出可应用根据本发明的作标记方法的半导体装置的透视图；
图2是沿图1中的II-II线截取的剖视图；
图3示出了根据本发明的作标记方法；
图4A示出了根据本发明的作标记方法的一个步骤；
图4B示出了根据本发明的作标记方法的另一个步骤；
图4C示出了根据本发明的作标记方法的又一个步骤；
图4D示出了根据本发明的作标记方法的再一个步骤；
图4E示出了完成图4D的步骤之后的状态；
图5示出了产生多个半导体装置的切割过程；并且
图6示出了半导体装置的常规印刷方法。
具体实施方式
下面参照附图说明本发明的优选实施方式。
图1和图2示出可应用根据本发明的作标记方法的半导体装置的实例。图1是示出半导体装置的主要部分的透视图。图2是沿图1中的II-II线截取的剖视图。半导体装置可以是例如齐纳二极管或者PIN二极管。
半导体装置包括半导体芯片1、由金属制成并且彼此间隔的引线2和3、导线4和树脂封装5。半导体装置具有大约0.6mm的宽度W，大约0.3mm的深度D和大约0.3mm的高度H。半导体装置被设计成利用引线2和3表面安装在未示出的安装板上。
半导体芯片1设有两个电极。其中一个电极形成在半导体芯片1的下表面上，另一个电极形成在芯片1的上表面上。半导体芯片1具有大约0.08mm的厚度。半导体芯片1安装在引线2的正面上。以此方式，半导体芯片1的下表面上的电极电连接于引线2。半导体芯片1的上表面上的电极经由导线4电连接于引线3。引线2和3具有大约0.1mm的厚度H2。
设置树脂封装5用以保护半导体芯片1和导线4。树脂封装5由例如为黑色或基本上黑色(例如，接近于黑色的深灰色)的具有遮光性的硅树脂制成。树脂封装5具有上表面，其上具有表示例如半导体装置的型号名称或型号的字符等。具体地，树脂封装5的上表面形成有构成字符的槽6。槽6填充有为白色或基本上白色(例如，接近于白色的浅灰色)的热固性树脂7。
槽6通过后述的激光束照射形成，并具有由激光照射产生的不规则内表面。激光束照射使得树脂封装5的上表面中的槽6的边缘不是直线形的，而是锯齿形的。槽6具有大约30μm的宽度W1和大约10至25μm的深度H3。
下面参照图3和图4A-4E说明半导体装置的作标记方法。
准备如图3中所示的矩形基板(base board)11。基板11包括彼此连接并且各自将提供一个半导体装置的多个部分。基板11可通过以下过程制成。首先，将多个将成为引线2和3的条形引线材料12放置在未示出的基座的适当位置上。然后，将多个半导体芯片1安装在引线材料12的适当位置上。然后，将导线4连结以连接半导体芯片1的上表面与引线材料12。然后，装填将成为树脂封装5的密封树脂13，以覆盖半导体芯片1和引线材料12。
如图4A和4B中所示，在准备基板11之后，在基板11的正面上与可表示例如型号名称的要印刷的字符相对应的部分上刻槽。应该注意的是，图4A至4E示出了基板11的主要部分。具体地，在密封树脂13的正面上形成多个槽6以形成要印刷的字符。通过利用从连接到未示出的激光发射装置上的割嘴(torch)14发出的激光束照射密封树脂13的正面而形成槽6。作为激光发射装置，可使用产生具有例如1064μm波长的激光束的YVO4激光器。
如图4B中所示，形成在密封树脂13上的槽6由于激光照射而具有不规则的内表面。密封树脂13正面中的槽6的边缘也可以是不规则的，即不是直线形的，而是锯齿形的。在密封树脂13的正面中制成槽的方法不局限于使用激光发射装置的激光束照射。例如，可通过蚀刻或使用机械切割工具制成槽。尽管图4B中的槽6被示为成排布置，但是这仅为一个实例。槽6的布置取决于要形成的字符。
然后，如图4C中所示，将热固性树脂7涂敷在基板11的正面上，以填充槽6并且遍布未刻槽的平坦部分。优选地，热固性树脂7可以是白色或基本上白色(例如浅灰色)的树脂。然而，热固性树脂7可以具有任意其它的颜色，只要该颜色与树脂封装5的表面颜色(在本实施方式中为黑色或深灰色)在视觉上可以区分开即可，从而允许清楚地示出字符或标记。
然后，如图4D中所示，通过使用例如橡皮刮板15沿着基板11的正面清扫，将基板11的正面上多余的热固性树脂7去除。这里，“多余的”热固性树脂是未填充任何一个槽6，因此未用于提供所需标记的部分热固性树脂7。在去除多余的热固性树脂之后，如图4E中所示，密封树脂13的正面和填充在槽6中的热固性树脂7暴露在空气中。除了使用橡皮刮板15之外，还可通过利用化学技术(例如蚀刻)或者机械技术(例如使用研磨机)实现去除多余的热固性树脂7。
然后，加热露出的热固性树脂7以使其硬化。替代性地，由于用于作标记的树脂7可能不需要具有很大的机械强度，因此也可不加热树脂7，而是简单地放置在空气中干燥。
然后，如图5中所示，使用未示出的切割锯沿着切割线L将基板11切割成预定尺寸。因此，获得了各自具有图1和图2中所示结构的多个半导体装置。
如上所述，在根据本发明的作标记方法中，通过例如激光束照射对作为半导体装置一部分的密封树脂13的正面刻槽以设置槽6，并且使用热固性树脂7填充这些槽6。槽6中的热固性树脂7被露出，以便呈现为表示例如型号名称的字符。使用该方法比使用常规印刷方法更容易更可靠地形成表示例如型号名称的字符。通过使用白色或浅灰色的热固性树脂7，在半导体装置上形成的字符具有高可视性。
以上说明了本发明，然而明显地本发明可以多种方式变化。这些变型不应被视为脱离本发明的本质和范围，并且所有这些对于本领域技术人员来说显而易见的改型都应该包括在以下权利要求的范围内。

Claims (6)

1.一种用于半导体装置的作标记方法，所述半导体装置包括半导体芯片和覆盖所述半导体芯片的树脂封装，所述方法包括以下步骤：
在所述树脂封装的正面形成槽；和
使用与所述树脂封装能够区分开的标记树脂填充所述槽。
2.如权利要求1所述的作标记方法，还包括在使用所述标记树脂填充所述槽的步骤之后，从所述树脂封装的正面去除多余的树脂的步骤。
3.如权利要求1所述的作标记方法，其中通过将激光束照射在所述树脂封装的正面上而形成所述槽。
4.如权利要求1所述的作标记方法，其中所述树脂封装是黑色或深灰色的，而所述标记树脂是白色或浅灰色的热固性树脂。
5.一种半导体装置，包括：
半导体芯片；
树脂封装，其覆盖所述半导体芯片并形成有包括不规则内表面的槽；和
标记树脂，其填充在所述槽中并与所述树脂封装能够区分开。
6.如权利要求5所述的半导体装置，其中所述树脂封装是黑色或深灰色的，而所述标记树脂是白色或浅灰色的。
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