CN101729037B - 电子部件用封装体、压电器件及其制造方法 - Google Patents

电子部件用封装体、压电器件及其制造方法 Download PDF

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Publication number
CN101729037B
CN101729037B CN2009101738604A CN200910173860A CN101729037B CN 101729037 B CN101729037 B CN 101729037B CN 2009101738604 A CN2009101738604 A CN 2009101738604A CN 200910173860 A CN200910173860 A CN 200910173860A CN 101729037 B CN101729037 B CN 101729037B
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CN
China
Prior art keywords
substrate
inner space
closed hole
sealing
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN2009101738604A
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English (en)
Chinese (zh)
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CN101729037A (zh
Inventor
斋田裕康
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
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Publication date
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Publication of CN101729037A publication Critical patent/CN101729037A/zh
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Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
    • G01L9/0008—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations
    • G01L9/0022—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a piezoelectric element
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0595—Holders or supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • General Physics & Mathematics (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
CN2009101738604A 2008-10-24 2009-09-16 电子部件用封装体、压电器件及其制造方法 Expired - Fee Related CN101729037B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008274040 2008-10-24
JP2008-274040 2008-10-24
JP2009120593A JP5369887B2 (ja) 2008-10-24 2009-05-19 電子部品用パッケージ、圧電デバイスおよびその製造方法
JP2009-120593 2009-05-19

Publications (2)

Publication Number Publication Date
CN101729037A CN101729037A (zh) 2010-06-09
CN101729037B true CN101729037B (zh) 2013-05-08

Family

ID=42116787

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009101738604A Expired - Fee Related CN101729037B (zh) 2008-10-24 2009-09-16 电子部件用封装体、压电器件及其制造方法

Country Status (5)

Country Link
US (1) US8334639B2 (https=)
JP (1) JP5369887B2 (https=)
KR (1) KR20100045909A (https=)
CN (1) CN101729037B (https=)
TW (1) TWI399874B (https=)

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JP5476964B2 (ja) 2009-12-09 2014-04-23 セイコーエプソン株式会社 振動子、発振器、ジャイロ及び電子機器
JP5384406B2 (ja) * 2010-03-30 2014-01-08 日本電波工業株式会社 音叉型水晶振動片の製造方法、水晶デバイス
JP2016154368A (ja) * 2011-03-30 2016-08-25 日本電波工業株式会社 圧電デバイス及び圧電デバイスの製造方法
JP2012217155A (ja) * 2011-03-30 2012-11-08 Nippon Dempa Kogyo Co Ltd 圧電デバイス及び圧電デバイスの製造方法
JP5831871B2 (ja) * 2011-08-31 2015-12-09 アルプス電気株式会社 電子部品
US9038463B2 (en) * 2011-09-22 2015-05-26 Seiko Epson Corporation Electronic device, manufacturing method thereof, and electronic apparatus
US9620702B2 (en) 2011-09-30 2017-04-11 Daishinku Corporation Electronic component package, electronic component package sealing member and method for producing the electronic component package sealing member
JP2013179228A (ja) * 2012-02-29 2013-09-09 Seiko Epson Corp 電子デバイスの製造方法および電子機器
US8691607B2 (en) * 2012-06-07 2014-04-08 Texas Instruments Incorporated Hermetically sealed MEMS device and method of fabrication
CN104051357B (zh) 2013-03-15 2017-04-12 财团法人工业技术研究院 环境敏感电子装置以及其封装方法
DE102014202801B4 (de) * 2014-02-17 2023-08-24 Robert Bosch Gmbh Verfahren zum Herstellen eines mikromechanischen Bauelements
US20160033273A1 (en) * 2014-07-31 2016-02-04 Seiko Epson Corporation Method for manufacturing physical quantity sensor, physical quantity sensor, electronic device, and moving body
WO2017016316A1 (zh) * 2015-07-28 2017-02-02 纳智源科技（唐山）有限责任公司 电子烟气动传感器、气流处理装置及电子烟
US9567208B1 (en) 2015-11-06 2017-02-14 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and method for fabricating the same
DE102016200497A1 (de) * 2016-01-15 2017-07-20 Robert Bosch Gmbh Verfahren zum Herstellen eines mikromechanischen Bauelements
CN107564890B (zh) * 2017-08-03 2019-09-20 华进半导体封装先导技术研发中心有限公司 一种应力传感器结构及其制作方法
JP2020036063A (ja) * 2018-08-27 2020-03-05 セイコーエプソン株式会社 振動デバイス、振動デバイスの製造方法、電子機器、および移動体
JP7266501B2 (ja) * 2019-09-25 2023-04-28 新光電気工業株式会社 ステム
US11174151B2 (en) * 2019-11-19 2021-11-16 Invensense, Inc. Integrated MEMS cavity seal
JP7361343B2 (ja) * 2021-09-29 2023-10-16 三安ジャパンテクノロジー株式会社 モジュール

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WO2007095461A3 (en) * 2006-02-13 2007-10-04 Honeywell Int Inc Surface acoustic wave packages and methods of forming same
CN101272135A (zh) * 2007-03-22 2008-09-24 爱普生拓优科梦株式会社 晶体器件及其密封方法

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JPH06343017A (ja) * 1993-04-09 1994-12-13 Citizen Watch Co Ltd 圧電振動子およびその製造方法
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US6960870B2 (en) * 1997-07-29 2005-11-01 Seiko Epson Corporation Piezo-electric resonator and manufacturing method thereof
JP2000269775A (ja) 1999-03-16 2000-09-29 Nippon Dempa Kogyo Co Ltd 薄型水晶振動子
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JP3945417B2 (ja) * 2003-02-14 2007-07-18 セイコーエプソン株式会社 圧電デバイスのパッケージ構造及び圧電デバイスの製造方法
JP3873902B2 (ja) 2003-02-21 2007-01-31 セイコーエプソン株式会社 圧電デバイスとその製造方法ならびに圧電デバイスを利用した携帯電話装置および圧電デバイスを利用した電子機器
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JP2005244500A (ja) * 2004-02-25 2005-09-08 Seiko Epson Corp 圧電デバイスとその製造方法ならびに圧電デバイス用パッケージおよび圧電デバイスを利用した携帯電話装置および圧電デバイスを利用した電子機器
US20060255691A1 (en) * 2005-03-30 2006-11-16 Takahiro Kuroda Piezoelectric resonator and manufacturing method thereof
JP4630110B2 (ja) * 2005-04-05 2011-02-09 パナソニック株式会社 電子部品の製造方法
JP4665768B2 (ja) * 2006-01-10 2011-04-06 エプソントヨコム株式会社 気密封止構造および圧電デバイスとその製造方法
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JP2008147895A (ja) * 2006-12-08 2008-06-26 Epson Toyocom Corp 水晶振動子、水晶振動子の製造方法
US7859172B2 (en) * 2007-06-19 2010-12-28 Epson Toyocom Corporation Piezoelectric resonator, manufacturing method thereof and lid for piezoelectric resonator
JP2009182924A (ja) * 2008-02-01 2009-08-13 Epson Toyocom Corp 圧電デバイス及び圧電デバイスの製造方法
JP5189378B2 (ja) * 2008-02-18 2013-04-24 セイコーインスツル株式会社 圧電振動子の製造方法
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JP2007180924A (ja) * 2005-12-28 2007-07-12 Kyocera Kinseki Corp 水晶振動子容器の封止方法
WO2007095461A3 (en) * 2006-02-13 2007-10-04 Honeywell Int Inc Surface acoustic wave packages and methods of forming same
CN101272135A (zh) * 2007-03-22 2008-09-24 爱普生拓优科梦株式会社 晶体器件及其密封方法

Also Published As

Publication number Publication date
JP2010124448A (ja) 2010-06-03
JP5369887B2 (ja) 2013-12-18
CN101729037A (zh) 2010-06-09
TW201025690A (en) 2010-07-01
US20100102678A1 (en) 2010-04-29
KR20100045909A (ko) 2010-05-04
US8334639B2 (en) 2012-12-18
TWI399874B (zh) 2013-06-21

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: SEIKO EPSON CORP.

Free format text: FORMER OWNER: EPSON TOYOCOM CORP.

Effective date: 20111024

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20111024

Address after: Tokyo, Japan

Applicant after: Seiko Epson Corp.

Address before: Japan Tokyo Hino Hino 421-8

Applicant before: Epson Toyocom Corp.

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130508

Termination date: 20170916