JP6383138B2 - 電子デバイス - Google Patents
電子デバイス Download PDFInfo
- Publication number
- JP6383138B2 JP6383138B2 JP2013035060A JP2013035060A JP6383138B2 JP 6383138 B2 JP6383138 B2 JP 6383138B2 JP 2013035060 A JP2013035060 A JP 2013035060A JP 2013035060 A JP2013035060 A JP 2013035060A JP 6383138 B2 JP6383138 B2 JP 6383138B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- base substrate
- electronic device
- external electrode
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 102
- 229910052751 metal Inorganic materials 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 34
- 238000007747 plating Methods 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 239000011521 glass Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 17
- 238000005530 etching Methods 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 238000005498 polishing Methods 0.000 description 9
- 239000010453 quartz Substances 0.000 description 9
- 230000035515 penetration Effects 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 239000005361 soda-lime glass Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 244000089486 Phragmites australis subsp australis Species 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Description
また、貫通電極10の側面は、図3と同様に、ベースの他方の表面から突出している。
また、外部電極11は、メッキ膜と、メッキ膜及びベース基板11の上面に形成される金属膜とで構成されてもよい。この金属膜は、スパッタ等で形成される。
ベース基板としては、ソーダ石灰ガラス、ホウケイ酸ガラス、その他のガラスを使用することができる。貫通電極として、コバール、インバー、パーマロイ、42アロイ、ステンレス鋼等の鉄−ニッケル系合金を使用することができる。貫通電極の突出部に無電解メッキ法によりメッキ膜を形成することにより、メッキ膜は貫通電極の突出部と端面近傍のベース基板の表面にキャップを被せたように形成され、貫通電極の突出部は密閉される。そのため、周囲に水分等が付着しても貫通電極とは接触せず、貫通電極が電池効果によって腐食することが防止される。メッキ膜の酸化を防止するため、メッキ膜の上面に金等のイオン化傾向の小さな金属材料を形成することができる。
2 ベース基板
3 蓋基板
4 電子素子
5 キャビティ
7 接合膜
9 内部電極
10 貫通電極
11 外部電極
Claims (4)
- 複数の貫通電極が形成される絶縁性のベース基板と、前記ベース基板の一方の表面に実装される電子素子と、前記電子素子を収納し前記ベース基板に接合される蓋体と、を備える電子デバイスであって、
前記貫通電極は、前記ベース基板の他方の表面から突出する突出部を有し、
前記突出部は、前記貫通電極の前記ベース基板の他方の表面側の端面の全体を含み、
前記突出部の表面の全体と、前記突出部近傍の前記ベース基板の他方の表面と、を覆う金属膜で形成される外部電極を有し、
前記貫通電極の前記端面は、周縁から中央に向かい傾斜する傾斜面を有することを特徴とする電子デバイス。 - 前記貫通電極の前記端面は、曲面で構成されることを特徴とする請求項1に記載の電子デバイス。
- 前記突出部は、前記貫通電極の前記端面のみで構成され、
前記端面の周縁が前記突出部と前記ベース基板の他方の表面との境界であることを特徴とする請求項1に記載の電子デバイス。 - 前記外部電極は、メッキ膜で構成されることを特徴とする請求項1に記載の電子デバイス。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013035060A JP6383138B2 (ja) | 2013-02-25 | 2013-02-25 | 電子デバイス |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013035060A JP6383138B2 (ja) | 2013-02-25 | 2013-02-25 | 電子デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014165341A JP2014165341A (ja) | 2014-09-08 |
JP6383138B2 true JP6383138B2 (ja) | 2018-08-29 |
Family
ID=51615687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013035060A Expired - Fee Related JP6383138B2 (ja) | 2013-02-25 | 2013-02-25 | 電子デバイス |
Country Status (1)
Country | Link |
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JP (1) | JP6383138B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017014127A1 (ja) * | 2015-07-21 | 2017-01-26 | 株式会社村田製作所 | Led搭載基板 |
JP6835607B2 (ja) * | 2017-01-30 | 2021-02-24 | 京セラ株式会社 | 水晶デバイス及びその製造方法 |
JP6928269B2 (ja) * | 2018-08-31 | 2021-09-01 | 日亜化学工業株式会社 | 発光装置及び発光装置の製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63253656A (ja) * | 1987-04-10 | 1988-10-20 | Sumitomo Electric Ind Ltd | 半導体装置 |
JPH0198252A (ja) * | 1987-10-12 | 1989-04-17 | Oki Electric Ind Co Ltd | 半導体パッケージ |
JPH0430561A (ja) * | 1990-05-28 | 1992-02-03 | Hitachi Ltd | 半導体集積回路装置およびその実装構造 |
JP3420435B2 (ja) * | 1996-07-09 | 2003-06-23 | 松下電器産業株式会社 | 基板の製造方法、半導体装置及び半導体装置の製造方法 |
-
2013
- 2013-02-25 JP JP2013035060A patent/JP6383138B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2014165341A (ja) | 2014-09-08 |
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