CN101711429B - 具有多个独立移动有节机械臂的基片传送装置 - Google Patents
具有多个独立移动有节机械臂的基片传送装置 Download PDFInfo
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- CN101711429B CN101711429B CN200880019066.8A CN200880019066A CN101711429B CN 101711429 B CN101711429 B CN 101711429B CN 200880019066 A CN200880019066 A CN 200880019066A CN 101711429 B CN101711429 B CN 101711429B
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- Prior art keywords
- arm
- power transmission
- transmission shaft
- platform
- scara
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/0009—Constructional details, e.g. manipulator supports, bases
- B25J9/0021—All motors in base
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
- B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/1005—Programme-controlled manipulators characterised by positioning means for manipulator elements comprising adjusting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20305—Robotic arm
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20305—Robotic arm
- Y10T74/20317—Robotic arm including electric motor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20305—Robotic arm
- Y10T74/20329—Joint between elements
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/697,390 | 2007-04-06 | ||
| US11/697,390 US7946800B2 (en) | 2007-04-06 | 2007-04-06 | Substrate transport apparatus with multiple independently movable articulated arms |
| PCT/US2008/004470 WO2008124108A1 (en) | 2007-04-06 | 2008-04-07 | Substrate transport apparatus with multiple independently movable articulated arms |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101711429A CN101711429A (zh) | 2010-05-19 |
| CN101711429B true CN101711429B (zh) | 2011-11-16 |
Family
ID=39827670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200880019066.8A Active CN101711429B (zh) | 2007-04-06 | 2008-04-07 | 具有多个独立移动有节机械臂的基片传送装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7946800B2 (enExample) |
| JP (2) | JP2010531739A (enExample) |
| KR (1) | KR101475421B1 (enExample) |
| CN (1) | CN101711429B (enExample) |
| TW (1) | TWI478797B (enExample) |
| WO (1) | WO2008124108A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI816713B (zh) * | 2017-11-16 | 2023-10-01 | 美商蘭姆研究公司 | 具有轉動關節編碼器的晶圓搬運機器人 |
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| KR20080002818A (ko) * | 2005-04-11 | 2008-01-04 | 니혼 덴산 산쿄 가부시키가이샤 | 다관절형 로보트 |
| US9117859B2 (en) * | 2006-08-31 | 2015-08-25 | Brooks Automation, Inc. | Compact processing apparatus |
| US7946800B2 (en) * | 2007-04-06 | 2011-05-24 | Brooks Automation, Inc. | Substrate transport apparatus with multiple independently movable articulated arms |
| US9610131B2 (en) * | 2008-11-05 | 2017-04-04 | The Johns Hopkins University | Rotating needle driver and apparatuses and methods related thereto |
| CN102326244B (zh) | 2009-01-11 | 2014-12-17 | 应用材料公司 | 用于在电子器件制造中传输基板的机械手系统、装置及方法 |
| JP5402233B2 (ja) * | 2009-05-19 | 2014-01-29 | 株式会社安川電機 | ロボット及び物品搬送システム |
| US8285418B2 (en) * | 2009-07-23 | 2012-10-09 | Kla-Tencor Corporation | Dual scanning stage |
| JP5499647B2 (ja) * | 2009-11-10 | 2014-05-21 | 株式会社安川電機 | ロボット及びロボットシステム |
| JP5568328B2 (ja) * | 2010-02-08 | 2014-08-06 | 川崎重工業株式会社 | 搬送装置 |
| US8616821B2 (en) * | 2010-08-26 | 2013-12-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated apparatus to assure wafer quality and manufacturability |
| US20120063874A1 (en) * | 2010-09-15 | 2012-03-15 | Applied Materials, Inc. | Low profile dual arm vacuum robot |
| KR102223624B1 (ko) | 2010-11-10 | 2021-03-05 | 브룩스 오토메이션 인코퍼레이티드 | 기판 처리 장치 |
| KR102047033B1 (ko) | 2011-03-11 | 2019-11-20 | 브룩스 오토메이션 인코퍼레이티드 | 기판 처리 툴 |
| US9184078B2 (en) * | 2011-05-07 | 2015-11-10 | Brooks Automation, Inc. | Narrow width loadport mechanism for cleanroom material transfer systems |
| KR20130083857A (ko) * | 2012-01-13 | 2013-07-23 | 노벨러스 시스템즈, 인코포레이티드 | 듀얼 암 진공 로봇 |
| KR20150003803A (ko) | 2012-04-12 | 2015-01-09 | 어플라이드 머티어리얼스, 인코포레이티드 | 독립적으로 회전가능한 웨이스트들을 갖는 로봇 시스템들, 장치 및 방법들 |
| WO2014008009A1 (en) * | 2012-07-05 | 2014-01-09 | Applied Materials, Inc | Boom drive apparatus, multi-arm robot apparatus, electronic device processing systems, and methods for transporting substrates in electronic device manufacturing systems |
| KR101212195B1 (ko) * | 2012-07-19 | 2012-12-13 | 미원정밀공업(주) | 탠덤 프레스 라인용 더블 로봇라인을 이용한 프레스 성형품 자동 제조시스템 |
| CN103802090A (zh) * | 2012-11-08 | 2014-05-21 | 沈阳新松机器人自动化股份有限公司 | 一种双臂搬运机械手 |
| JP5532110B2 (ja) * | 2012-11-16 | 2014-06-25 | 株式会社安川電機 | 基板搬送ロボットおよび基板搬送方法 |
| US9281222B2 (en) * | 2013-03-15 | 2016-03-08 | Applied Materials, Inc. | Wafer handling systems and methods |
| KR102308221B1 (ko) * | 2013-06-05 | 2021-10-01 | 퍼시몬 테크놀로지스 코포레이션 | 로봇 및 적응형 배치 시스템 및 방법 |
| US11201073B2 (en) * | 2013-08-26 | 2021-12-14 | Brooks Automation, Inc | Substrate transport apparatus |
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| KR20220139430A (ko) * | 2015-02-06 | 2022-10-14 | 퍼시몬 테크놀로지스 코포레이션 | 동등하지 않은 링크 길이를 가진 아암을 구비한 로봇 |
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| US10903107B2 (en) * | 2017-07-11 | 2021-01-26 | Brooks Automation, Inc. | Semiconductor process transport apparatus comprising an adapter pendant |
| US11088004B2 (en) | 2018-01-30 | 2021-08-10 | Brooks Automation, Inc. | Automatic wafer centering method and apparatus |
| TWI815869B (zh) | 2018-03-16 | 2023-09-21 | 美商布魯克斯自動機械美國公司 | 基板輸送裝置及用於基板輸送裝置之方法 |
| JP7347892B2 (ja) * | 2019-09-18 | 2023-09-20 | 株式会社ダイヘン | 搬送ロボットおよびこれを備えたワーク搬送システム |
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| CN110854050B (zh) * | 2019-12-12 | 2025-10-03 | 北京京仪自动化装备技术股份有限公司 | 晶圆映射传感器的安装机构 |
| KR102888808B1 (ko) | 2020-07-24 | 2025-11-21 | 삼성전자주식회사 | 그립 장치 및 이를 포함하는 로봇 장치 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| EP0265517A1 (en) | 1986-05-16 | 1988-05-04 | EASTMAN KODAK COMPANY (a New Jersey corporation) | Article transfer apparatus |
| JP2511273B2 (ja) | 1987-07-30 | 1996-06-26 | 能美防災株式会社 | 火災感知装置 |
| JP2567628B2 (ja) | 1987-10-06 | 1996-12-25 | 三洋電機株式会社 | ファクシミリ装置 |
| JP2745565B2 (ja) | 1988-09-30 | 1998-04-28 | ソニー株式会社 | 物体の形状を表す曲線データ作成方法 |
| US5054831A (en) | 1989-04-07 | 1991-10-08 | Rutgers University | Piercing element gripping apparatus |
| DE3931556A1 (de) | 1989-09-22 | 1991-04-04 | Kurz Leonhard Fa | Verfahren zum dekorieren von gegenstaenden und vorrichtung zur durchfuehrung des verfahrens |
| JPH03239483A (ja) | 1990-02-15 | 1991-10-25 | Fanuc Ltd | 産業用ロボットの駆動機構 |
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| JPH0414635A (ja) | 1990-05-09 | 1992-01-20 | Hitachi Ltd | 情報記録用部材 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI816713B (zh) * | 2017-11-16 | 2023-10-01 | 美商蘭姆研究公司 | 具有轉動關節編碼器的晶圓搬運機器人 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010531739A (ja) | 2010-09-30 |
| CN101711429A (zh) | 2010-05-19 |
| TW200848230A (en) | 2008-12-16 |
| US7946800B2 (en) | 2011-05-24 |
| US8651796B2 (en) | 2014-02-18 |
| WO2008124108A1 (en) | 2008-10-16 |
| JP2015053509A (ja) | 2015-03-19 |
| TWI478797B (zh) | 2015-04-01 |
| US20110224822A1 (en) | 2011-09-15 |
| JP6027072B2 (ja) | 2016-11-16 |
| KR101475421B1 (ko) | 2014-12-23 |
| KR20100016298A (ko) | 2010-02-12 |
| US20080249651A1 (en) | 2008-10-09 |
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