KR100981078B1 - 박판 형상물의 변위량 검출 방법 및 변위량 수정 방법 - Google Patents
박판 형상물의 변위량 검출 방법 및 변위량 수정 방법 Download PDFInfo
- Publication number
- KR100981078B1 KR100981078B1 KR1020067000394A KR20067000394A KR100981078B1 KR 100981078 B1 KR100981078 B1 KR 100981078B1 KR 1020067000394 A KR1020067000394 A KR 1020067000394A KR 20067000394 A KR20067000394 A KR 20067000394A KR 100981078 B1 KR100981078 B1 KR 100981078B1
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- KR
- South Korea
- Prior art keywords
- thin plate
- shaped object
- detection means
- displacement
- displacement amount
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/02—Sensing devices
- B25J19/021—Optical sensing devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Numerical Control (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Controlling Sheets Or Webs (AREA)
Abstract
Description
Claims (5)
- 박판 형상물의 취급 장치에 그 취급 장치의 위치를 포함하는 X,Y 좌표계 하에서, 상기 박판 형상물의 변위량을 검출할 때에,박판 형상물을 보관 유지하는 엔드 이펙터의 지지 암상에, 암의 회동 중심으로부터의 거리가 상이한 관계에 조금 이동시켜 장착된 コ자 형상체의 개방구 측에 투광기와 수광기로 이루어진 복수개의 투과형 센서를, 해당 지지 암의 회동에 의해 コ자 형상체의 개방구의 원호 궤적이 엔드 이펙터에 보관 유지된 상기 박판 형상물의 가장자리부와 교차하는 위치에 설치하여,상기 1개의 투과형 센서가 상기 박판 형상물의 가장자리부를 교차했을 때에 얻을 수 있는 각도를 나타내는 수치와 미리 교시된 수치를 비교해 X좌표의 수정 변위량을 산출해,상기 복수개의 투과형 센서가 상기 박판 형상물의 가장자리부를 교차했을 때에 얻을 수 있는 각도를 나타내는 수치에 의해 기울기 각도량을 산출하는 것을 특징으로 하는 박판 형상물의 변위량 검출 방법.
- 제 1 항에 있어서,상기 수정 변위량의 검출은 박판 형상물을 그 선반단 상으로 수납해서 이루어진 카세트로부터 인출하는 동작 중에 행하여지는 것을 특징으로 하는 박판 형상물의 변위량 검출 방법.
- 삭제
- 삭제
- 제 1 항 또는 제 2 항에 있어서, 산출된 수정 변위량 및 기울기 각도량을 기초로 취급 장치를 기준 좌표에서 소정의 위치로 이동시켜서 박판 형상물을 교시위치로 수정하는 것을 특징으로 하는 박판 형상물 변위량 수정 방법.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2003/008629 WO2005004227A1 (ja) | 2003-07-07 | 2003-07-07 | 薄板状物の変位量検出方法及び変位量修正方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060065627A KR20060065627A (ko) | 2006-06-14 |
KR100981078B1 true KR100981078B1 (ko) | 2010-09-08 |
Family
ID=33562099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067000394A KR100981078B1 (ko) | 2003-07-07 | 2003-07-07 | 박판 형상물의 변위량 검출 방법 및 변위량 수정 방법 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP4395873B2 (ko) |
KR (1) | KR100981078B1 (ko) |
CN (1) | CN1802736B (ko) |
AU (1) | AU2003304309A1 (ko) |
TW (1) | TWI230782B (ko) |
WO (1) | WO2005004227A1 (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7946800B2 (en) | 2007-04-06 | 2011-05-24 | Brooks Automation, Inc. | Substrate transport apparatus with multiple independently movable articulated arms |
US8752449B2 (en) | 2007-05-08 | 2014-06-17 | Brooks Automation, Inc. | Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism |
JP5146641B2 (ja) | 2007-06-06 | 2013-02-20 | 株式会社安川電機 | 基板搬送ロボットおよび基板搬送ロボットの制御方法 |
JP4697192B2 (ja) * | 2007-06-12 | 2011-06-08 | 東京エレクトロン株式会社 | 位置ずれ検出装置及びこれを用いた処理システム |
US20100162955A1 (en) * | 2008-12-31 | 2010-07-01 | Lawrence Chung-Lai Lei | Systems and methods for substrate processing |
US8958907B2 (en) * | 2011-03-31 | 2015-02-17 | Sinfonia Technology Co., Ltd. | Robot arm apparatus |
JP2012210676A (ja) * | 2011-03-31 | 2012-11-01 | Sinfonia Technology Co Ltd | ロボットアーム型搬送装置 |
JP5532110B2 (ja) * | 2012-11-16 | 2014-06-25 | 株式会社安川電機 | 基板搬送ロボットおよび基板搬送方法 |
CN103972135B (zh) * | 2013-01-25 | 2017-02-22 | 上海微电子装备有限公司 | 一种硅片精确定位传输装置及定位方法 |
JP2016143787A (ja) * | 2015-02-03 | 2016-08-08 | 川崎重工業株式会社 | 基板搬送ロボットおよび基板搬送方法 |
CN106956290B (zh) | 2017-04-17 | 2019-09-10 | 京东方科技集团股份有限公司 | 机械臂及其操作方法、机械臂装置及显示面板生产设备 |
CN109877822A (zh) * | 2017-12-06 | 2019-06-14 | 沈阳新松机器人自动化股份有限公司 | 一种双取纠偏双臂机器人及其纠偏方法 |
CN109877823A (zh) * | 2017-12-06 | 2019-06-14 | 沈阳新松机器人自动化股份有限公司 | 一种双放纠偏双臂机器人及其纠偏方法 |
JP7443142B2 (ja) | 2020-04-10 | 2024-03-05 | ニデックインスツルメンツ株式会社 | 産業用ロボットおよび産業用ロボットの制御方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07335723A (ja) * | 1994-06-08 | 1995-12-22 | Nikon Corp | 位置決め装置 |
JP2003142559A (ja) | 2001-08-08 | 2003-05-16 | Tokyo Electron Ltd | 基板搬送装置、基板処理システム及び基板搬送方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11106044A (ja) * | 1997-10-08 | 1999-04-20 | Mitsubishi Electric Corp | 基板搬送装置および基板搬送方法 |
JP2002093882A (ja) * | 2000-09-20 | 2002-03-29 | Olympus Optical Co Ltd | 基板搬送装置及び基板検査システム |
TW550651B (en) * | 2001-08-08 | 2003-09-01 | Tokyo Electron Ltd | Substrate conveying apparatus, substrate processing system, and substrate conveying method |
-
2003
- 2003-07-07 AU AU2003304309A patent/AU2003304309A1/en not_active Abandoned
- 2003-07-07 KR KR1020067000394A patent/KR100981078B1/ko active IP Right Grant
- 2003-07-07 JP JP2005503395A patent/JP4395873B2/ja not_active Expired - Lifetime
- 2003-07-07 TW TW092118459A patent/TWI230782B/zh not_active IP Right Cessation
- 2003-07-07 WO PCT/JP2003/008629 patent/WO2005004227A1/ja active Application Filing
- 2003-07-07 CN CN03826756.XA patent/CN1802736B/zh not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07335723A (ja) * | 1994-06-08 | 1995-12-22 | Nikon Corp | 位置決め装置 |
JP2003142559A (ja) | 2001-08-08 | 2003-05-16 | Tokyo Electron Ltd | 基板搬送装置、基板処理システム及び基板搬送方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1802736A (zh) | 2006-07-12 |
JP4395873B2 (ja) | 2010-01-13 |
KR20060065627A (ko) | 2006-06-14 |
JPWO2005004227A1 (ja) | 2006-09-28 |
CN1802736B (zh) | 2013-01-09 |
WO2005004227A1 (ja) | 2005-01-13 |
AU2003304309A1 (en) | 2005-01-21 |
TW200502531A (en) | 2005-01-16 |
TWI230782B (en) | 2005-04-11 |
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