KR20060065627A - 박판 형상물의 변위량 검출 방법 및 변위량 수정 방법 - Google Patents
박판 형상물의 변위량 검출 방법 및 변위량 수정 방법 Download PDFInfo
- Publication number
- KR20060065627A KR20060065627A KR1020067000394A KR20067000394A KR20060065627A KR 20060065627 A KR20060065627 A KR 20060065627A KR 1020067000394 A KR1020067000394 A KR 1020067000394A KR 20067000394 A KR20067000394 A KR 20067000394A KR 20060065627 A KR20060065627 A KR 20060065627A
- Authority
- KR
- South Korea
- Prior art keywords
- thin plate
- shaped object
- displacement amount
- detection means
- support arm
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/02—Sensing devices
- B25J19/021—Optical sensing devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/40—Robotics, robotics mapping to robotics vision
- G05B2219/40562—Position and orientation of end effector, teach probe, track them
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Numerical Control (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Controlling Sheets Or Webs (AREA)
Abstract
Description
Claims (5)
- 박판 형상물의 취급 장치에 그 취급 장치의 위치를 포함한 기준 좌표계 하에서, 상기 박판 형상물의 변위량을 검출할 때에 박판 형상물을 유지하는 엔드 이펙터의 지지 암 상에 검출 수단을 설치하고, 지지 암의 회동에 의해 상기 박판 형상물의 가장자리부와 검출 수단의 원호 궤적이 교차하는 것으로 하고, 이것에 의해 얻어지는 수치와 미리 설정되어 있는 박판 형상물의 상기 수치를 비교해서 수정 변위량을 산출하는 것으로 이루어지는 것을 특징으로 하는 박판 형상물의 변위량 검출 방법.
- 제 1 항에 있어서,상기 수정 변위량의 검출은 박판 형상물을 그 선반단 상으로 수납해서 이루어진 카세트로부터 인출하는 동작 중에 행하여지는 것을 특징으로 하는 박판 형상물의 변위량 검출 방법.
- 제 1 항 또는 제 2 항에 있어서,상기 변위량 검출 수단은 コ자 형상체로 구성하고, 또한 그 개방구를 엔드 이펙터 측이 되도록 해서 엔드 이펙터의 전방측 지지 암 상에 배치하는 것 외에, 그 개방구는 박판 형상물의 가장자리부가 통과할 수 있는 간극 치수를 갖는 것으로 이루어지는 것을 특징으로 하는 박판 형상물의 변위량 검출 방법.
- 제 3 항에 있어서,상기 コ자 형상체의 개방구 측에 투광기와 수광기로 이루어지는 투과형 센서 1개 또는 복수 개를 암의 회동 중심으로부터의 거리가 상이한 관계로 조금 이동시켜 설치하고, 지지 암의 회동에 의해 박판 형상물의 가장자리부의 1개소 또는 복수 개소가 동시에 검출되는 것으로 이루어져 있는 것을 특징으로 하는 박판 형상물의 변위량 검출 방법.
- 제 1 항 내지 제 4 항 중 어느 한 항에 있어서, 산출된 수정 변위량을 기초로 취급 장치를 기준 좌표에서 소정의 위치로 이동시켜서 수정하는 것을 특징으로 하는 박판 형상물 변위량 수정 방법.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2003/008629 WO2005004227A1 (ja) | 2003-07-07 | 2003-07-07 | 薄板状物の変位量検出方法及び変位量修正方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060065627A true KR20060065627A (ko) | 2006-06-14 |
KR100981078B1 KR100981078B1 (ko) | 2010-09-08 |
Family
ID=33562099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067000394A KR100981078B1 (ko) | 2003-07-07 | 2003-07-07 | 박판 형상물의 변위량 검출 방법 및 변위량 수정 방법 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP4395873B2 (ko) |
KR (1) | KR100981078B1 (ko) |
CN (1) | CN1802736B (ko) |
AU (1) | AU2003304309A1 (ko) |
TW (1) | TWI230782B (ko) |
WO (1) | WO2005004227A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101031843B1 (ko) * | 2007-06-12 | 2011-05-02 | 도쿄엘렉트론가부시키가이샤 | 위치 어긋남 검출 장치 및 이것을 이용한 처리 시스템 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7946800B2 (en) | 2007-04-06 | 2011-05-24 | Brooks Automation, Inc. | Substrate transport apparatus with multiple independently movable articulated arms |
US8752449B2 (en) | 2007-05-08 | 2014-06-17 | Brooks Automation, Inc. | Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism |
JP5146641B2 (ja) | 2007-06-06 | 2013-02-20 | 株式会社安川電機 | 基板搬送ロボットおよび基板搬送ロボットの制御方法 |
US20100162955A1 (en) * | 2008-12-31 | 2010-07-01 | Lawrence Chung-Lai Lei | Systems and methods for substrate processing |
JP2012210676A (ja) * | 2011-03-31 | 2012-11-01 | Sinfonia Technology Co Ltd | ロボットアーム型搬送装置 |
US8958907B2 (en) | 2011-03-31 | 2015-02-17 | Sinfonia Technology Co., Ltd. | Robot arm apparatus |
JP5532110B2 (ja) * | 2012-11-16 | 2014-06-25 | 株式会社安川電機 | 基板搬送ロボットおよび基板搬送方法 |
CN103972135B (zh) * | 2013-01-25 | 2017-02-22 | 上海微电子装备有限公司 | 一种硅片精确定位传输装置及定位方法 |
JP2016143787A (ja) * | 2015-02-03 | 2016-08-08 | 川崎重工業株式会社 | 基板搬送ロボットおよび基板搬送方法 |
CN106956290B (zh) | 2017-04-17 | 2019-09-10 | 京东方科技集团股份有限公司 | 机械臂及其操作方法、机械臂装置及显示面板生产设备 |
CN109877822A (zh) * | 2017-12-06 | 2019-06-14 | 沈阳新松机器人自动化股份有限公司 | 一种双取纠偏双臂机器人及其纠偏方法 |
CN109877823A (zh) * | 2017-12-06 | 2019-06-14 | 沈阳新松机器人自动化股份有限公司 | 一种双放纠偏双臂机器人及其纠偏方法 |
JP7443142B2 (ja) | 2020-04-10 | 2024-03-05 | ニデックインスツルメンツ株式会社 | 産業用ロボットおよび産業用ロボットの制御方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07335723A (ja) * | 1994-06-08 | 1995-12-22 | Nikon Corp | 位置決め装置 |
JPH11106044A (ja) * | 1997-10-08 | 1999-04-20 | Mitsubishi Electric Corp | 基板搬送装置および基板搬送方法 |
JP2002093882A (ja) * | 2000-09-20 | 2002-03-29 | Olympus Optical Co Ltd | 基板搬送装置及び基板検査システム |
TW550651B (en) * | 2001-08-08 | 2003-09-01 | Tokyo Electron Ltd | Substrate conveying apparatus, substrate processing system, and substrate conveying method |
JP3960162B2 (ja) | 2001-08-08 | 2007-08-15 | 東京エレクトロン株式会社 | 基板搬送装置、基板処理システム及び基板搬送方法 |
-
2003
- 2003-07-07 KR KR1020067000394A patent/KR100981078B1/ko active IP Right Grant
- 2003-07-07 TW TW092118459A patent/TWI230782B/zh not_active IP Right Cessation
- 2003-07-07 WO PCT/JP2003/008629 patent/WO2005004227A1/ja active Application Filing
- 2003-07-07 JP JP2005503395A patent/JP4395873B2/ja not_active Expired - Lifetime
- 2003-07-07 AU AU2003304309A patent/AU2003304309A1/en not_active Abandoned
- 2003-07-07 CN CN03826756.XA patent/CN1802736B/zh not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101031843B1 (ko) * | 2007-06-12 | 2011-05-02 | 도쿄엘렉트론가부시키가이샤 | 위치 어긋남 검출 장치 및 이것을 이용한 처리 시스템 |
US8395136B2 (en) | 2007-06-12 | 2013-03-12 | Tokyo Electron Limited | Positional deviation detection apparatus and process system employing the same |
Also Published As
Publication number | Publication date |
---|---|
JPWO2005004227A1 (ja) | 2006-09-28 |
WO2005004227A1 (ja) | 2005-01-13 |
KR100981078B1 (ko) | 2010-09-08 |
JP4395873B2 (ja) | 2010-01-13 |
TW200502531A (en) | 2005-01-16 |
AU2003304309A1 (en) | 2005-01-21 |
TWI230782B (en) | 2005-04-11 |
CN1802736A (zh) | 2006-07-12 |
CN1802736B (zh) | 2013-01-09 |
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