AU2003304309A1 - Thin sheet-like article displacement detection method and displacement correction method - Google Patents

Thin sheet-like article displacement detection method and displacement correction method

Info

Publication number
AU2003304309A1
AU2003304309A1 AU2003304309A AU2003304309A AU2003304309A1 AU 2003304309 A1 AU2003304309 A1 AU 2003304309A1 AU 2003304309 A AU2003304309 A AU 2003304309A AU 2003304309 A AU2003304309 A AU 2003304309A AU 2003304309 A1 AU2003304309 A1 AU 2003304309A1
Authority
AU
Australia
Prior art keywords
displacement
thin sheet
article
detection method
correction method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003304309A
Inventor
Fumio Sakiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rorze Corp
Original Assignee
Rorze Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rorze Corp filed Critical Rorze Corp
Publication of AU2003304309A1 publication Critical patent/AU2003304309A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • B25J19/021—Optical sensing devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40562—Position and orientation of end effector, teach probe, track them
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Numerical Control (AREA)
  • Controlling Sheets Or Webs (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
AU2003304309A 2003-07-07 2003-07-07 Thin sheet-like article displacement detection method and displacement correction method Abandoned AU2003304309A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/008629 WO2005004227A1 (en) 2003-07-07 2003-07-07 Thin sheet-like article displacement detection method and displacement correction method

Publications (1)

Publication Number Publication Date
AU2003304309A1 true AU2003304309A1 (en) 2005-01-21

Family

ID=33562099

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003304309A Abandoned AU2003304309A1 (en) 2003-07-07 2003-07-07 Thin sheet-like article displacement detection method and displacement correction method

Country Status (6)

Country Link
JP (1) JP4395873B2 (en)
KR (1) KR100981078B1 (en)
CN (1) CN1802736B (en)
AU (1) AU2003304309A1 (en)
TW (1) TWI230782B (en)
WO (1) WO2005004227A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10434642B2 (en) 2017-04-17 2019-10-08 Boe Technology Group Co., Ltd. Mechanical arm and operation method thereof, mechanical arm device and manufacturing equipment for display panel

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7946800B2 (en) 2007-04-06 2011-05-24 Brooks Automation, Inc. Substrate transport apparatus with multiple independently movable articulated arms
US8752449B2 (en) 2007-05-08 2014-06-17 Brooks Automation, Inc. Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism
JP5146641B2 (en) 2007-06-06 2013-02-20 株式会社安川電機 Substrate transfer robot and control method of substrate transfer robot
JP4697192B2 (en) * 2007-06-12 2011-06-08 東京エレクトロン株式会社 Position shift detection device and processing system using the same
US20100162955A1 (en) * 2008-12-31 2010-07-01 Lawrence Chung-Lai Lei Systems and methods for substrate processing
US8958907B2 (en) * 2011-03-31 2015-02-17 Sinfonia Technology Co., Ltd. Robot arm apparatus
JP2012210676A (en) * 2011-03-31 2012-11-01 Sinfonia Technology Co Ltd Robot arm type transport apparatus
JP5532110B2 (en) * 2012-11-16 2014-06-25 株式会社安川電機 Substrate transfer robot and substrate transfer method
CN103972135B (en) * 2013-01-25 2017-02-22 上海微电子装备有限公司 Silicon wafer accurate positioning and conveying device and positioning method
JP2016143787A (en) * 2015-02-03 2016-08-08 川崎重工業株式会社 Substrate transfer robot and substrate transfer method
CN109877822A (en) * 2017-12-06 2019-06-14 沈阳新松机器人自动化股份有限公司 A kind of pair takes correction tow-armed robot and its method for correcting error
CN109877823A (en) * 2017-12-06 2019-06-14 沈阳新松机器人自动化股份有限公司 A kind of pair puts correction tow-armed robot and its method for correcting error
JP7443142B2 (en) 2020-04-10 2024-03-05 ニデックインスツルメンツ株式会社 Industrial robots and industrial robot control methods

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335723A (en) * 1994-06-08 1995-12-22 Nikon Corp Positioning device
JPH11106044A (en) * 1997-10-08 1999-04-20 Mitsubishi Electric Corp Substrate carrier device and substrate carrying method
JP2002093882A (en) * 2000-09-20 2002-03-29 Olympus Optical Co Ltd Substrate-transferring device and substrate-inspecting system
TW550651B (en) * 2001-08-08 2003-09-01 Tokyo Electron Ltd Substrate conveying apparatus, substrate processing system, and substrate conveying method
JP3960162B2 (en) * 2001-08-08 2007-08-15 東京エレクトロン株式会社 Substrate transfer apparatus, substrate processing system, and substrate transfer method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10434642B2 (en) 2017-04-17 2019-10-08 Boe Technology Group Co., Ltd. Mechanical arm and operation method thereof, mechanical arm device and manufacturing equipment for display panel

Also Published As

Publication number Publication date
JPWO2005004227A1 (en) 2006-09-28
JP4395873B2 (en) 2010-01-13
TW200502531A (en) 2005-01-16
TWI230782B (en) 2005-04-11
WO2005004227A1 (en) 2005-01-13
KR20060065627A (en) 2006-06-14
CN1802736A (en) 2006-07-12
KR100981078B1 (en) 2010-09-08
CN1802736B (en) 2013-01-09

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase