TWI230782B - Displacement detecting method of sheet and displacement modifying method thereof - Google Patents

Displacement detecting method of sheet and displacement modifying method thereof Download PDF

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Publication number
TWI230782B
TWI230782B TW092118459A TW92118459A TWI230782B TW I230782 B TWI230782 B TW I230782B TW 092118459 A TW092118459 A TW 092118459A TW 92118459 A TW92118459 A TW 92118459A TW I230782 B TWI230782 B TW I230782B
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TW
Taiwan
Prior art keywords
thin plate
displacement
support arm
detection mechanism
end effector
Prior art date
Application number
TW092118459A
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Chinese (zh)
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TW200502531A (en
Inventor
Fumio Sakiya
Original Assignee
Rorze Corp
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Publication of TW200502531A publication Critical patent/TW200502531A/en
Application granted granted Critical
Publication of TWI230782B publication Critical patent/TWI230782B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • B25J19/021—Optical sensing devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40562—Position and orientation of end effector, teach probe, track them
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Numerical Control (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Controlling Sheets Or Webs (AREA)

Abstract

When taking out or storing sheets, a proper position and a shifted position of a sheet on an end effector of a supporting arm are detected, and modifying operation is carried out effectively. A detecting means, which forms C letter shape and provides its aperture to the end effector side and has enough depth not to interfere with a passing sheet, is provided on the supporting arm.

Description

1230782 玖、發明說明： 【發明所屬之技術領域】 本發明係關於，操作薄板狀物的搬運機器人，於 運、加工而載放薄板之際需要高度精準的定位，尤其 於，在將半導體晶圓、液晶顯示板用基板、電漿顯示 板、有機 EL( ORGANIC ELECTRO LUMINESCENT)基板 機 EL ( ELECTRO LUMINESCENT )基板、芒「刷電路配、線 等薄板狀物，移動於卡匣和各種處理裝置之間時的搬 置。 【先前技術】 一般而言半導體、液晶用基板等薄板狀物都是在向 潔的環境也就是所謂的無塵室内進行製造。該無塵室 上述薄板狀物的搬運，多將薄板狀物收納於卡匣内的 上，用卡匣板運用大型機器人來連同卡匣整個一起搬 圖 1 3所示為關於本案申請人先前所使用的操作裝 之圖。在本裝置中具備：設置卡匣3用的多個檯24、 各種處理的處理裝置6、在卡匣3和上述處理裝置6 搬運薄板狀物2的先前技術的搬運機器人4、將該搬 器人4移動到處理裝置6或者卡匣3的搬出入口 2 5正 直線移動機構5，用該等裝置實施加工處理的薄板狀啦 從卡匣3的棚架2 6上取出，移動到處理裝置6的載 2 3並且載放在其上。 之後，在處理裝置6内對於薄板狀物2實施各種加 理。此時對載放薄板狀物2的位置精確度，有需要高 312/發明說明書(補件)/92-09/92118459 為搬 是關 器基 、無 基板 運裝 度清 内的 棚架 運。 置 1 進行 之間 運機 面的 7 2, 放台 工處 度精 5 1230782 確加工處理之情形。例如，進行兩片薄板狀物2黏合處理 的情形，此時對於處理裝置的所定載放位置，第一片薄板 狀物 2和第二片操作裝置 1需要放置於事前預定的位置 上，分別都不能發生傾斜或者偏移。 但是，上述的卡匣3的棚架2 6上的薄板狀物2，在載放 時左右方向上都有某一程度的寬裕空隙，在這點上分別有 些微偏移的狀態下而被容納。從而，在這樣有偏移的狀態 下來將薄板狀物2搬運到處理裝置6的話，無法進行正確 的載放，造成處理製品的良品率惡化的問題。 用以解決該問題之先前技術，係在處置裝置附近另外備 置有能檢測出上述偏移狀態的檢測機構，藉以檢測出薄板 狀物的偏移並且計算出偏移量，進行修正，該等一連串的 處理步驟，參照圖1 3而說明如下： 在本實施例中檢測機構1 8設置於直線移動機構5上。 首先，以直線移動機構5的動作將搬運機器人4移動到 載放於檯24上的卡匣3正面，接著，使得該機器人手臂動 作而從卡匣3内部將薄板狀物2取出到末端效應器1 1上。 之後，再度由直線移動機構5的動作將搬運機器人4移動 到檢測機構1 8的正面位置，同時旋轉臂1 2、1 3使得載放 於末端效應器1 1上的薄板狀物2邊緣能夠遮斷檢測機構 1 8的光軸。以該旋轉使得薄板狀物2的邊緣部遮斷檢測機 構1 8的光軸所獲得的位置資訊，和所預定事前獲得的位置 資訊相比較而計算出變位量。然後，依照所算出的數值， 使搬運機器人4向處理裝置6的搬出入口 2 5正面移動，並 312/發明說明書(補件)/92-09/92118459 1230782 且以支撐臂1 4的動作，在將末端效應器1 1的薄板狀物2 載放於載放台2 3上之際，按照上述算出的數值而載放於修 正後的位置上。以上操作，係薄板狀物2在適當位置上進 行必要處理的操作，此後再度以搬運機器人4從處理裝置 6返回3 (再度收納）。 上述之檢測機構1 8，如圖示例所示設於搬運機器人4的 移動途中，依上述方法使用，也可分別備置在多個處理裝 置前面側。於此，檢測機構1 8係由投光器1 9和受光器2 0 所組成的光學式透過型感測器，光軸係為一筆直而備於裝 置中央。 附帶說明，事前預定的位置資訊，係在搬運機器人4的 末端效應器1 1上薄板狀物2位於正確位置上之時，該薄板 狀物2的邊緣部遮斷檢測機構1 8光軸時的位置資訊。 此外，上述裝置中的搬運機器人4係為無塵室用平面關 節型（S C A R A )搬運機器人4，由吸附保持薄板狀物2的末 端效應器11、以可旋轉的方式支撐末端效應器11的支撐 臂1 4 (圖中係由下支撐臂1 3和上支撐臂1 2兩者組成）而 可旋轉的旋轉部1 5、可使旋轉部1 5在高度方向上移動的 升降機構1 6、和基台1 7所組成。 (專利文獻1 ):日本專利特開平9 - 3 6 2 0 1號公報 (專利文獻2 ):日本專利特開平9 - 1 6 2 2 5 7號公報 【發明内容】 (發明所欲解決之問題） 圖1 3所示操作裝置1，必須在從卡匣3將薄板狀物2搬 7 312/發明說明書(補件)/92-09/92118459 1230782 到處理裝置 6的途中的檢測機構 1 8之處使搬運機器人4 停止而加以檢測，而上述從卡匣取出和再度放入的一個工 作循環所需要的搬運時間也大為增加，因此使得生產效率 降低。 此外，因為檢測機構 1 8備於搬運機器人4的直線移動 機構5上，在搬運機器人4的移動中，為防止支撐臂等之 間的干擾，必須加長投光器1 9和受光器2 0之間的距離， 但是如此增加光軸的長度後的檢測機構 1 8價格非常昂 貴，並且造成使光軸調整更加困難等問題。若以未充分調 整過的檢測機構1 8做檢測的話，會使檢測精確度下降而發 生不良的問題。 專利文獻1所示圖2的發明中，提出的裝置，每個處理 裝置的薄板狀物 6的載放台1 8都分別具備多個檢測機構 3 1。該裝置中為了檢測出薄板狀物6的變位量，必須對每 個載放台1 8都配置檢測機構，因此除了增加成本之外，也 因每個檢測機構 3 1都需要調整而造成作業效率下降的問 題。 在專利文獻2所示圖7的發明中，提出的裝置具備：搬 運檢測機構 1 4的機器人的效應器 3 1 c。在該搬運機器人 中，因為需要另外備置用來旋轉檢測機構1 4的馬達等動力 來源，故除了需要另外的費用之外，也造成機器組件更加 複雜並且動作控制也更困難的問題。 (解決問題之手段） 本發明為申請人將所使用的操作裝置改良後之作品，其 8 31刀發明說明書(補件)/92-09/92118459 1230782 特徵為：於薄板狀物操作裝置，基於包含該操作裝置位置 在内的基準座標系，在檢測出上述薄板狀物變位量時，於 維持薄板狀物的末端效應器支撐臂上安裝檢測機構，因支 撐臂的旋轉而使上述薄板狀物邊緣部和檢測機構的圓弧軌 跡交叉，由此所得的數值和預先設定的薄板狀物該當數值 相比較而算出修正變位量。 於申請專利範圍第2項中，其特徵為：上述修正變位量 之檢測，係於將薄板狀物從其所被容納的卡匣棚架上取出 的動作中所進行。 於申請專利範圍第3項中，其特徵為：安裝於支撐臂上 的變位量檢測機構，形成：？字形狀，並且除了開口配置在 末端效應器前方側支撐臂上，使得開口處在末端效應器側 之外，該開口也具有能讓薄板狀物邊緣部通過的隙縫尺寸。 於申請專利範圍第4項中，係關於安裝於口字形狀變位 量檢測機構開口側的一個或者多個由投光器和受光器組成 的透過型感測器的數目和配置，換言之，在多個配置中使 其等與支撐臂旋轉中心之間的距離分別略為不同，藉由支 撐臂的旋轉即可同時檢測出薄板狀物邊緣部的一處或者多 處位置。 於申請專利範圍第5項中，在支撐臂旋轉動作中，依照 安裝於支撐臂上的^字形狀檢測機構所自動算出的修正變 位量，將操作裝置修正移動到基準座標所定的位置，使薄 板狀物載放於載置檯上的正確位置上。 換句話說，本發明的操作裝置1，在將薄板狀物2從卡 9 312/發明說明書(補件)/92-09/92118459 1230782 匣取出移動之際，可自動算出在末端效應器上載放的位 移，並且加以修正，係可載放於處理裝置的正確位置上之 裝置，其具體構成，係由握持或者吸附薄板狀物2而搬運 的公知機器人；可在薄板狀物2的卡匣3延伸方向移動該 搬運機器人4而具備螺絲釘軸等之直線移動機構5 ;並且 具有以搬運機器人4載放薄板狀物2的載放台2 3，且使該 載放台在水平面内直線移動或者旋轉，藉以進行薄板狀物 定位的行列狀裝置等所組成。 另一方面，包含操作裝置位置的基準座標系，即操作裝 置1接受來自控制機構7的動作命令而進行動作之際，包 含操作裝置1的起始位置、操作裝置1配設的位置、和交 付位置等之空間作為假想座標。 至於其他方面，例如本發明的檢測機構1 8，係光學式透 過型和反射型感測器，以非接觸而能檢測出薄板狀物2邊 緣部的感測器最佳。該檢測機構1 8係由投光器1 9和受光 器2 0所組成，使投光器1 9和受光器2 0，在口字形狀的固 定構件2 1前端附近互相相對，光軸呈筆直或者傾斜狀，藉 由遮蔽薄板狀物邊緣的光軸而檢測出其位置。 【實施方式】 圖1為將圖1 3所說明本案申請人的先前例改良後的操 作裝置1，本發明的改良點為：將備置於處理裝置6前面 或直線移動機構5上的檢測機構1 8除去，亦即改成獨特的 〕字形狀而備置於支撐臂1 4上。 以下說明本發明最佳實施形態之例。附帶說明，以下實 10 312/發明說明書(補件)/92-09/92118459 1230782 施形態並非限定本發明案之申請專利範圍。從而，凡熟習 該項技術人員可在本發明原理的範圍内採用其他實施形 態。 圖2為本發明檢測機構 1 8之部分放大立體圖。該檢測 機構1 8，係在具備扁平的開放口和深度之〕字形狀固定構 件2 1前端附近，具備投光器1 9和受光器2 0所組成，並且， 於安裝時口字形狀的開放口係朝向末端效應器 1 1側面而 設置。此時可以分別設置一個投光器1 9和一個受光器2 0， 也可如圖2所示設置多個在朝向内側的橫向位置。 本發明之中，在檢測機構1 8和支撐臂1 4的旋轉動作同 時旋轉時，維持於末端效應器1 1的薄板狀物2邊緣部，通 過口字形狀固定構件2 1的開放口，遮蔽從投光器1 9朝向 受光器2 0的光軸，如此即可進行薄板狀物2的位置檢測。 因此，^字形狀的開放口空隙P和其深度S的尺寸，可以 設計在不妨礙薄板狀物2邊緣部通過的範圍内。 然後，上述薄板狀物 2的末端效應器1 1上之偏移或者 傾斜的計算，可以X、Y軸座標系來表示支撐臂1 4的旋轉 而算出，具體而言，係以支撐末端效應器1 1的支撐臂14 的軸心作為X、Y軸座標的原點0，X軸為搬運機器人4移 動直線移動機構5的方向，相對於此，Y軸座標為於此成 直角相交的方向。以下，就其算出方法加以說明。 圖3 ( a )〜（c )中，在上支撐臂1 2備置有檢測機構1 8， 末端效應裔1 1上的薄板狀物2的虛線表不放在正確位置上 的狀態，相對於此，實線表示的是發生偏移的狀態。首先， 11 312/發明說明書(補件)/92-09/92118459 1230782 在正確位置（預定位置）上的數據取得方法如下：支撐臂 1 4旋轉，上支撐臂1 2上的感測器3 1則從圖3 ( a)的A位置， 旋轉到檢測圖3 ( c )的薄板狀物2邊緣部的B位置，如此即 可獲得該旋轉角度（測定值），具體而言，若起點A之座標 為（X A、Y a )，而預定位置B之座標為（X B、Y b )來測定該 旋轉角度，以所測定的旋轉角度為基準即可算出預定位置。 上述預定位置之座標算出公式如下： COS θ Β —sin θ Β Χα = r Χβ ^ sin θ β cos θ Β ^ .Υα. .Υβ. ···公式（1 ) 將公式（1 )展開即可得如下公式： ...公式1230782 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a handling robot that operates a thin plate, and requires highly accurate positioning when it is being transported, processed, and placed on a thin plate. , Substrates for liquid crystal display panels, plasma display panels, organic EL (ELECTRO LUMINESCENT) substrate machines, EL (ELECTRO LUMINESCENT) substrates, thin plates such as circuit boards, wires, etc., moved between the cassette and various processing devices [Prior art] Generally, thin plates such as semiconductors and liquid crystal substrates are manufactured in a clean environment, also known as a clean room. Many of these thin plates are handled in this clean room. The thin plate is stored on the inside of the cassette, and a large robot is used to move the cassette together with the cassette using the cassette plate. Figure 13 shows a diagram of the operating equipment previously used by the applicant in this case. : A plurality of tables 24 for the cassette 3, a processing device 6 for various processes, and a conventional conveyor for conveying a thin plate 2 between the cassette 3 and the processing device 6 described above Person 4: Move the person 4 to the processing device 6 or the loading and unloading inlet 2 of the cassette 3. The straight-line moving mechanism 5 uses the devices to perform the processing in a thin plate shape and take it out of the shelf 26 of the cassette 3. , Move to the load 2 3 of the processing device 6 and place on it. After that, various processing is performed on the thin plate 2 in the processing device 6. At this time, the position accuracy of the thin plate 2 is required. Gao 312 / Invention Manual (Supplement) / 92-09 / 92118459 It is a scaffolding that is used to move the base of the device, and it has no substrate. It is transported in the clearing room. Set 1 for 7 between the planes of the machine 2 and put in the work station Degree precision 5 1230782 The case where processing is indeed performed. For example, when two pieces of thin plate 2 are bonded, the first thin plate 2 and the second operating device 1 are required for the predetermined placement position of the processing device. When placed in a predetermined position beforehand, each of them cannot be tilted or shifted. However, the thin plate 2 on the shelf 26 of the cassette 3 described above has a certain degree of margin in the left and right directions when placed. Gaps, at this point slightly offset Therefore, if the thin plate-like object 2 is transported to the processing device 6 in such an offset state, correct placement cannot be performed, resulting in a problem that the yield of the processed product is deteriorated. The prior art to solve this problem In addition, a detection mechanism capable of detecting the above-mentioned offset state is additionally provided near the treatment device, so as to detect the offset of the thin plate-like object and calculate the offset amount to make corrections. Such a series of processing steps, refer to FIG. 1 3 The description is as follows: In this embodiment, the detection mechanism 18 is provided on the linear movement mechanism 5. First, the transfer robot 4 is moved to the front of the cassette 3 placed on the table 24 by the action of the linear movement mechanism 5. Then, The robot arm is caused to move, and the thin plate-like object 2 is taken out from the inside of the cassette 3 onto the end effector 11. After that, the robot 4 is moved to the front position of the detection mechanism 18 by the action of the linear movement mechanism 5 again, and the arms 1 2 and 1 3 are rotated at the same time so that the edges of the thin plate 2 placed on the end effector 11 can be covered. Optical axis of the break detection mechanism 18. By this rotation, the position information obtained by blocking the optical axis of the detection mechanism 18 by the edge portion of the thin plate 2 is compared with the position information obtained in advance to calculate the displacement amount. Then, according to the calculated value, the conveying robot 4 is moved to the front of the loading and unloading entrance 25 of the processing device 6, and 312 / Invention Specification (Supplement) / 92-09 / 92118459 1230782 is moved with the support arm 14 in When the thin plate-like object 2 of the end effector 11 is placed on the placing table 23, it is placed at the corrected position according to the value calculated as described above. The above operations are operations in which the thin plate-like object 2 is required to be processed at an appropriate position, and thereafter, the conveying robot 4 is returned from the processing device 6 to 3 (re-storing). The above-mentioned detection mechanism 18 is provided in the middle of the movement of the transfer robot 4 as shown in the example, and is used according to the above-mentioned method, and may also be separately provided on the front side of a plurality of processing devices. Here, the detection mechanism 18 is an optical transmission type sensor composed of a light projector 19 and a light receiver 20, and the optical axis is a straight line and is provided at the center of the device. Incidentally, the position information scheduled in advance is when the thin plate 2 on the end effector 1 1 of the transfer robot 4 is in the correct position, and the edge of the thin plate 2 blocks the detection mechanism 1 8 optical axis. Location information. In addition, the transfer robot 4 in the above device is a SCARA transfer robot 4 for a clean room. The end effector 11 of the thin plate 2 is sucked and held by the end effector 11 and the end effector 11 is rotatably supported. A rotating part 15 which is rotatable by an arm 14 (which is composed of both a lower supporting arm 13 and an upper supporting arm 12), a lifting mechanism 16 capable of moving the rotating part 15 in a height direction, and Composed of abutments 17. (Patent Document 1): Japanese Patent Laid-Open No. 9-3 6 2 0 1 (Patent Document 2): Japanese Patent Laid-Open No. 9-1 6 2 2 5 7 [Summary of the Invention] (Problems to be Solved by the Invention) ) The operating device 1 shown in FIG. 1 must be moved from the cassette 3 to the thin plate 2 7 312 / Invention Manual (Supplement) / 92-09 / 92118459 1230782 to the detection mechanism 1 on the way to the processing device 6 The handling robot 4 is stopped and detected, and the handling time required for the above-mentioned one cycle of taking out and re-inserting the cassette is also greatly increased, thereby reducing production efficiency. In addition, since the detection mechanism 18 is provided on the linear movement mechanism 5 of the transfer robot 4, in order to prevent interference between the support arms and the like during the movement of the transfer robot 4, it is necessary to lengthen the distance between the light projector 19 and the light receiver 20. The detection mechanism 18 after increasing the length of the optical axis in this way is very expensive and causes problems such as making the adjustment of the optical axis more difficult. If the detection mechanism 18 which is not sufficiently adjusted is used for detection, the detection accuracy will be lowered and a problem will occur. In the invention of Fig. 2 shown in Patent Document 1, the proposed device is provided with a plurality of detection mechanisms 3 1 on the placing table 18 of the thin plate-like object 6 of each processing device. In order to detect the displacement amount of the thin plate-like object 6 in this device, a detection mechanism must be provided for each mounting table 18, so in addition to increasing the cost, operations are also caused because each detection mechanism 31 needs to be adjusted. The problem of reduced efficiency. In the invention of FIG. 7 shown in Patent Document 2, the proposed device includes an effector 3 1 c of a robot that transports the detection mechanism 14. In this handling robot, since a power source such as a motor for rotating the detection mechanism 14 needs to be separately provided, in addition to requiring additional costs, it also causes problems of more complicated machine components and more difficult motion control. (Means for Solving the Problem) The present invention is an improved work piece used by the applicant. The invention of the 8-31 knife invention specification (Supplement) / 92-09 / 92118459 1230782 is characterized in that the device is operated on a thin plate. The reference coordinate system including the position of the operating device, when the displacement of the thin plate is detected, a detection mechanism is installed on the end effector support arm that maintains the thin plate, and the thin plate is caused by the rotation of the support arm. The edge of the object intersects with the arc trajectory of the detection mechanism, and the obtained value is compared with a preset value of the thin plate object to calculate the correction displacement. In item 2 of the scope of the patent application, it is characterized in that the detection of the above-mentioned correction displacement amount is performed in the action of removing the thin plate-like object from the cassette shelf in which it is accommodated. In item 3 of the scope of patent application, it is characterized by: a displacement detection mechanism installed on the support arm, forming:? In addition to the shape of the opening, the opening is arranged on the support arm on the front side of the end effector so that the opening is on the side of the end effector. The opening also has a slit size that allows the edge portion of the thin plate to pass through. In item 4 of the scope of patent application, it is about the number and configuration of one or more transmissive sensors composed of a light emitter and a light receiver, which are installed on the opening side of the mouth-shaped displacement detection mechanism, in other words, in multiple In the configuration, the distances between the equidistance and the rotation center of the support arm are slightly different, and one or more positions of the edge portion of the thin plate can be detected at the same time by the rotation of the support arm. In item 5 of the scope of the patent application, during the rotation of the support arm, the operating device is corrected and moved to the position determined by the reference coordinate according to the correction displacement automatically calculated by the shape detection mechanism installed on the support arm. The thin plate is placed in the correct position on the mounting table. In other words, when the operating device 1 of the present invention removes and moves the thin plate-shaped object 2 from the cassette 9 312 / Invention Manual (Supplement) / 92-09 / 92118459 1230782 box, it can automatically calculate the loading on the end effector. The displacement is corrected and it is a device that can be placed on the correct position of the processing device. Its specific structure is a known robot that is carried by holding or adsorbing the thin plate-like object 2; a cassette that can be placed on the thin plate-like object 2 3 The moving robot 4 is provided with a linear movement mechanism 5 such as a screw shaft to move the conveying robot 4; and a placing platform 2 3 for placing the thin plate-like object 2 by the conveying robot 4 and moving the placing platform linearly in a horizontal plane or It consists of a row-shaped device for positioning a thin plate to rotate. On the other hand, the reference coordinate system including the position of the operation device, that is, when the operation device 1 receives an operation command from the control mechanism 7 and operates, includes the starting position of the operation device 1, the position where the operation device 1 is provided, and the delivery Spaces such as positions are used as imaginary coordinates. As for other aspects, for example, the detection mechanism 18 of the present invention is an optical transmission type and a reflection type sensor, and a sensor capable of detecting the edge portion of the thin plate-like object 2 without contact is most preferable. The detection mechanism 18 is composed of a light projector 19 and a light receiver 20, so that the light projector 19 and the light receiver 20 are opposed to each other near the front end of the fixed member 21 with a square shape, and the optical axis is straight or inclined. The position is detected by masking the optical axis of the edge of the thin plate. [Embodiment] FIG. 1 is an improved operating device 1 of the applicant's previous example described in FIG. 13. The improvement point of the present invention is: a detection mechanism 1 provided in front of a processing device 6 or on a linear movement mechanism 5. 8 is removed, that is, changed to a unique shape, and is placed on the support arm 14. Examples of the best mode of the present invention will be described below. Incidentally, the following embodiment 10 312 / Invention Specification (Supplement) / 92-09 / 92118459 1230782 The application form does not limit the scope of patent application for the present invention. Therefore, those skilled in the art can adopt other implementation forms within the scope of the principles of the present invention. FIG. 2 is a partially enlarged perspective view of the detection mechanism 18 of the present invention. The detection mechanism 18 is provided near the front end of the 字 -shaped fixing member 21 having a flat opening and a depth, and is composed of a light emitter 19 and a light receiver 20, and has a mouth-shaped open mouth system at the time of installation. It is provided toward the side of the end effector 11. At this time, one light projector 19 and one light receiver 20 may be respectively provided, or a plurality of lateral positions facing inward may be provided as shown in FIG. 2. In the present invention, when the detection mechanism 18 and the support arm 14 are rotated at the same time, the edge portion of the thin plate 2 maintained at the end effector 11 is shielded by the opening of the mouth-shaped fixing member 21. From the light projector 19 toward the optical axis of the light receiver 20, the position of the thin plate-like object 2 can be detected. Therefore, the size of the opening opening gap P and the depth S of the square shape can be designed within a range that does not prevent the edge portion of the thin plate-like object 2 from passing. Then, the calculation of the offset or inclination on the end effector 11 of the thin plate-like object 2 can be calculated by expressing the rotation of the support arm 14 by the X and Y axis coordinate system. Specifically, the end effector is supported. The axis of the 11 support arm 14 is regarded as the origin 0 of the X and Y axis coordinates, and the X axis is the direction in which the transfer robot 4 moves the linear movement mechanism 5. In contrast, the Y axis coordinates are the directions where they intersect at right angles. The calculation method will be described below. In FIGS. 3 (a) to (c), the upper support arm 12 is provided with a detection mechanism 18, and the dotted line of the thin plate-like object 2 on the end effector 11 is not placed in the correct position. The solid line indicates the state where the shift has occurred. First, 11 312 / Invention Specification (Supplement) / 92-09 / 92118459 1230782 The data acquisition method at the correct position (predetermined position) is as follows: the support arm 1 4 rotates, and the sensor 3 on the upper support arm 1 2 Then, from the position A in FIG. 3 (a) to the position B of the edge portion of the thin plate 2 in FIG. 3 (c), the rotation angle (measurement value) can be obtained. Specifically, if the starting point A The coordinates are (XA, Y a), and the coordinates of the predetermined position B are (XB, Y b) to measure the rotation angle, and the predetermined position can be calculated based on the measured rotation angle. The formula for calculating the coordinates of the above predetermined position is as follows: COS θ Β —sin θ Β χα = r χβ ^ sin θ β cos θ Β ^. Υα.. Υβ. The following formula: ... formula

···公式（3 ) X b = X a c 〇 s θ β - Υ λ s i η θ β Υ β = X λ s i η θ β + Υ λ c ο s θ β 如此即可算出預定位置Β ( X Β、Υ Β )的數值。 接著，關於實線所示薄板狀物2的位移，係將支撐臂再 度旋轉，亦即測定圖3 ( c )中的座標（X。、Υ。），算出該變位 位置之座標的公式如下： r COS θ c —sin θ c Χα = Χ〇 sin θ c cos θ c 一 .Υα. .Yc. 將上式展開即可得如下公式： …公式（4 )··· Formula (3) X b = X ac 〇s θ β-Υ λ si η θ β Υ β = X λ si η θ β + Υ λ c ο s θ β In this way, the predetermined position B (X Β , Υ Β). Next, regarding the displacement of the thin plate-like object 2 shown by the solid line, the support arm is rotated again, that is, the coordinates (X., Υ.) In FIG. 3 (c) are measured, and the formula for calculating the coordinates of the displacement position is as follows : R COS θ c —sin θ c χα = χ〇sin θ c cos θ c -.Υα. .Yc. Expand the above formula to get the following formula:… Formula (4)

Xc = Xacos i9 c-Yas i η <9 c …公式（5)Xc = Xacos i9 c-Yas i η < 9 c… Formula (5)

Yc = XAsin0c + YAsin0c …公式（6) 如此即可算出變位位置C ( X c、Y c )的數值。 此外，為算出X軸方向上的變位量Lc，需求取上述預定 位置和變位位置之間的X座標值之差，其公式如下： 12 312/發明說明書(補件)/92-09/92118459 1230782Yc = XAsin0c + YAsin0c… Formula (6) In this way, the value of the displacement position C (X c, Y c) can be calculated. In addition, in order to calculate the displacement amount Lc in the X-axis direction, it is necessary to take the difference in the X coordinate value between the predetermined position and the displacement position, and the formula is as follows: 12 312 / Invention Specification (Supplement) / 92-09 / 92118459 1230782

Lc= I Xc-Xb I …公式（7 ) 依照公式（2 )和公式（5 )可得變位量L。如下列公式： Lc=| Xa(cos0b-cos0c)-YA(sin6lB-sin0c)| ...公式（8) 此即變位量Lc。 本發明中對於17字形狀的檢測機構1 8，也可具備有兩個 以上的感測器，接著以圖4說明安裝兩個感測器之例。兩 個感測器距離適當的間隔而設，如此可讓該等旋轉半徑分 別不同，以支撐臂1 4的旋轉而在薄板狀物2邊緣部上有效 率的檢測出兩處的位置。而且，如此也可以所檢測出的測 定值為基礎，計算出薄板狀物2的X軸方向的變位量和薄 板狀物傾斜40。 圖 4 (a )〜 '(c )也和圖3 ：相 同， 圖解 顯示該 算 出 機 構 〇 圖 中 顯 示 32 > 33 兩 個感 測 器， 末端效應器 11 上 的 虛 線 所 的 是 薄 板 狀物 2的預定位置， 相對 於此， 實 線 表 示 偏 移 態 的 位 置 。圖 中（b)係 以 支撐 臂14 的旋轉 算 出 預 定 位 置 狀 態 j 而 (c )為 算 出偏 移位置 的狀態之說明圖 〇 首 先 預 定位： 1的算出， 係以 下列 公式所 求 取 ； cos Θ 1 S —sin Θ E Xd = χΕ 公 式 (£ )) V· sin θ E cos θ Ε .Yd. L Ye. COS θ 1 Η —sin θ Η r 、 Xg = Xh 公 式 (1 〇 ) sin θ [ cos θ η 將 公 式 ( 9 )展 開 即可 得如下 公式：Lc = I Xc-Xb I… Formula (7) According to formula (2) and formula (5), the displacement amount L can be obtained. Such as the following formula: Lc = | Xa (cos0b-cos0c) -YA (sin6lB-sin0c) | ... Formula (8) This is the displacement Lc. In the present invention, the 17-shaped detection mechanism 18 may be provided with two or more sensors, and an example of mounting two sensors will be described with reference to FIG. 4. The two sensors are set at appropriate intervals, so that the rotation radii are different, and the positions of the two edges of the thin plate-like object 2 are effectively detected by the rotation of the support arm 14. In addition, the amount of displacement in the X-axis direction of the thin plate-like object 2 and the inclination of the thin plate-like object 40 can be calculated based on the detected measurement values. Figures 4 (a) ~ '(c) are also the same as in Figure 3: the calculation mechanism is shown graphically. 32 > 33 are shown in the figure. Two sensors, the dashed line on the end effector 11 is a thin plate 2 In contrast, the solid line indicates the position of the offset state. In the figure, (b) is the calculation of the predetermined position state j based on the rotation of the support arm 14 and (c) is the state of calculating the offset position. First, the pre-position is calculated: The calculation of 1 is obtained by the following formula; cos Θ 1 S —sin Θ E Xd = χΕ formula (£)) V · sin θ E cos θ Ε .Yd. L Ye. COS θ 1 Η —sin θ Η r, Xg = Xh formula (1 〇) sin θ [cos θ η expands formula (9) to get the following formula:

Xe = Xdcos(9 D-Ypsin^ d ···公式（11) 13 312/發明說明書(補件)/92-09/92118459 1230782 YE = XDsin0 d + Ydcos0 d …公式（12) 將公式（1 0 )展開即可得如下公式：Xe = Xdcos (9 D-Ypsin ^ d ···· Formula (11) 13 312 / Invention Specification (Supplement) / 92-09 / 92118459 1230782 YE = XDsin0 d + Ydcos0 d… Formula (12) will be the formula (1 0 ) Expand to get the following formula:

Xh = Xgcosi9 n-Ycsin^ » ...公式（13) YII 二 X g s i η 0 η + Y g c o s 0 II …公式（1 4 ) 此即預定位置點E ( X E、Y E )、H ( XII、Y H ) 相對於此，變位位置F ( Xf、Yf )、I ( X!、 公式算出： COS Θ F —sin Θ F Xd = XF sin Θ F cos 0 F ^ .Yd. .Yf. cos Θ i 一 sin 0 i Xg Xl sin 0 i cos Θ i ^ .Y〇. 將公式（1 5 )展開即可得如下公式： Y !)則以 ···公式（ ···公式（ 下列 15 16 )Xh = Xgcosi9 n-Ycsin ^ »... Formula (13) YII Two X gsi η 0 η + Y gcos 0 II… Formula (1 4) This is the predetermined position point E (XE, YE), H (XII, YH ) In contrast, the displacement position F (Xf, Yf), I (X !, formula is calculated: COS Θ F —sin Θ F Xd = XF sin Θ F cos 0 F ^ .Yd. .Yf. Cos Θ i a sin 0 i Xg Xl sin 0 i cos Θ i ^ .Y〇. Expand formula (1 5) to get the following formula: Y!) Then use ··· formula (··· formula (15 15 below))

Xf DC 0 IS Θ F - Υ d s i η Θ F .•公 式（ 1 7 ) Yf -X d s i η Θ F + Υ D c o s Θ F • ··公 式（ 1 8 ) 將 公 式 ( 16 ) 展開 即 可 得 如 下 公 式 : X丨 G C 0 丨s θ' -Υ g s i η Θ I •公 式（ 1 9 ) Yl =χ g s i η Θ I + Υ g c o s Θ I 參 • •公 式（ 20 ) 此 即 為 變 位 位 置兩 點 F () 【F、 、Y 〇, 、I (Xl 丨、Y丨） 的 算出 值 〇 接 著 ， 參 昭 圖 5說 明 薄 板 狀 物 的 傾 斜40之算出 方法 〇 本 發 明 中 薄 板 狀物 的 傾 斜 40， ^在 .末: 喘效應 ，器 11 . 上 的 薄 板 狀 物 所 產 成 的部 分 旋 轉 5 以 預 定 位置作為 基準的 薄 板 狀 物 2 的 中 心 線 41 (和 Y - •由 平. 行: )、 和變位後 薄 板狀 物 2 的 中 心 線 43之間發生角度0 L 的 時 候 ，以 角度 Θ L 來表 示 〇 於 是 實 施 例 的 薄板 狀 物 2 為 長 方 形 的平面形 狀 ， 而， ί頃 斜 後薄板狀物2的中心線4 3和其邊緣部側面平行。以此可由 312/發明說明書(補件)/92-09/92118459 14 1230782 變位後薄板狀物2的兩個檢測位置F到I的向量F I、和預 定薄板狀物中心線4 1上的單位向量y所成角度0 l，即可 在數值上算出薄板狀物的傾斜角度（9 L。 向量F I為以下公式所表示： r r r ) Χι — XF = X F I .Yi . .Yf. .Yfi. …公式（21 ) 軸上的單位向量y則為以下公式所表示：Xf DC 0 IS Θ F-Υ dsi η Θ F. • Formula (1 7) Yf -X dsi η Θ F + Υ D cos Θ F • · Formula (1 8) Expanding formula (16) can be obtained as follows Formula: X 丨 GC 0 丨 s θ '-Υ gsi η Θ I • Formula (1 9) Yl = χ gsi η Θ I + Υ gcos Θ I Parameter • • Formula (20) This is the two points F of the displacement position () [Calculated values of F,, Y 〇,, I (Xl 丨, Y 丨) 〇 Next, a calculation method of the inclination 40 of the thin plate-like object will be described with reference to FIG. 5. In the present invention, the inclination of the thin plate-like object 40, ^ At the end: asthma effect, the part produced by the thin plate on the device 11 is rotated 5 center line 41 of the thin plate 2 with the predetermined position as the reference 2 (and Y-• by flat. Line:), and changed When an angle of 0 L occurs between the center lines 43 of the thin plate-like object 2 after the position, the angle is expressed by the angle Θ L. Therefore, the thin plate-like object 2 of the embodiment has a rectangular planar shape, and 2 the center line 43 thereof and parallel to the side edge portion thereof. In this way, the vector FI from the two detection positions F to I of the thin plate 2 after the displacement can be determined by 312 / Instruction of the Invention (Supplement) / 92-09 / 92118459 14 1230782, and the unit on the center line 41 of the predetermined thin plate 2 The angle formed by the vector y is 0 l, and the tilt angle of the thin plate (9 L can be calculated numerically. The vector FI is represented by the following formula: rrr) χι — XF = XFI .Yi. .Yf. .Yfi.… Formula (21) The unit vector y on the axis is represented by the following formula:

Y 0 ...公式（22 ) 因此，向量F I和向量Y所形成的角度0 L即可以下列公 式所表示： ...公式（2 3 —> —> —> —>Y 0 ... Formula (22) Therefore, the angle 0 L formed by the vector F I and the vector Y can be represented by the following formula: ... Formula (2 3 — > — > — > — >

| Y | | F I | =cos0L Y · F I 將公式（2 1 )和公式（2 2 )代入公式（2 3 )，即可解角 0L=YF〆（XFI2 + XFI2) 1/2 …公式（24) 此即顯示薄板狀物傾斜角度0 L的算出值。 [載放位置的修正方法] 於本發明中，修正經變位後薄板狀物2的載放位置，根 據先前所取得的變位量和傾斜，進行薄板狀物2的位置修 正，依圖6說明該修正方法如下： 該圖中的元件符號 4係搬運機器人，5為直線移動機 構，以搬運機器人4的旋轉部1 5之旋轉中心為原點0的座 標。 15 312/發明說明書(補件)/92-09/92118459 1230782 軸 薄 板 移 搬 Lc 即 了 和 位 方 物 軸 4 而在該座標中，以直線移動機構 5的移動方向作為 X ，Y軸則為在原點0上跟X軸呈直角的方向，且此為將 板狀物載放於預定位置的方向。 以先前的公式（24)所求取的算出值，來修正本圖中薄 狀物2的X軸方向上的變位量L。。亦即將實線所示的位 位置上的薄板狀物 2，修正到虛線所示預定位置，使得 運機器人4對於直線移動機構朝向X軸正方向移動距離 = Xa(cos0b— cos0c) — YA(sin0B— sin0c)的距離 "aj* 〇 圖7所示為傾斜後薄板狀物2的修正方法，本圖中，除 上支撐臂1 2上具備有兩個感測器3 2、3 3外，其他則都 圖6相同。 為將實線所示傾斜的薄板狀物2修正到虛線所示的適當 置（預定位置），用搬運機器人4的旋轉部1 5向逆時針 向旋轉角度0 Yfj(Xfi2 + Xfi2)1/2。該旋轉使得薄板狀Y | | FI | = cos0L Y · FI Substitute the formula (2 1) and formula (2 2) into the formula (2 3), and you can solve the angle 0L = YF〆 (XFI2 + XFI2) 1/2… formula (24 ) This shows the calculated value of the thin plate inclination angle 0 L. [Method for correcting the placement position] In the present invention, the placement position of the thin plate-like object 2 after the displacement is corrected, and the position of the thin plate-like object 2 is corrected according to the displacement amount and the tilt obtained previously, as shown in FIG. 6. The description of the correction method is as follows: The component symbol 4 in the figure is a transfer robot, 5 is a linear movement mechanism, and the rotation center of the rotation portion 15 of the transfer robot 4 is the coordinate of the origin 0. 15 312 / Invention Manual (Supplement) / 92-09 / 92118459 1230782 The axis of the thin plate transfer Lc is the square object axis 4 and in this coordinate, the movement direction of the linear movement mechanism 5 is taken as X, and the Y axis is A direction perpendicular to the X axis at the origin 0, and this is a direction in which the plate is placed at a predetermined position. The calculated value obtained by the previous formula (24) is used to correct the displacement amount L of the thin object 2 in the X-axis direction in the figure. . That is, the thin plate 2 at the bit position shown by the solid line is corrected to the predetermined position shown by the dotted line, so that the moving robot 4 moves the distance toward the positive direction of the X axis for the linear movement mechanism = Xa (cos0b— cos0c) — YA (sin0B —Sin0c) 's distance " aj * 〇 Figure 7 shows the correction method of the thin plate 2 after tilting. In this figure, except that the upper support arm 12 has two sensors 3 2, 3 3, The others are the same as in FIG. 6. In order to correct the inclined thin plate 2 shown in the solid line to the proper position (predetermined position) shown in the broken line, the rotating part 15 of the transfer robot 4 is rotated counterclockwise by an angle of 0 Yfj (Xfi2 + Xfi2) 1/2 . This rotation makes a thin plate

邊 緣 部 上 的 點 F 移動 到 點 J 向 上 發 生 變 位 量 L” 以 直 線 動 變 位 量 的 距 離 Lj， 即可 加 述 X 軸 方 向 的 移 動量 亦 即 距 cos Θ 1 L sin 〖0】 r ^ XF = Xj ^ sin Θ L cos 6 丨L ···公式（2 5 將公式（2 5 )展開即可得如下公式： 312/發明說明書(補件)/92-09/92118459 16 1230782When the point F on the edge moves to the point J, the displacement amount L occurs upward. With the distance Lj of the linear displacement, you can add the movement amount in the X-axis direction, that is, from the cos Θ 1 L sin 〖0】 r ^ XF = Xj ^ sin Θ L cos 6 丨 L ··· Formula (2 5 Develop formula (2 5) to get the following formula: 312 / Invention Specification (Supplement) / 92-09 / 92118459 16 1230782

Xj = Xfcos Θ L-Yrsin Θ L …公式（26)Xj = Xfcos Θ L-Yrsin Θ L… formula (26)

Yj = Xfs i η Θ l + Yfcos θ i …公式（27) 此即變位位置之座標J ( X】、Y i )的算出值。 其次，將預定位置E和上述算出值J做比較，以如下公 式計算X軸方向的變位量L:Yj = Xfs i η Θ l + Yfcos θ i… Formula (27) This is the calculated value of the coordinates J (X), Y i of the displacement position. Next, compare the predetermined position E with the above-mentioned calculated value J, and calculate the displacement L in the X-axis direction using the following formula:

Lj = Xj-Xe ···公式（28 ) 如此可算出旋轉後薄板狀物2在X軸負方向上變位了 Lj 的距離，以直線移動機構5將搬運機器人4在X軸正方向 上移動之距離的話，即可載放於所預定的位置上。 在上述實施例說明的是將檢測機構 1 8備置於上支撐臂 1 2上的實施例，圖8所示的搬運機器人4中，則將檢測機 構1 8備置於下支撐臂1 3上。該搬運機器人4中，為避免 旋轉時檢測機構1 8和上支撐臂1 2碰撞衝突，設置連接下 支撐臂13和上支撐臂12的支軸29比先前的更長，在高度 方向上只設距離T的空隙。 此外，該實施例的末端效應器1 1備置於下支撐臂1 3下 部。 圖9 ( a )〜（c )，係圖解在圖8的搬運機器人4將薄板狀 物2取出（交付）時，算出末端效應器1 1上所產生之偏移 (變位量）的方法。圖式上3 1表示檢測機構1 8的感測器， 末端效應器1 1上以虛線表示的薄板狀物2係預定位置，相 對於此實線表示的是偏位了距離Ln後的狀態。 在本例中，以旋轉部1 5的旋轉中心作為座標的原點0， 設於下支撐臂1 3上的檢測機構1 8的感測器3 1旋轉。以此 17 312/發明說明書(補件)/92-09/92118459 1230782 時所得的測定值為基準，利用上述計算公式即可同樣算出 變位量。 在圖9 ( a)中，顯示感測器3 1在上述動作起始點K ( X κ、 Υ κ )上的狀態。 圖9 ( b)中，表示感測器3 1從動作起始點Κ ( Χκ、Υκ )旋 轉角度0 μ，到預定位置Μ ( Χμ、Υμ )上的狀態。 圖9 (c)中，表示感測器3 1再從動作起始點旋轉角度0 ν，到檢 測位置Ν ( X Ν、Υ Ν )上的狀態。 用該搬運機器人4算出薄板狀物2變位量的程序，和上 述檢測機構1 8備置於上支撐臂1 2上的情形相同，其結果， 獲得如下列公式的變位量Ln :Lj = Xj-Xe .. Formula (28) In this way, the distance after the rotation of the rotating thin plate 2 in the negative direction of the X axis by Lj can be calculated. The linear movement mechanism 5 moves the transport robot 4 in the positive direction of the X axis. If it is a distance, it can be placed at a predetermined position. In the above embodiment, the detection mechanism 18 is provided on the upper support arm 12. In the handling robot 4 shown in FIG. 8, the detection mechanism 18 is provided on the lower support arm 13. In the handling robot 4, in order to avoid collision between the detection mechanism 18 and the upper support arm 12 during rotation, a support shaft 29 connecting the lower support arm 13 and the upper support arm 12 is longer than before, and is only provided in the height direction. The gap of distance T. In addition, the end effector 11 of this embodiment is provided at the lower portion of the lower support arm 13. Figs. 9 (a) to (c) are diagrams illustrating a method of calculating an offset (displacement amount) generated at the end effector 11 when the carrying robot 4 of Fig. 8 takes out (delivers) the thin plate-like object 2. The reference numeral 31 in the figure indicates the sensor of the detection mechanism 18, and the thin plate-like object 2 indicated by the dashed line on the end effector 11 is a predetermined position, and the solid line indicates the state after being offset by the distance Ln. In this example, the rotation center of the rotation part 15 is used as the origin 0 of the coordinates, and the sensor 31 of the detection mechanism 18 provided on the lower support arm 13 is rotated. Based on the measurement value obtained at 17 312 / Invention Specification (Supplement) / 92-09 / 92118459 1230782, the displacement can be calculated in the same way by using the above calculation formula. In FIG. 9 (a), the state of the sensor 31 at the above-mentioned operation starting point K (X κ, Υ κ) is shown. In FIG. 9 (b), the state where the sensor 31 is rotated from the operation starting point K (χκ, Υκ) by an angle of 0 μ to a predetermined position M (× μ, Υμ) is shown. In FIG. 9 (c), the state where the sensor 31 is rotated by the angle 0 ν from the starting point of the operation to the detection position N (X Ν, Υ Ν) is shown. The procedure for calculating the displacement amount of the thin plate-like object 2 by the carrying robot 4 is the same as that in the case where the detection mechanism 18 is placed on the upper support arm 12. As a result, the displacement amount Ln is obtained as follows:

Ln = Xk(cos0n-cos0M)-YK(sin0N-sin0M) ...公式（29) 上述實施例中係就具備一組上支撐臂 1 2 (以下簡稱單 臂）構成的搬運機器人4加以說明，圖9中則顯示具備兩 組上支撐臂1 2 (以下簡稱雙臂）構成的搬運機器人4。 此外，本圖搬運機器人4係旋轉部1 5和下支撐臂1 3成 一體化，旋轉旋轉部1 5來藉以取代下支撐臂1 3的動作， 藉此即可和圖1的搬運機器人4同樣動作，也可用同樣算 出方法來算出變位量。 本例中，與旋轉部 1 5成一體化而旋轉的兩組下支撐臂 1 3、1 3上所安裝的一組上支撐臂1 2，為避免旋轉中的衝擊 而具備有比先前更長的支軸 2 9，在高度方向上形成隙縫 (距離T )。而在其他地方檢測機構1 8係設於上支撐臂1 2 上部，形成上述隙縫的上支撐臂1 2上則備置於其下部。 18 312/發明說明書(補件)/92-09/92118459 1230782 在圖1 0中說明了下支撐臂1 3和旋轉部1 5成一體化的 搬運機器人4，而可如同圖1所示搬運機器人4 一般下支 撐臂1 3和旋轉部1 5分別獨立動作，具備兩組支撐臂1 4 的搬運機器人4，也可實施本發明。 於上述搬運機器人4中，係以上支撐臂1 2和下支撐臂 1 3兩者來構成支撐臂1 4，而圖1 0中的搬運機器人4，則 僅以一個下支撐臂1 3構成支撐臂1 4，檢測機構1 8安裝在 上支撐臂1 2上和末端效應器1 1相反側的側面上。 此外，圖1 2的搬運機器人4之支撐臂1 4和上述例不同， 係以上支撐臂1 2、中間臂2 8、和下支撐臂1 3三者所構成。 該搬運機器人4中係於上支撐臂1 2上備置檢測機構1 8， 但也可備置於中間臂2 9或者下支撐臂1 3上，都在本發明 實施範圍内。 (發明效果） 本發明中，係以獨特的構成將檢測機構 1 8安裝與搬運 機器人的支撐臂1 4上，在搬運機器人4將薄板狀物2取出 (交付）動作中，可以自動並且迅速的進行變位量檢測， 對於減少裝置整體的成本和提昇生產能力，都有很大的貢 獻。 此外，呈口字形狀的檢測機構1 8，因為投光、受光之間 的光軸距離很短，故該感測器的調整和維修也非常容易， 價格也相當廉價。 【圖式簡單說明】 圖1為顯示本發明搬運機器人4之一實施例的立體圖。 19 312/發明說明書(補件)/92-09/92118459 1230782 圖2為顯示搬運機器人4所備置檢測機構1 8之部分切 開立體圖。 圖 3 (a )〜 ( c ) 為 搬 運 機 器 人 4 算 出 一 個 感 測 器 之 檢 測 狀 態 之 使 用 說 明 圖 〇 圖 4 (a )〜（ C) 為 上 述 中 使 用 兩 個 感 測 器 之 情 形 的 作 用 圖 〇 圖 5 為 算 出 薄 板 狀 物 2 之 傾 斜 狀 態 用 的 作 用 說 明 圖 〇 圖 6 為 說 明 修 正 作 用 的 俯 視 圖 〇 圖 7 為 說 明 傾 斜 薄 板 狀 物 2 之 修 正 作 用 的 俯 視 圖 0 圖 8 為 顯 示 •下 支撐 ’臂 13 備 置 檢 測 機 構 之 搬 運 機 器 人 的俯視圖。 圖9 ( a )〜（c )為算出上述薄板狀物變位量的說明圖。 圖1 0為顯示搬運機器人4其他例的立體圖。 圖1 1為顯示搬運機器人4其他例的立體圖。 圖1 2為顯示搬運機器人4其他例的立體圖。 圖1 3為顯示具備先前薄板狀物位置檢測機構的操作裝 置之整體立體圖。 (元件符號說明） 1 操作裝置 2 薄板狀物 3 卡匣 4 搬運機器人 5 直線移動機構 6 處理裝置 20 312/發明說明書(補件)/92-09/92118459 1230782 7 控制機構 11 末端效應器 12 上支撐臂 13 下支撐臂 14 支撐臂 15 旋轉部 16 升降機構 17 基台 18 檢測機構 19 投光器 20 受光器 2 1 固定構件 2 2 處理室 23 載放台 24 檯 2 5 搬出入口 2 6 棚架 27 可動部 28 中間臂 29 支軸 3 1 感測器 32 感測器 3 3 感測器 40 薄板狀物的傾斜 312/發明說明書(補件)/92-09/92118459 1230782 4 1 薄板狀物的中心線 42 變位後薄板狀物的中心線 43 傾斜後薄板狀物的中心線 44 傾斜修正後之薄板狀物的中心線Ln = Xk (cos0n-cos0M) -YK (sin0N-sin0M) ... Formula (29) In the above embodiment, the transport robot 4 having a set of upper support arms 12 (hereinafter referred to as a single arm) will be described. FIG. 9 shows a transfer robot 4 including two sets of upper support arms 12 (hereinafter referred to as two arms). In addition, the conveying robot 4 in this figure is integrated with the rotating part 15 and the lower support arm 13, and the rotating part 15 is rotated to replace the action of the lower support arm 13, so that it can be the same as the conveying robot 4 in FIG. 1. In the operation, the displacement can be calculated by the same calculation method. In this example, the two sets of lower support arms 1 3, 1 3 that are integrated and rotated with the rotation part 15 are provided with a set of upper support arms 12 that are longer than before to avoid impact during rotation. The fulcrum shaft 29 forms a gap (distance T) in the height direction. In other places, the detection mechanism 18 is provided on the upper part of the upper support arm 12 and the upper support arm 12 forming the above-mentioned gap is prepared at the lower part. 18 312 / Invention Specification (Supplement) / 92-09 / 92118459 1230782 In Fig. 10, the lower supporting arm 13 and the rotating part 15 are integrated into a carrying robot 4, which can be handled as shown in Fig. 1 4 Generally, the lower support arm 13 and the rotating part 15 operate independently, and the carrying robot 4 having two sets of support arms 1 4 can also implement the present invention. In the above-mentioned carrying robot 4, the upper supporting arm 12 and the lower supporting arm 13 are both connected to constitute the supporting arm 14, while the carrying robot 4 in FIG. 10 constitutes the supporting arm with only one lower supporting arm 13 14, the detection mechanism 18 is mounted on the upper support arm 12 on the side opposite to the end effector 11. In addition, the support arm 14 of the transfer robot 4 in FIG. 12 is different from the above example, and is composed of the upper support arm 12, the middle arm 28, and the lower support arm 13. The conveying robot 4 is provided with a detection mechanism 18 on the upper support arm 12, but may also be provided on the middle arm 29 or the lower support arm 13, which are all within the scope of the present invention. (Effects of the Invention) In the present invention, the detection mechanism 18 is mounted on the support arm 14 of the carrying robot with a unique structure, and the thin plate-like object 2 can be automatically and quickly moved by the carrying robot 4 to remove (deliver) the thin plate-like object 2. The detection of the displacement amount greatly contributes to reducing the overall cost of the device and improving the production capacity. In addition, the mouth-shaped detection mechanism 18 has a short optical axis distance between light projection and light reception, so that the adjustment and maintenance of the sensor are also very easy, and the price is relatively inexpensive. [Brief Description of the Drawings] FIG. 1 is a perspective view showing an embodiment of a carrying robot 4 according to the present invention. 19 312 / Invention Manual (Supplement) / 92-09 / 92118459 1230782 Figure 2 is a partially cutaway perspective view showing the detection mechanism 18 provided in the transfer robot 4. Figures 3 (a) ~ (c) Figures 4 (a) ~ (C) are the action diagrams for calculating the detection state of one sensor for the handling robot 4. Fig. 5 is an explanatory view of the function for calculating the inclined state of the thin plate-like object 2 Fig. 6 is a plan view for explaining the corrective action 0 Fig. 7 is a plan view for explaining the corrective action of the inclined thin-plate object 2 Fig. 8 is a display and lower supporting arm 13 Top view of a transport robot with a detection mechanism. 9 (a) to (c) are explanatory diagrams for calculating the displacement amount of the thin plate-like object. FIG. 10 is a perspective view showing another example of the transfer robot 4. FIG. 11 is a perspective view showing another example of the transfer robot 4. FIG. 12 is a perspective view showing another example of the transfer robot 4. Fig. 13 is an overall perspective view showing an operating device including a conventional thin plate-like position detecting mechanism. (Description of component symbols) 1 Operating device 2 Thin plate 3 Cassette 4 Carrying robot 5 Linear movement mechanism 6 Processing device 20 312 / Invention manual (Supplement) / 92-09 / 92118459 1230782 7 Control mechanism 11 End effector 12 Support arm 13 Lower support arm 14 Support arm 15 Rotating part 16 Lifting mechanism 17 Abutment 18 Detection mechanism 19 Light projector 20 Light receiver 2 1 Fixing member 2 2 Processing chamber 23 Placement table 24 5 2 Exits 2 6 Shelf 27 Movable Part 28 Middle arm 29 Pivot shaft 3 1 Sensor 32 Sensor 3 3 Sensor 40 Tilt of thin plate 312 / Invention Manual (Supplement) / 92-09 / 92118459 1230782 4 1 Centerline of thin plate 42 Centerline of thin plate after displacement 43 Centerline of thin plate after tilting 44 Centerline of thin plate after tilting correction

312/發明說明書(補件)/92-09/92118459 22312 / Invention Specification (Supplement) / 92-09 / 92118459 22

Claims (1)

1230782 拾、申請專利範圍： 1 . 一種薄板狀物之變位量檢測方法，其特徵為：於薄板 狀物操作裝置，基於包含該操作裝置位置在内的基準座標 系，在檢測出上述薄板狀物變位量時，於維持薄板狀物的 末端效應器支撐臂上安裝檢測機構，因支撐臂的旋轉而使 上述薄板狀物邊緣部和檢測機構的圓弧轨跡交叉，由此所 得的數值和預先設定的薄板狀物該當數值相比較而算出 修正變位量。 2 .如申請專利範圍第 1項之薄板狀物之變位量檢測方 法，其中修正變位量之檢測，係於將薄板狀物從其所被容 納的卡匣棚架上取出的動作中所進行。 3 .如申請專利範圍第1項之薄板狀物之變位量檢測方 法，其中變位量檢測機構，除了構成j字形狀，並且開口 配置在末端效應器前方側支撐臂上，使得開口處在末端效 應器側之外，該開口也具有能讓薄板狀物邊緣部通過的隙 縫尺寸。 4 .如申請專利範圍第 2項之薄板狀物之變位量檢測方 法，其中變位量檢測機構，除了構成17字形狀，並且開口 配置在末端效應器前方側支撐臂上，使得開口處在末端效 應器側之外，該開口也具有能讓薄板狀物邊緣部通過的隙 縫尺寸。 5 .如申請專利範圍第 3項之薄板狀物之變位量檢測方 法，其中在口字形狀開口側，安裝一個或者多個由投光器 和受光器組成的透過型感測器，使其等與支撐臂旋轉中心 23 312/發明說明書(補件)/92-09/92118459 1230782 之間的距離分別略為不同，藉由支撐臂的旋轉即可同時檢 測出薄板狀物邊緣部的一處或者多處位置。 6 .如申請專利範圍第 4項之薄板狀物之變位量檢測方 法，其中在j字形狀開口側，安裝一個或者多個由投光器 和受光器組成的透過型感測器，使其等與支撐臂旋轉中心 之間的距離分別略為不同，藉由支撐臂的旋轉即可同時檢 測出薄板狀物邊緣部的一處或者多處位置。 7. —種薄板狀物之變位量修正方法，其特徵為：依照申 請專利範圍第1、2、3、4、5或6項中所算出的修正變位 量，將操作裝置移動到基準座標所定的位置而加以修正。 24 312/發明說明書(補件)/92-09/921184591230782 Patent application scope: 1. A method for detecting the displacement of a thin plate-shaped object, characterized in that the thin-plate-shaped operating device detects the above-mentioned thin plate-like shape based on a reference coordinate system including the position of the operating device. When an object is displaced, a detection mechanism is installed on the end effector support arm that maintains the thin plate. The rotation of the support arm causes the edge of the thin plate to intersect with the arc trajectory of the detection mechanism. The correction displacement is calculated by comparing with the preset value of the thin plate. 2. The method for detecting the displacement of a thin plate-like object as described in item 1 of the scope of patent application, wherein the detection of the corrected displacement amount is based on the action of taking out the thin plate-like object from the cassette shelf in which it is accommodated. get on. 3. The method for detecting the displacement of a thin plate-like object as described in item 1 of the patent application scope, wherein the displacement detection mechanism, except for forming a j-shape, is arranged on the support arm on the front side of the end effector so that the opening is at In addition to the end effector side, this opening also has a slit size through which the edge of the thin plate can pass. 4. The method for detecting the displacement of a thin plate-like object as described in item 2 of the patent application scope, wherein the displacement detection mechanism, except for forming a 17-shape, and the opening is arranged on the support arm in front of the end effector, so that the opening is at In addition to the end effector side, this opening also has a slit size through which the edge of the thin plate can pass. 5. The method for detecting the displacement of a thin plate-like object according to item 3 of the patent application scope, wherein one or more transmissive sensors composed of a light emitter and a light receiver are installed on the side of the opening of the mouth shape, so that they are equivalent to Support arm rotation center 23 312 / Invention specification (Supplement) / 92-09 / 92118459 1230782 The distances are slightly different, and one or more edges of a thin plate can be detected at the same time by the rotation of the support arm position. 6. The method for detecting the displacement of a thin plate-like object according to item 4 of the scope of patent application, wherein one or more transmissive sensors composed of a light emitter and a light receiver are installed on the side of the j-shaped opening to make them equal to The distances between the rotation centers of the support arms are slightly different, and one or more positions of the edge of the thin plate-like object can be detected simultaneously by the rotation of the support arm. 7. —A method for correcting the displacement of a thin plate-shaped object, characterized in that the operating device is moved to a reference according to the correction displacement calculated in item 1, 2, 3, 4, 5, or 6 of the scope of the patent application. The position specified by the coordinates is corrected. 24 312 / Invention Specification (Supplement) / 92-09 / 92118459
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KR20060065627A (en) 2006-06-14
CN1802736B (en) 2013-01-09
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JP4395873B2 (en) 2010-01-13
CN1802736A (en) 2006-07-12

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