JP5573861B2 - 搬送システム - Google Patents
搬送システム Download PDFInfo
- Publication number
- JP5573861B2 JP5573861B2 JP2012031982A JP2012031982A JP5573861B2 JP 5573861 B2 JP5573861 B2 JP 5573861B2 JP 2012031982 A JP2012031982 A JP 2012031982A JP 2012031982 A JP2012031982 A JP 2012031982A JP 5573861 B2 JP5573861 B2 JP 5573861B2
- Authority
- JP
- Japan
- Prior art keywords
- robot
- control device
- wafer
- positioning device
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1679—Programme controls characterised by the tasks executed
- B25J9/1682—Dual arm manipulator; Coordination of several manipulators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1628—Programme controls characterised by the control loop
- B25J9/1633—Programme controls characterised by the control loop compliant, force, torque control, e.g. combined with position control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1656—Programme controls characterised by programming, planning systems for manipulators
- B25J9/1664—Programme controls characterised by programming, planning systems for manipulators characterised by motion, path, trajectory planning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/50—Machine tool, machine tool null till machine tool work handling
- G05B2219/50036—Find center of circular mark, groove
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Description
図3は、本実施形態に係る搬送システム1のブロック図である。
2 搬送室
3、3a ウェハ
4、4a ノッチ
5 収納容器
6 処理室
10 第1のロボット
12 本体部
13 アーム部
14 第1アーム部
15 第2アーム部
16 ハンド
20 第2のロボット
30 第1のロボット制御装置
31 位置取得部
32 補正部
33 搬出位置送信部
34 記憶部
34a 位置情報
40 第2のロボット制御装置
41 搬出位置受信部
42 動作指示部
50 基板位置決め装置
60 上位装置
Claims (4)
- 回転中心回りに回転する載置台を有しており、該載置台に載置された基板の位置合わせを行う基板位置決め装置と、
前記基板位置決め装置との間で前記基板の受渡を行う複数のロボットと、
前記ロボットごとにそれぞれ設けられ、当該ロボットの動作制御を行うロボット制御装置と
を備え、
第1のロボットおよび前記基板位置決め装置が接続される第1のロボット制御装置は、
少なくとも前記回転中心と位置決めが完了した前記基板の中心位置との絶対的なずれ量を前記基板位置決め装置から取得する取得部と、
前記取得部によって取得された前記絶対的なずれ量に基づく補正情報を、第2のロボットが接続され、前記基板位置決め装置とは接続されていない第2のロボット制御装置に対して送信する送信部と
を備え、
前記第2のロボット制御装置は、
前記第1のロボット制御装置から受信した前記補正情報に基づいて前記第2のロボットが前記位置決め装置へアクセスする場合の教示データを補正し、補正された前記教示データに基づいて動作させる動作指示部
を備えることを特徴とする搬送システム。 - 前記第1のロボット制御装置は、
前記取得部によって取得された前記絶対的なずれ量を、前記第2のロボット制御装置に接続される第2のロボットからみた相対的なずれ量へ補正する補正部
を備え、
前記送信部は、
前記補正部によって補正された前記相対的なずれ量を前記補正情報として前記第2のロボット制御装置へ送信すること
を特徴とする請求項1に記載の搬送システム。 - 前記第1のロボット制御装置は、
前記基板位置決め装置と前記第2のロボットとの相対位置に関する位置情報を記憶する記憶部
を備え、
前記補正部は、
前記位置情報に基づいて前記絶対的なずれ量を前記相対的なずれ量へ補正すること
を特徴とする請求項2に記載の搬送システム。 - 前記取得部は、
前記絶対的なずれ量として、前記回転中心および前記中心位置間の距離と、前記回転中心および前記中心位置を結ぶ直線が所定の基準軸となす角度とを取得すること
を特徴とする請求項1〜3のいずれか一つに記載の搬送システム。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012031982A JP5573861B2 (ja) | 2012-02-16 | 2012-02-16 | 搬送システム |
TW102101495A TW201347937A (zh) | 2012-02-16 | 2013-01-15 | 傳送系統 |
IN566CH2013 IN2013CH00566A (ja) | 2012-02-16 | 2013-02-11 | |
US13/765,754 US8989901B2 (en) | 2012-02-16 | 2013-02-13 | Transfer system |
KR1020130016250A KR101446413B1 (ko) | 2012-02-16 | 2013-02-15 | 반송 시스템 |
CN2013100512096A CN103253512A (zh) | 2012-02-16 | 2013-02-16 | 传送系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012031982A JP5573861B2 (ja) | 2012-02-16 | 2012-02-16 | 搬送システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013168579A JP2013168579A (ja) | 2013-08-29 |
JP5573861B2 true JP5573861B2 (ja) | 2014-08-20 |
Family
ID=48957803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012031982A Expired - Fee Related JP5573861B2 (ja) | 2012-02-16 | 2012-02-16 | 搬送システム |
Country Status (6)
Country | Link |
---|---|
US (1) | US8989901B2 (ja) |
JP (1) | JP5573861B2 (ja) |
KR (1) | KR101446413B1 (ja) |
CN (1) | CN103253512A (ja) |
IN (1) | IN2013CH00566A (ja) |
TW (1) | TW201347937A (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6199199B2 (ja) * | 2014-02-20 | 2017-09-20 | 東京エレクトロン株式会社 | 基板処理装置、位置ずれ補正方法及び記憶媒体 |
JP6384195B2 (ja) * | 2014-08-20 | 2018-09-05 | 株式会社安川電機 | ロボットシステムおよびロボット教示方法 |
US9824908B2 (en) * | 2015-05-05 | 2017-11-21 | Kawasaki Jukogyo Kabushiki Kaisha | Conveying system, conveying robot and teaching method of the same |
JP6587423B2 (ja) * | 2015-05-28 | 2019-10-09 | キヤノン株式会社 | 搬送システム及び露光システム |
WO2017104039A1 (ja) * | 2015-12-17 | 2017-06-22 | 株式会社安川電機 | 教示システム、教示方法およびロボット |
US10099377B2 (en) * | 2016-06-29 | 2018-10-16 | Applied Materials, Inc. | Methods and systems providing misalignment correction in robots |
JP6741538B2 (ja) * | 2016-09-28 | 2020-08-19 | 川崎重工業株式会社 | ロボット、ロボットの制御装置、及び、ロボットの位置教示方法 |
JP7199073B2 (ja) * | 2017-10-20 | 2023-01-05 | 株式会社キーレックス | 垂直多関節ロボットの教示データ作成システム |
SG11202008643PA (en) * | 2018-04-09 | 2020-10-29 | Tokyo Electron Ltd | Laser processing device, laser processing system, and laser processing method |
US10974388B2 (en) * | 2018-12-27 | 2021-04-13 | Kawasaki Jukogyo Kabushiki Kaisha | Method of correcting position of robot and robot |
US11059178B2 (en) * | 2018-12-27 | 2021-07-13 | Kawasaki Jukogyo Kabushiki Kaisha | Method of correcting position of robot and robot |
CN113276104A (zh) * | 2020-02-19 | 2021-08-20 | 总督科技股份有限公司 | 晶圆转载机构的机械臂校准装置及其校准方法 |
US20230104871A1 (en) * | 2020-02-19 | 2023-04-06 | Mao-Yen Sung | Wafer carrier disc installation/uninstallation device and installation/uninstallation method thereof |
JP2022102888A (ja) * | 2020-12-25 | 2022-07-07 | 川崎重工業株式会社 | 基板搬送ロボットの制御装置及び関節モータの制御方法 |
CN114536339A (zh) * | 2022-03-03 | 2022-05-27 | 深圳市大族机器人有限公司 | 协作机器人的控制方法、装置、协作机器人和存储介质 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10173022A (ja) * | 1996-12-10 | 1998-06-26 | Mecs:Kk | ウェハ搬送装置 |
US6405101B1 (en) * | 1998-11-17 | 2002-06-11 | Novellus Systems, Inc. | Wafer centering system and method |
JP2003142417A (ja) | 2001-11-05 | 2003-05-16 | Anelva Corp | 成膜処理装置に装備されたロボットの制御装置 |
JP3760212B2 (ja) * | 2001-11-30 | 2006-03-29 | 川崎重工業株式会社 | アライメント処理方法およびアライメント処理装置 |
JP4071057B2 (ja) * | 2002-07-10 | 2008-04-02 | 東京エレクトロン株式会社 | 基板位置決め装置及び基板処理装置 |
US6748293B1 (en) * | 2003-03-24 | 2004-06-08 | Varian Semiconductor Equipment Associates, Inc. | Methods and apparatus for high speed object handling |
KR100583727B1 (ko) * | 2004-01-07 | 2006-05-25 | 삼성전자주식회사 | 기판 제조 장치 및 이에 사용되는 기판 이송 모듈 |
CN1876529B (zh) | 2006-07-11 | 2010-12-01 | 友达光电股份有限公司 | 玻璃基板移送装置 |
JP2008173744A (ja) * | 2007-01-22 | 2008-07-31 | Tokyo Electron Ltd | 搬送システムの搬送位置合わせ方法 |
KR100855877B1 (ko) | 2007-02-23 | 2008-09-03 | 세메스 주식회사 | 기판 처리 장치 및 그 장치에서의 기판 정렬 방법 |
US8060252B2 (en) * | 2007-11-30 | 2011-11-15 | Novellus Systems, Inc. | High throughput method of in transit wafer position correction in system using multiple robots |
CN102132378B (zh) * | 2008-08-26 | 2013-12-11 | 应用材料公司 | 激光材料移除方法和设备 |
JP2011108958A (ja) * | 2009-11-20 | 2011-06-02 | Hitachi High-Tech Control Systems Corp | 半導体ウェーハ搬送装置及びこれを用いた搬送方法 |
JP5755844B2 (ja) * | 2010-05-31 | 2015-07-29 | 株式会社ダイヘン | ワーク搬送システム |
JP5627518B2 (ja) * | 2011-03-16 | 2014-11-19 | 大日本スクリーン製造株式会社 | 基板処理装置および電源管理方法 |
-
2012
- 2012-02-16 JP JP2012031982A patent/JP5573861B2/ja not_active Expired - Fee Related
-
2013
- 2013-01-15 TW TW102101495A patent/TW201347937A/zh unknown
- 2013-02-11 IN IN566CH2013 patent/IN2013CH00566A/en unknown
- 2013-02-13 US US13/765,754 patent/US8989901B2/en not_active Expired - Fee Related
- 2013-02-15 KR KR1020130016250A patent/KR101446413B1/ko not_active IP Right Cessation
- 2013-02-16 CN CN2013100512096A patent/CN103253512A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2013168579A (ja) | 2013-08-29 |
US20130218337A1 (en) | 2013-08-22 |
CN103253512A (zh) | 2013-08-21 |
KR20130094754A (ko) | 2013-08-26 |
US8989901B2 (en) | 2015-03-24 |
TW201347937A (zh) | 2013-12-01 |
KR101446413B1 (ko) | 2014-10-02 |
IN2013CH00566A (ja) | 2015-04-24 |
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