CN101690442B - 具有屏蔽及散热性的高频模块及其制造方法 - Google Patents

具有屏蔽及散热性的高频模块及其制造方法 Download PDF

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Publication number
CN101690442B
CN101690442B CN2008800236271A CN200880023627A CN101690442B CN 101690442 B CN101690442 B CN 101690442B CN 2008800236271 A CN2008800236271 A CN 2008800236271A CN 200880023627 A CN200880023627 A CN 200880023627A CN 101690442 B CN101690442 B CN 101690442B
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China
Prior art keywords
resin
heat
curing
metal powder
curing agent
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CN2008800236271A
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English (en)
Chinese (zh)
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CN101690442A (zh
Inventor
杉本健一朗
村上久敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Tatsuta System Electronics Co Ltd
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Application filed by Tatsuta Electric Wire and Cable Co Ltd, Tatsuta System Electronics Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Publication of CN101690442A publication Critical patent/CN101690442A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/281—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials
    • H10W42/284—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials shielding resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN2008800236271A 2007-07-09 2008-06-13 具有屏蔽及散热性的高频模块及其制造方法 Active CN101690442B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP179473/2007 2007-07-09
JP2007179473A JP2009016715A (ja) 2007-07-09 2007-07-09 シールド及び放熱性を有する高周波モジュール及びその製造方法
PCT/JP2008/060836 WO2009008243A1 (ja) 2007-07-09 2008-06-13 シールド及び放熱性を有する高周波モジュール及びその製造方法

Publications (2)

Publication Number Publication Date
CN101690442A CN101690442A (zh) 2010-03-31
CN101690442B true CN101690442B (zh) 2012-10-10

Family

ID=40228422

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008800236271A Active CN101690442B (zh) 2007-07-09 2008-06-13 具有屏蔽及散热性的高频模块及其制造方法

Country Status (5)

Country Link
JP (1) JP2009016715A (https=)
KR (1) KR20100045461A (https=)
CN (1) CN101690442B (https=)
TW (1) TWI434377B (https=)
WO (1) WO2009008243A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108493176A (zh) * 2018-03-27 2018-09-04 董秀玲 一种指纹识别芯片装置及其制造方法
TWI692845B (zh) 2017-12-05 2020-05-01 日商Ｔｄｋ股份有限公司 使用具有導電性的模製材料之電子電路封裝

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* Cited by examiner, † Cited by third party
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JP2010225620A (ja) * 2009-03-19 2010-10-07 Panasonic Corp 回路モジュール
JP5416458B2 (ja) * 2009-04-02 2014-02-12 タツタ電線株式会社 シールドおよび放熱性を有する高周波モジュールの製造方法
JP5045727B2 (ja) 2009-10-21 2012-10-10 ソニー株式会社 高周波モジュールおよび受信装置
JP2012019091A (ja) * 2010-07-08 2012-01-26 Sony Corp モジュールおよび携帯端末
KR101460271B1 (ko) * 2011-01-07 2014-11-11 가부시키가이샤 무라타 세이사쿠쇼 전자 부품 모듈의 제조 방법 및 전자 부품 모듈
WO2012101857A1 (ja) * 2011-01-28 2012-08-02 株式会社村田製作所 モジュール基板
JP5624903B2 (ja) * 2011-01-31 2014-11-12 京セラドキュメントソリューションズ株式会社 基板装置
KR20120131530A (ko) 2011-05-25 2012-12-05 삼성전자주식회사 반도체 장치 및 그 제조 방법
JP5278579B2 (ja) * 2012-05-25 2013-09-04 ソニー株式会社 高周波モジュールおよび受信装置
JP2013247339A (ja) * 2012-05-29 2013-12-09 Tdk Corp 電子部品モジュールの製造方法
US9202747B2 (en) 2012-09-28 2015-12-01 Skyworks Solutions, Inc. Segmented conductive top layer for radio frequency isolation
CN104159391A (zh) * 2013-05-15 2014-11-19 中兴通讯股份有限公司 一种用于终端的散热装置及终端
JP5527785B1 (ja) * 2013-08-08 2014-06-25 太陽誘電株式会社 回路モジュール及び回路モジュールの製造方法
WO2015186624A1 (ja) 2014-06-02 2015-12-10 タツタ電線株式会社 導電性接着フィルム、プリント回路基板、及び、電子機器
CN105811891A (zh) * 2016-04-20 2016-07-27 佛山臻智微芯科技有限公司 减低移动通信多级功率放大器中带内噪声的结构和方法
CN106340498B (zh) * 2016-10-20 2018-11-09 江苏长电科技股份有限公司 一种具有电磁屏蔽接地功能的封装结构及其制造方法
DE102018116682A1 (de) * 2018-07-10 2020-01-16 Elringklinger Ag Wärmeabschirmvorrichtung, insbesondere an lokal unterschiedlich auftretende Wärmeeinträge pro Fläche anpassbare Wärmeabschirmvorrichtung
JP7503401B2 (ja) * 2020-03-19 2024-06-20 太陽誘電株式会社 コイル部品及び電子機器
CN112701096A (zh) * 2020-12-22 2021-04-23 杰群电子科技（东莞）有限公司 一种半导体模组封装工艺及半导体模组

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* Cited by examiner, † Cited by third party
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JP2724079B2 (ja) * 1992-10-06 1998-03-09 京セラ株式会社 半導体素子収納用パッケージ
JP2673928B2 (ja) * 1993-05-11 1997-11-05 株式会社巴川製紙所 電子部品素子封止用蓋材
JP4662324B2 (ja) * 2002-11-18 2011-03-30 太陽誘電株式会社 回路モジュール
JP3842229B2 (ja) * 2003-02-27 2006-11-08 太陽誘電株式会社 回路モジュール
JP4020874B2 (ja) * 2003-03-13 2007-12-12 三洋電機株式会社 半導体装置およびその製造方法
JP2005019900A (ja) * 2003-06-27 2005-01-20 Kyocera Corp 電子装置
US7701728B2 (en) * 2004-10-28 2010-04-20 Kyocera Corporation Electronic component module and radio comunications equipment
KR100874302B1 (ko) * 2005-02-18 2008-12-18 도요 잉키 세이조 가부시끼가이샤 전자파 차폐성 접착필름, 그 제조방법 및 피착체의 전자파차폐방법
JP2006286915A (ja) * 2005-03-31 2006-10-19 Taiyo Yuden Co Ltd 回路モジュール

Non-Patent Citations (2)

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JP特开2004-172176A 2004.06.17
JP特开2006-286915A 2006.10.19

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI692845B (zh) 2017-12-05 2020-05-01 日商Ｔｄｋ股份有限公司 使用具有導電性的模製材料之電子電路封裝
CN108493176A (zh) * 2018-03-27 2018-09-04 董秀玲 一种指纹识别芯片装置及其制造方法

Also Published As

Publication number Publication date
TW200917430A (en) 2009-04-16
JP2009016715A (ja) 2009-01-22
TWI434377B (zh) 2014-04-11
KR20100045461A (ko) 2010-05-03
CN101690442A (zh) 2010-03-31
WO2009008243A1 (ja) 2009-01-15

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Owner name: TATSUTA DENSEN K. K.

Free format text: FORMER OWNER: DAIZDA SYSTEM ELECTRONICS CO., LTD.

Effective date: 20120823

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20120823

Address after: Japan Osaka East Osaka Iwata Machiji 3 chome No. 1

Applicant after: Tatsuta Densen K. K.

Address before: Osaka Japan

Applicant before: Daizda System Electronics Co., Ltd.

C14 Grant of patent or utility model
GR01 Patent grant