TWI434377B - A high frequency module having shielding property and heat dissipation property and a manufacturing method thereof - Google Patents

A high frequency module having shielding property and heat dissipation property and a manufacturing method thereof Download PDF

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Publication number
TWI434377B
TWI434377B TW097125570A TW97125570A TWI434377B TW I434377 B TWI434377 B TW I434377B TW 097125570 A TW097125570 A TW 097125570A TW 97125570 A TW97125570 A TW 97125570A TW I434377 B TWI434377 B TW I434377B
Authority
TW
Taiwan
Prior art keywords
resin
conductive
frequency module
shielding
ground pattern
Prior art date
Application number
TW097125570A
Other languages
English (en)
Chinese (zh)
Other versions
TW200917430A (en
Inventor
杉本健一朗
村上久敏
Original Assignee
大自達電線股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大自達電線股份有限公司 filed Critical 大自達電線股份有限公司
Publication of TW200917430A publication Critical patent/TW200917430A/zh
Application granted granted Critical
Publication of TWI434377B publication Critical patent/TWI434377B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/281—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials
    • H10W42/284—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials shielding resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW097125570A 2007-07-09 2008-07-07 A high frequency module having shielding property and heat dissipation property and a manufacturing method thereof TWI434377B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007179473A JP2009016715A (ja) 2007-07-09 2007-07-09 シールド及び放熱性を有する高周波モジュール及びその製造方法

Publications (2)

Publication Number Publication Date
TW200917430A TW200917430A (en) 2009-04-16
TWI434377B true TWI434377B (zh) 2014-04-11

Family

ID=40228422

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097125570A TWI434377B (zh) 2007-07-09 2008-07-07 A high frequency module having shielding property and heat dissipation property and a manufacturing method thereof

Country Status (5)

Country Link
JP (1) JP2009016715A (https=)
KR (1) KR20100045461A (https=)
CN (1) CN101690442B (https=)
TW (1) TWI434377B (https=)
WO (1) WO2009008243A1 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010225620A (ja) * 2009-03-19 2010-10-07 Panasonic Corp 回路モジュール
JP5416458B2 (ja) * 2009-04-02 2014-02-12 タツタ電線株式会社 シールドおよび放熱性を有する高周波モジュールの製造方法
JP5045727B2 (ja) 2009-10-21 2012-10-10 ソニー株式会社 高周波モジュールおよび受信装置
JP2012019091A (ja) * 2010-07-08 2012-01-26 Sony Corp モジュールおよび携帯端末
KR101460271B1 (ko) * 2011-01-07 2014-11-11 가부시키가이샤 무라타 세이사쿠쇼 전자 부품 모듈의 제조 방법 및 전자 부품 모듈
WO2012101857A1 (ja) * 2011-01-28 2012-08-02 株式会社村田製作所 モジュール基板
JP5624903B2 (ja) * 2011-01-31 2014-11-12 京セラドキュメントソリューションズ株式会社 基板装置
KR20120131530A (ko) 2011-05-25 2012-12-05 삼성전자주식회사 반도체 장치 및 그 제조 방법
JP5278579B2 (ja) * 2012-05-25 2013-09-04 ソニー株式会社 高周波モジュールおよび受信装置
JP2013247339A (ja) * 2012-05-29 2013-12-09 Tdk Corp 電子部品モジュールの製造方法
US9202747B2 (en) 2012-09-28 2015-12-01 Skyworks Solutions, Inc. Segmented conductive top layer for radio frequency isolation
CN104159391A (zh) * 2013-05-15 2014-11-19 中兴通讯股份有限公司 一种用于终端的散热装置及终端
JP5527785B1 (ja) * 2013-08-08 2014-06-25 太陽誘電株式会社 回路モジュール及び回路モジュールの製造方法
WO2015186624A1 (ja) 2014-06-02 2015-12-10 タツタ電線株式会社 導電性接着フィルム、プリント回路基板、及び、電子機器
CN105811891A (zh) * 2016-04-20 2016-07-27 佛山臻智微芯科技有限公司 减低移动通信多级功率放大器中带内噪声的结构和方法
CN106340498B (zh) * 2016-10-20 2018-11-09 江苏长电科技股份有限公司 一种具有电磁屏蔽接地功能的封装结构及其制造方法
US10373917B2 (en) * 2017-12-05 2019-08-06 Tdk Corporation Electronic circuit package using conductive sealing material
CN108493176B (zh) * 2018-03-27 2020-07-10 浙江中正智能科技有限公司 一种指纹识别芯片装置及其制造方法
DE102018116682A1 (de) * 2018-07-10 2020-01-16 Elringklinger Ag Wärmeabschirmvorrichtung, insbesondere an lokal unterschiedlich auftretende Wärmeeinträge pro Fläche anpassbare Wärmeabschirmvorrichtung
JP7503401B2 (ja) * 2020-03-19 2024-06-20 太陽誘電株式会社 コイル部品及び電子機器
CN112701096A (zh) * 2020-12-22 2021-04-23 杰群电子科技（东莞）有限公司 一种半导体模组封装工艺及半导体模组

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2724079B2 (ja) * 1992-10-06 1998-03-09 京セラ株式会社 半導体素子収納用パッケージ
JP2673928B2 (ja) * 1993-05-11 1997-11-05 株式会社巴川製紙所 電子部品素子封止用蓋材
JP4662324B2 (ja) * 2002-11-18 2011-03-30 太陽誘電株式会社 回路モジュール
JP3842229B2 (ja) * 2003-02-27 2006-11-08 太陽誘電株式会社 回路モジュール
JP4020874B2 (ja) * 2003-03-13 2007-12-12 三洋電機株式会社 半導体装置およびその製造方法
JP2005019900A (ja) * 2003-06-27 2005-01-20 Kyocera Corp 電子装置
US7701728B2 (en) * 2004-10-28 2010-04-20 Kyocera Corporation Electronic component module and radio comunications equipment
KR100874302B1 (ko) * 2005-02-18 2008-12-18 도요 잉키 세이조 가부시끼가이샤 전자파 차폐성 접착필름, 그 제조방법 및 피착체의 전자파차폐방법
JP2006286915A (ja) * 2005-03-31 2006-10-19 Taiyo Yuden Co Ltd 回路モジュール

Also Published As

Publication number Publication date
CN101690442B (zh) 2012-10-10
TW200917430A (en) 2009-04-16
JP2009016715A (ja) 2009-01-22
KR20100045461A (ko) 2010-05-03
CN101690442A (zh) 2010-03-31
WO2009008243A1 (ja) 2009-01-15

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