KR20100045461A - 쉴드 및 방열성을 가지는 고주파 모듈 및 그의 제조 방법 - Google Patents

쉴드 및 방열성을 가지는 고주파 모듈 및 그의 제조 방법 Download PDF

Info

Publication number
KR20100045461A
KR20100045461A KR1020107002591A KR20107002591A KR20100045461A KR 20100045461 A KR20100045461 A KR 20100045461A KR 1020107002591 A KR1020107002591 A KR 1020107002591A KR 20107002591 A KR20107002591 A KR 20107002591A KR 20100045461 A KR20100045461 A KR 20100045461A
Authority
KR
South Korea
Prior art keywords
frequency module
resin
high frequency
conductive
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020107002591A
Other languages
English (en)
Korean (ko)
Inventor
켄이치로 수지모토
히사토시 무라카미
Original Assignee
다츠타 시스테무 에레쿠토로니쿠스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다츠타 시스테무 에레쿠토로니쿠스 가부시키가이샤 filed Critical 다츠타 시스테무 에레쿠토로니쿠스 가부시키가이샤
Publication of KR20100045461A publication Critical patent/KR20100045461A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/281—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials
    • H10W42/284—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials shielding resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020107002591A 2007-07-09 2008-06-13 쉴드 및 방열성을 가지는 고주파 모듈 및 그의 제조 방법 Ceased KR20100045461A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007179473A JP2009016715A (ja) 2007-07-09 2007-07-09 シールド及び放熱性を有する高周波モジュール及びその製造方法
JPJP-P-2007-179473 2007-07-09

Publications (1)

Publication Number Publication Date
KR20100045461A true KR20100045461A (ko) 2010-05-03

Family

ID=40228422

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107002591A Ceased KR20100045461A (ko) 2007-07-09 2008-06-13 쉴드 및 방열성을 가지는 고주파 모듈 및 그의 제조 방법

Country Status (5)

Country Link
JP (1) JP2009016715A (https=)
KR (1) KR20100045461A (https=)
CN (1) CN101690442B (https=)
TW (1) TWI434377B (https=)
WO (1) WO2009008243A1 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010225620A (ja) * 2009-03-19 2010-10-07 Panasonic Corp 回路モジュール
JP5416458B2 (ja) * 2009-04-02 2014-02-12 タツタ電線株式会社 シールドおよび放熱性を有する高周波モジュールの製造方法
JP5045727B2 (ja) 2009-10-21 2012-10-10 ソニー株式会社 高周波モジュールおよび受信装置
JP2012019091A (ja) * 2010-07-08 2012-01-26 Sony Corp モジュールおよび携帯端末
KR101460271B1 (ko) * 2011-01-07 2014-11-11 가부시키가이샤 무라타 세이사쿠쇼 전자 부품 모듈의 제조 방법 및 전자 부품 모듈
WO2012101857A1 (ja) * 2011-01-28 2012-08-02 株式会社村田製作所 モジュール基板
JP5624903B2 (ja) * 2011-01-31 2014-11-12 京セラドキュメントソリューションズ株式会社 基板装置
KR20120131530A (ko) 2011-05-25 2012-12-05 삼성전자주식회사 반도체 장치 및 그 제조 방법
JP5278579B2 (ja) * 2012-05-25 2013-09-04 ソニー株式会社 高周波モジュールおよび受信装置
JP2013247339A (ja) * 2012-05-29 2013-12-09 Tdk Corp 電子部品モジュールの製造方法
US9202747B2 (en) 2012-09-28 2015-12-01 Skyworks Solutions, Inc. Segmented conductive top layer for radio frequency isolation
CN104159391A (zh) * 2013-05-15 2014-11-19 中兴通讯股份有限公司 一种用于终端的散热装置及终端
JP5527785B1 (ja) * 2013-08-08 2014-06-25 太陽誘電株式会社 回路モジュール及び回路モジュールの製造方法
WO2015186624A1 (ja) 2014-06-02 2015-12-10 タツタ電線株式会社 導電性接着フィルム、プリント回路基板、及び、電子機器
CN105811891A (zh) * 2016-04-20 2016-07-27 佛山臻智微芯科技有限公司 减低移动通信多级功率放大器中带内噪声的结构和方法
CN106340498B (zh) * 2016-10-20 2018-11-09 江苏长电科技股份有限公司 一种具有电磁屏蔽接地功能的封装结构及其制造方法
US10373917B2 (en) * 2017-12-05 2019-08-06 Tdk Corporation Electronic circuit package using conductive sealing material
CN108493176B (zh) * 2018-03-27 2020-07-10 浙江中正智能科技有限公司 一种指纹识别芯片装置及其制造方法
DE102018116682A1 (de) * 2018-07-10 2020-01-16 Elringklinger Ag Wärmeabschirmvorrichtung, insbesondere an lokal unterschiedlich auftretende Wärmeeinträge pro Fläche anpassbare Wärmeabschirmvorrichtung
JP7503401B2 (ja) * 2020-03-19 2024-06-20 太陽誘電株式会社 コイル部品及び電子機器
CN112701096A (zh) * 2020-12-22 2021-04-23 杰群电子科技（东莞）有限公司 一种半导体模组封装工艺及半导体模组

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2724079B2 (ja) * 1992-10-06 1998-03-09 京セラ株式会社 半導体素子収納用パッケージ
JP2673928B2 (ja) * 1993-05-11 1997-11-05 株式会社巴川製紙所 電子部品素子封止用蓋材
JP4662324B2 (ja) * 2002-11-18 2011-03-30 太陽誘電株式会社 回路モジュール
JP3842229B2 (ja) * 2003-02-27 2006-11-08 太陽誘電株式会社 回路モジュール
JP4020874B2 (ja) * 2003-03-13 2007-12-12 三洋電機株式会社 半導体装置およびその製造方法
JP2005019900A (ja) * 2003-06-27 2005-01-20 Kyocera Corp 電子装置
US7701728B2 (en) * 2004-10-28 2010-04-20 Kyocera Corporation Electronic component module and radio comunications equipment
KR100874302B1 (ko) * 2005-02-18 2008-12-18 도요 잉키 세이조 가부시끼가이샤 전자파 차폐성 접착필름, 그 제조방법 및 피착체의 전자파차폐방법
JP2006286915A (ja) * 2005-03-31 2006-10-19 Taiyo Yuden Co Ltd 回路モジュール

Also Published As

Publication number Publication date
CN101690442B (zh) 2012-10-10
TW200917430A (en) 2009-04-16
JP2009016715A (ja) 2009-01-22
TWI434377B (zh) 2014-04-11
CN101690442A (zh) 2010-03-31
WO2009008243A1 (ja) 2009-01-15

Similar Documents

Publication Publication Date Title
KR20100045461A (ko) 쉴드 및 방열성을 가지는 고주파 모듈 및 그의 제조 방법
KR101616625B1 (ko) 반도체 패키지 및 그 제조방법
JP5416458B2 (ja) シールドおよび放熱性を有する高周波モジュールの製造方法
US8785789B2 (en) Printed circuit board and method for manufacturing the same
US20180130761A1 (en) Semiconductor package, manufacturing method thereof, and electronic element module using the same
KR101153570B1 (ko) 반도체 패키지 모듈
US20080272469A1 (en) Semiconductor die package and integrated circuit package and fabricating method thereof
CN112271165A (zh) 半导体封装结构及其制造方法和半导体器件
US9839132B2 (en) Component-embedded substrate
KR20130014122A (ko) 전자 소자 내장 인쇄회로기판 및 그 제조방법
KR20120095357A (ko) 전자 디바이스, 전자 장치, 전자 디바이스 제조 방법
CN108109991B (zh) 用于翘曲改进的隔室屏蔽
KR20150006686A (ko) 반도체 패키지 및 그 제조 방법
CN106328633B (zh) 电子装置模块及其制造方法
CN104813753B (zh) 高频模块
KR20150035251A (ko) 외부접속단자부와 외부접속단자부를 갖는 반도체 패키지 및 그들의 제조방법
US20130112464A1 (en) Conformal reference planes in substrates
US10334728B2 (en) Reduced-dimension via-land structure and method of making the same
US9345125B2 (en) Wiring substrate
KR100751995B1 (ko) 인쇄회로기판 및 그 제조방법
TW201703601A (zh) 一種柔性線路板及其製作方法
JP2012015548A (ja) シールド及び放熱性を有する高周波モジュール及びその製造方法
US7755909B2 (en) Slim design main board
KR102207270B1 (ko) 반도체 패키지 및 그 제조방법
KR101167453B1 (ko) 전자부품 내장형 인쇄회로기판 및 그 제조방법

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

AMND Amendment
J201 Request for trial against refusal decision
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

PB0901 Examination by re-examination before a trial

St.27 status event code: A-6-3-E10-E12-rex-PB0901

B601 Maintenance of original decision after re-examination before a trial
PB0601 Maintenance of original decision after re-examination before a trial

St.27 status event code: N-3-6-B10-B17-rex-PB0601

J301 Trial decision
PJ1301 Trial decision

St.27 status event code: A-3-3-V10-V15-crt-PJ1301

Decision date: 20150429

Appeal event data comment text: Appeal Kind Category : Appeal against decision to decline refusal, Appeal Ground Text : 2010 7002591

Appeal request date: 20140912

Appellate body name: Patent Examination Board

Decision authority category: Office appeal board

Decision identifier: 2014101005728

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000