JP2009016715A - シールド及び放熱性を有する高周波モジュール及びその製造方法 - Google Patents

シールド及び放熱性を有する高周波モジュール及びその製造方法 Download PDF

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Publication number
JP2009016715A
JP2009016715A JP2007179473A JP2007179473A JP2009016715A JP 2009016715 A JP2009016715 A JP 2009016715A JP 2007179473 A JP2007179473 A JP 2007179473A JP 2007179473 A JP2007179473 A JP 2007179473A JP 2009016715 A JP2009016715 A JP 2009016715A
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JP
Japan
Prior art keywords
frequency module
resin
shield
heat dissipation
ground pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007179473A
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English (en)
Japanese (ja)
Other versions
JP2009016715A5 (https=
Inventor
Kenichiro Sugimoto
健一朗 杉本
Hisatoshi Murakami
久敏 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta System Electronics Co Ltd
Original Assignee
Tatsuta System Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta System Electronics Co Ltd filed Critical Tatsuta System Electronics Co Ltd
Priority to JP2007179473A priority Critical patent/JP2009016715A/ja
Priority to CN2008800236271A priority patent/CN101690442B/zh
Priority to PCT/JP2008/060836 priority patent/WO2009008243A1/ja
Priority to KR1020107002591A priority patent/KR20100045461A/ko
Priority to TW097125570A priority patent/TWI434377B/zh
Publication of JP2009016715A publication Critical patent/JP2009016715A/ja
Publication of JP2009016715A5 publication Critical patent/JP2009016715A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/281—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials
    • H10W42/284—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials shielding resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2007179473A 2007-07-09 2007-07-09 シールド及び放熱性を有する高周波モジュール及びその製造方法 Pending JP2009016715A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007179473A JP2009016715A (ja) 2007-07-09 2007-07-09 シールド及び放熱性を有する高周波モジュール及びその製造方法
CN2008800236271A CN101690442B (zh) 2007-07-09 2008-06-13 具有屏蔽及散热性的高频模块及其制造方法
PCT/JP2008/060836 WO2009008243A1 (ja) 2007-07-09 2008-06-13 シールド及び放熱性を有する高周波モジュール及びその製造方法
KR1020107002591A KR20100045461A (ko) 2007-07-09 2008-06-13 쉴드 및 방열성을 가지는 고주파 모듈 및 그의 제조 방법
TW097125570A TWI434377B (zh) 2007-07-09 2008-07-07 A high frequency module having shielding property and heat dissipation property and a manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007179473A JP2009016715A (ja) 2007-07-09 2007-07-09 シールド及び放熱性を有する高周波モジュール及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011220028A Division JP2012015548A (ja) 2011-10-04 2011-10-04 シールド及び放熱性を有する高周波モジュール及びその製造方法

Publications (2)

Publication Number Publication Date
JP2009016715A true JP2009016715A (ja) 2009-01-22
JP2009016715A5 JP2009016715A5 (https=) 2009-11-19

Family

ID=40228422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007179473A Pending JP2009016715A (ja) 2007-07-09 2007-07-09 シールド及び放熱性を有する高周波モジュール及びその製造方法

Country Status (5)

Country Link
JP (1) JP2009016715A (https=)
KR (1) KR20100045461A (https=)
CN (1) CN101690442B (https=)
TW (1) TWI434377B (https=)
WO (1) WO2009008243A1 (https=)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010106599A1 (ja) * 2009-03-19 2010-09-23 パナソニック株式会社 回路モジュール及び電子機器
WO2010113687A1 (ja) * 2009-04-02 2010-10-07 タツタ電線株式会社 シールドおよび放熱性を有する高周波モジュールおよびその製造方法
JP2011091574A (ja) * 2009-10-21 2011-05-06 Sony Corp 高周波モジュールおよび受信装置
WO2012101857A1 (ja) * 2011-01-28 2012-08-02 株式会社村田製作所 モジュール基板
JP2012160530A (ja) * 2011-01-31 2012-08-23 Kyocera Document Solutions Inc 基板装置
JP2012191654A (ja) * 2012-05-25 2012-10-04 Sony Corp 高周波モジュールおよび受信装置
JP2013247339A (ja) * 2012-05-29 2013-12-09 Tdk Corp 電子部品モジュールの製造方法
WO2014052796A1 (en) * 2012-09-28 2014-04-03 Skyworks Solutions, Inc. Systems and methods for providing intramodule radio frequency isolation
JPWO2012093690A1 (ja) * 2011-01-07 2014-06-09 株式会社村田製作所 電子部品モジュールの製造方法、及び電子部品モジュール
US8937370B2 (en) 2011-05-25 2015-01-20 Samsung Electronics Co., Ltd. Memory device and fabricating method thereof
KR20170013202A (ko) 2014-06-02 2017-02-06 다츠다 덴센 가부시키가이샤 도전성 접착 필름, 프린트 회로 기판, 및 전자 기기
JP2021150512A (ja) * 2020-03-19 2021-09-27 太陽誘電株式会社 コイル部品及び電子機器

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012019091A (ja) * 2010-07-08 2012-01-26 Sony Corp モジュールおよび携帯端末
CN104159391A (zh) * 2013-05-15 2014-11-19 中兴通讯股份有限公司 一种用于终端的散热装置及终端
JP5527785B1 (ja) * 2013-08-08 2014-06-25 太陽誘電株式会社 回路モジュール及び回路モジュールの製造方法
CN105811891A (zh) * 2016-04-20 2016-07-27 佛山臻智微芯科技有限公司 减低移动通信多级功率放大器中带内噪声的结构和方法
CN106340498B (zh) * 2016-10-20 2018-11-09 江苏长电科技股份有限公司 一种具有电磁屏蔽接地功能的封装结构及其制造方法
US10373917B2 (en) * 2017-12-05 2019-08-06 Tdk Corporation Electronic circuit package using conductive sealing material
CN108493176B (zh) * 2018-03-27 2020-07-10 浙江中正智能科技有限公司 一种指纹识别芯片装置及其制造方法
DE102018116682A1 (de) * 2018-07-10 2020-01-16 Elringklinger Ag Wärmeabschirmvorrichtung, insbesondere an lokal unterschiedlich auftretende Wärmeeinträge pro Fläche anpassbare Wärmeabschirmvorrichtung
CN112701096A (zh) * 2020-12-22 2021-04-23 杰群电子科技（东莞）有限公司 一种半导体模组封装工艺及半导体模组

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120362A (ja) * 1992-10-06 1994-04-28 Kyocera Corp 半導体素子収納用パッケージ
JPH06326204A (ja) * 1993-05-11 1994-11-25 Tomoegawa Paper Co Ltd 電子部品素子封止用蓋材
JP2004172176A (ja) * 2002-11-18 2004-06-17 Taiyo Yuden Co Ltd 回路モジュール
WO2006046713A1 (ja) * 2004-10-28 2006-05-04 Kyocera Corporation 電子部品モジュール及び無線通信機器
WO2006088127A1 (ja) * 2005-02-18 2006-08-24 Toyo Ink Manufacturing Co., Ltd. 電磁波シールド性接着フィルム及びその製造方法、並びに被着体の電磁波遮蔽方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3842229B2 (ja) * 2003-02-27 2006-11-08 太陽誘電株式会社 回路モジュール
JP4020874B2 (ja) * 2003-03-13 2007-12-12 三洋電機株式会社 半導体装置およびその製造方法
JP2005019900A (ja) * 2003-06-27 2005-01-20 Kyocera Corp 電子装置
JP2006286915A (ja) * 2005-03-31 2006-10-19 Taiyo Yuden Co Ltd 回路モジュール

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120362A (ja) * 1992-10-06 1994-04-28 Kyocera Corp 半導体素子収納用パッケージ
JPH06326204A (ja) * 1993-05-11 1994-11-25 Tomoegawa Paper Co Ltd 電子部品素子封止用蓋材
JP2004172176A (ja) * 2002-11-18 2004-06-17 Taiyo Yuden Co Ltd 回路モジュール
WO2006046713A1 (ja) * 2004-10-28 2006-05-04 Kyocera Corporation 電子部品モジュール及び無線通信機器
WO2006088127A1 (ja) * 2005-02-18 2006-08-24 Toyo Ink Manufacturing Co., Ltd. 電磁波シールド性接着フィルム及びその製造方法、並びに被着体の電磁波遮蔽方法

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010106599A1 (ja) * 2009-03-19 2010-09-23 パナソニック株式会社 回路モジュール及び電子機器
WO2010113687A1 (ja) * 2009-04-02 2010-10-07 タツタ電線株式会社 シールドおよび放熱性を有する高周波モジュールおよびその製造方法
JP2010245139A (ja) * 2009-04-02 2010-10-28 Tatsuta Electric Wire & Cable Co Ltd シールドおよび放熱性を有する高周波モジュールおよびその製造方法
JP2011091574A (ja) * 2009-10-21 2011-05-06 Sony Corp 高周波モジュールおよび受信装置
US8923748B2 (en) 2009-10-21 2014-12-30 Sony Corporation High frequency module and receiver
JPWO2012093690A1 (ja) * 2011-01-07 2014-06-09 株式会社村田製作所 電子部品モジュールの製造方法、及び電子部品モジュール
WO2012101857A1 (ja) * 2011-01-28 2012-08-02 株式会社村田製作所 モジュール基板
JP5633582B2 (ja) * 2011-01-28 2014-12-03 株式会社村田製作所 モジュール基板
JP2012160530A (ja) * 2011-01-31 2012-08-23 Kyocera Document Solutions Inc 基板装置
US8937370B2 (en) 2011-05-25 2015-01-20 Samsung Electronics Co., Ltd. Memory device and fabricating method thereof
JP2012191654A (ja) * 2012-05-25 2012-10-04 Sony Corp 高周波モジュールおよび受信装置
JP2013247339A (ja) * 2012-05-29 2013-12-09 Tdk Corp 電子部品モジュールの製造方法
WO2014052796A1 (en) * 2012-09-28 2014-04-03 Skyworks Solutions, Inc. Systems and methods for providing intramodule radio frequency isolation
US9202748B2 (en) 2012-09-28 2015-12-01 Skyworks Solutions, Inc. Segmented conductive ground plane for radio frequency isolation
US9202747B2 (en) 2012-09-28 2015-12-01 Skyworks Solutions, Inc. Segmented conductive top layer for radio frequency isolation
US9214387B2 (en) 2012-09-28 2015-12-15 Skyworks Solutions, Inc. Systems and methods for providing intramodule radio frequency isolation
KR20170013202A (ko) 2014-06-02 2017-02-06 다츠다 덴센 가부시키가이샤 도전성 접착 필름, 프린트 회로 기판, 및 전자 기기
JP2021150512A (ja) * 2020-03-19 2021-09-27 太陽誘電株式会社 コイル部品及び電子機器
JP7503401B2 (ja) 2020-03-19 2024-06-20 太陽誘電株式会社 コイル部品及び電子機器

Also Published As

Publication number Publication date
CN101690442B (zh) 2012-10-10
TW200917430A (en) 2009-04-16
TWI434377B (zh) 2014-04-11
KR20100045461A (ko) 2010-05-03
CN101690442A (zh) 2010-03-31
WO2009008243A1 (ja) 2009-01-15

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