CN101690437B - 电控制仪 - Google Patents

电控制仪 Download PDF

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CN101690437B
CN101690437B CN2008800219280A CN200880021928A CN101690437B CN 101690437 B CN101690437 B CN 101690437B CN 2008800219280 A CN2008800219280 A CN 2008800219280A CN 200880021928 A CN200880021928 A CN 200880021928A CN 101690437 B CN101690437 B CN 101690437B
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printed conductor
conductor substrate
outer casing
casing member
electric
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CN101690437A (zh
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R·贝克
C·拉默斯
J·杰格
J·沃尔夫
V·霍克霍尔泽
U·特雷谢尔
H·布贝尔
K·沃格特莱恩德
J·本兹勒
T·雷卡
W·库恩
T·韦萨
M·克拉普
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Robert Bosch GmbH
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K1/18Printed circuits structurally associated with non-printed electric components
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    • H05K5/02Details
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16HGEARING
    • F16H61/00Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
    • F16H61/0003Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
    • F16H61/0006Electronic control units for transmission control, e.g. connectors, casings or circuit boards
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    • H05K5/0026Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463Filling compound, e.g. potted resin
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854Heat transfer by conduction from internal heat source to heat radiating structure
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
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    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
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    • H05K2201/10189Non-printed connector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10371Shields or metal cases
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10439Position of a single component
    • H05K2201/10446Mounted on an edge
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147Sealing or impregnating, e.g. of pores
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1572Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

公开了一种电控制仪,所述电气控制仪具有印制导线基片(2)、外壳件(3、4)和至少一个仪器插头件(6),在所述印制导线基片上布置了电子线路(9),所述电子线路包括多个通过所述印制导线基片的印制导线(12)彼此间相连接的电结构元件(11),所述外壳件用于覆盖所述印制导线基片上的电结构元件,所述仪器插头件(6)与所述结构元件进行电连接并且在所述印制导线基片(2)的被外壳件(3、4)所覆盖的部分的外部布置在所述印制导线基片上,其中所述结构元件与仪器插头件之间的电连接通过所述印制导线基片的印制导线(14)来进行。在此提出,在所述印制导线基片(2)的被外壳件(3、4)所覆盖的部分的外部并且在所述印制导线基片(2)的设有仪器插头件(6)的部分的外部在所述印制导线基片(2)上还布置了至少一个用于另外的电组件(7、8)的触点(21、22)。

Description

电控制仪
技术领域
本发明涉及一种电控制仪。
背景技术
这样的控制仪比如从DE 4023319C1中得到公开并且具有印制导线基片,所述印制导线基片构造为层压到板上的柔性的印制导线薄膜的形式。所述印制导线基片在两侧装备有形成电子线路的电结构元件。所述结构元件被两个设置在所述印制导线基片的上侧面及下侧面上的外壳件所覆盖。在所述印制导线基片的被外壳件所覆盖的区域的外部,在该印制导线基片上布置了仪器插头件,该仪器插头件通过所述印制导线基片的印制导线与所述结构元件相连接并且用于将控制仪连接到外部的电缆束上。这种公开的控制仪用于安装到汽车的发动机舱中。
此外,从DE 19528632A1中公开了一种控制仪,该控制仪具有装备有电结构元件的印制导线基片,该印制导线基片在上侧面和下侧面上用外壳半壳所覆盖。所述半壳则通过能够旋紧的紧固件固定在所述印制导线基片上。安装到印制导线基片上的功率结构元件在运行中产生热量,所述热量通过所述功率结构元件下面的通孔敷镀(Durchkontaktierung)排出到所述印制导线基片的下侧面上的导热层上并且从那里排出到与该导热层接触的外壳件上。
此外,从WO 200&/066983中公开了一种用于变速器的构造为控制模块的电控制仪,在该控制仪中在支座上布置了仪器插头和传感器,它们的电接头通过柔性的导线薄膜插入外壳内腔中并且在那里通过接线与单独制造的线路件接触。
发明内容
按本发明的电控制仪具有印制导线基片、至少一个外壳件和至少一个仪器插头件,其中在所述印制导线基片上布置了电子线路,所述电子线路包括多个通过所述印制导线基片的印制导线彼此间相连接的电结构元件,所述外壳件用于覆盖所述印制导线基片上的电结构元件,所述仪器插头件与所述电结构元件进行电连接并且在所述印制导线基片的被所述至少一个外壳件所覆盖的部分的外部布置在所述印制导线基片上,并且其中所述电结构元件与仪器插头件之间的电连接通过所述印制导线基片的印制导线来进行,其中,在所述印制导线基片的被所述至少一个外壳件所覆盖的部分的外部并且在所述印制导线基片的设有仪器插头件的部分的外部在所述印制导线基片上还布置了至少一个用于另外的电组件的触点,其特征在于,所述印制导线基片的未被所述至少一个外壳件和所述仪器插头件以及所述至少一个触点所覆盖的外面的区域设有保护涂层。相对于已知的控制仪,所述按本发明的电控制仪具有这样的优点,也就是适合于以成本特别低廉的和特别简单的制造方式安装到自动变速器上。安装在自动变速器中的控制仪除了所述仪器插头和由彼此相连接的电结构元件构成的电子线路件之外还必须与大量其它的电组件相接触,如执行器和/或传感器。所述按本发明的控制仪有利地仅仅具有一个唯一的共同的印制导线基片。它可以是印制电路板、柔性的设置在金属支座上的导线薄膜(Leiterfolio)或者其它的合适的印制导线基片。重要的是,所述印制导线基片的印制导线不仅用于电连接那些在印制导线基片上形成被外壳件覆盖的电子线路件的电结构元件,而且用于其它的将所述线路件与仪器插头件和至少一个用于另外的电组件的触点相连接的印制导线。所述至少一个触点布置在所述印制导线基片的被所述外壳件或者在设置多个外壳件的情况下被这些外壳件所覆盖的部分的外面并且布置在所述印制导线基片的设有所述仪器插头件的部分的外面。
所述至少一个触点可以有利地与设置在所述印制导线基片上的传感器连接件进行电连接。除此以外,可以在所述印制导线基片上在所述被外壳件覆盖的区域的外部设置至少一个触点,该触点与电液的执行器比如能够电操纵的调压阀或者另一个变速器组件的配对触点进行电连接。
本发明的有利的设计方案和改进方案能够通过以下所说明的措施来实现。
电组件如传感器连接件可以有利地在所述印制导线基片的被外壳件覆盖的区域的外部直接布置在该印制导线基片上。其它的在所述被外壳件覆盖的区域外部设置在印制导线基片上的触点可以与在空间上远离所述印制导线基片布置的执行器进行电连接。
特别有利的是,所述印制导线基片的未被所述至少一个外壳件和所述仪器插头件以及所述至少一个触点所覆盖的外面的区域设有保护涂层。具有第一面和背向所述第一面的第二面以及环绕的端面的板状的印制导线基片可以有利地包括设置在所述第一面及第二面上的保护层以及设置在所述环绕的端面上的棱边覆盖层作为保护涂层。所述保护涂层可以包括铜层、漆层或者其它合适的有利地防止变速器油、水和其它有害的介质扩散到基片中的钝化层。
为改进散热效果,至少一个外壳件可以设有平坦的表面用于支承在设置用于散热的冷却体尤其汽车变速器的液压板上。
通过以下方式来进一步改进散热效果,即至少一个布置在所述印制导线基片的第一面上的产生热量的电结构元件通过所述印制导线基片的通孔敷镀与设置在所述印制导线基片的背向所述第一面的第二面上的导热层进行热连接。为进一步改进散热效果,所述导热层与外壳件和/或冷却体处于导热接触之中。
附图说明
本发明的实施例在附图中示出,并且在接下来的说明中得到详细解释。其中:
图1是安装到变速器的液压板上的按本发明的电控制仪连同布置在其上面的传感器及执行器的横截面;
图2是所述控制仪的印制导线基片的俯视图,其中没有传感器、执行器和外壳件;
图3是图1的放大的细节;
图4是按本发明的另一种实施例的印制导线基片的横截面的细节;
图5是本发明的另一种实施例的横截面,其中为简单起见未示出仪器插头件;
图6是第四实施例的细节。
图7是第五实施例的细节。
具体实施方式
图1示出了本发明的第一实施例的横截面。所述按本发明的电控制仪1包括印制导线基片2。该印制导线基片2可以构造为单层印制电路板或者多层印制电路板或者构造为层压到金属板上的柔性的导线薄膜或者构造为具有埋入其中的印制导线的注塑件或者以其它方式构成。所述印制导线基片基本上构造为板状结构,其具有第一面15和背向该第一面15的第二面16和环绕的端面31。在所述第一面15和第二面16上,所述印制导线基片2在局部受限制的区域中设有形成电子线路9的电结构元件11。所述结构元件11当然也可以仅仅设置在所述印制导线基片的一面上。装备有所述结构元件11的区域在图2中通过虚线来表示。所述电结构元件11通过所述印制导线基片2的印制导线12彼此进行电连接。所述印制导线可以通过多层基片的一个或者多个层来敷设。除了用于所述结构元件11的布线的印制导线12之外,在所述印制导线基片上布置了其它的印制导线13和印制导线14,所述印制导线13和印制导线14通往所述印制导线基片2的在第一面15和第二面16上被电子线路9占用的区域之外的偏远区域。如可以在图2中看出的一样,印制导线基片具有最大长度a和最大宽度b,如此设计所述最大长度a和最大宽度b的尺寸,从而产生尽可能少的材料边角料。所述印制导线基片2的表面伸展与汽车变速器中的情况相匹配。如可以在图1中看出的一样,第一面15上的属于所述电子线路9的结构元件11用外壳件3覆盖,而第二面16上的结构元件11则用第二外壳件4覆盖。所述外壳件3、4比如可以构造为金属的半壳件,比如构造为冲压弯曲件。如可以最好地在图3中看出的一样,所述第一外壳件3和第二外壳件4以已知的方式在边缘区域中多次折弯,从而可以分别将环绕的密封圈17布置在相应的外壳件的折弯的区域与所述印制导线基片2之间。可以借助于螺纹连接18或者以其它合适的方式将所述第一外壳件3和第二外壳件4固定在所述印制导线基片2上,其中相应的环绕的密封圈17被压合在所配属的外壳件与所述印制导线基片2之间并且使所述电子线路9对外密封。
所述印制导线基片2的印制导线14将电结构元件11与仪器插头件6相连接,该仪器插头件6布置在所述印制导线基片上的被外壳件3、4所覆盖的区域之外。该仪器插头件6用于将控制仪1连接到外部的电缆束上。重要的是,在所述印制导线基片2上的被所述外壳件3、4所覆盖的区域之外以及被仪器插头件6所覆盖的区域之外布置了至少一个触点21,该触点21用于接触所述控制仪的另外的电组件。所述至少一个触点21比如可以构造为金属化的表面或者通孔敷镀的形式。
如在图1中示出的一样,所述另外的组件比如可以是传感器连接件7。该传感器连接件7用于连接到转速传感器上并且借助于两根触针30与所述印制导线基片上的两个触点21进行电连接。所述触点21如在图2中示出的一样通过印制导线13与所述电子线路9相连接。所述传感器连接件7则可以以机械方式在被外壳件3、4和仪器插头件所覆盖的区域之外固定在所述印制导线基片2上。此外如可以在图1中看出的一样,在所述印制导线基片的第二面上布置至少一个另外的触点22,该触点22借助于有导电能力的弹簧接触元件29与电液的执行器相连接。所述电液的执行器8比如可以是调压阀,该调压阀对变速器的液压管路中的液压进行调节。在所述印制导线基片2上,可以在所述被外壳件3、4和仪器插头件6覆盖的区域之外布置任意多的其它触点,用于接触变速器的电组件如传感器、执行器、夹紧触点和压紧触点。触点与所述电组件的接触可以借助于插头触点、焊接触点、压入触点、弹簧触点或者以其它合适的方式来进行。所有的触点都通过所述印制导线基片的印制导线与所述电子线路9相连接。
装备有外壳件3、4、仪器插头件6和触点21、22以及必要时装备有电组件7的印制导线基片2以所述第二外壳件4的平坦的外表面安装到冷却体10上,所述冷却体10比如可以是变速器的液压板。在所述液压板上固定着多个执行器8,所述执行器8通过弹簧接触元件29与所述印制导线基片上的所配属的触点22进行电连接。
如在图4中示出的一样,也可以取代比如半壳状的外壳件3或4而使用以浇铸材料20来填充的框架件19作为用于对所述电结构元件11进行覆盖的外壳件。但是也可以通过制模材料、泡沫、凝胶或者以其它的方式来构成所述将结构元件11覆盖的外壳件。重要的是,通过所述外壳件3、4来防止所述第一面15上的结构元件11与所述第二面16上的结构元件11受到腐蚀性介质的影响。
在图5中示出了本发明的一种特别优选的实施例。该实施例与在图1中示出的实施例的区别在于,所述印制导线基片2的第一面15及第二面16上的未被外壳件3、4覆盖的区域设有保护涂层。为此,所述印制导线基片2的第一面15以及背向所述第一面15的第二面16除了被未示出的仪器插头件6、外壳件3、4和触点21、22占用的外部区域之外分别设有大面积涂覆的保护层23。所述保护层23优选包括大面积的铜质印制导线、漆层或者合适的硬的或者软的涂层,该涂层防止介质比如变速器油或者潮湿的空气扩散到基片中。在所述印制导线基片2的环绕的端面上作为保护涂层设置了棱边覆盖层24。该棱边覆盖层24可以通过漆、制模材料、挤压包封或者其它合适的钝化方法来实现。
产生热量的结构元件11的散热可以以不同的方式来进行。如在图6中示出的一样,由所述印制导线基片2的第一面15上的功率结构元件11产生的热量比如可以以已知的方式通过设置在所述印制导线基片中的通孔敷镀25排出到第二面16上。所述印制导线基片2的第二面16与导热层26处于热接触之中。所述导热层26比如可以是铜层,该铜层将热量传递到与之热接触的外壳件4上。热量从那里排出到冷却体10上,所述外壳件4平放在所述冷却体10上并且该冷却体10比如是变速器的液压板。但是热量也可以直接从所述导热层26传递到冷却体10上。为此目的,如在图7中示出的一样所述冷却体可以设有平台27,所述印制导线基片2在中间布置导热层26的情况下平放在所述平台27上。作为替代方案,如在图8中示出的一样,所述冷却体10也可以具有凹处32和将该凹处32包围的边缘28,所述印制导线基片2在中间布置导热层26的情况下平放到所述边缘28上。

Claims (8)

1.变速器控制模块,具有印制导线基片(2)、至少一个外壳件(3、4)和至少一个仪器插头件(6),其中在所述印制导线基片(2)上布置了电子线路(9),所述电子线路(9)包括多个通过所述印制导线基片的印制导线(12、13、14)彼此间相连接的电结构元件(11),所述外壳件(3、4)用于覆盖所述印制导线基片上的电结构元件,所述仪器插头件(6)与所述电结构元件进行电连接并且在所述印制导线基片(2)的被所述至少一个外壳件(3、4)所覆盖的部分的外部布置在所述印制导线基片(2)上,并且其中所述电结构元件与仪器插头件之间的电连接通过所述印制导线基片的印制导线(14)来进行,其中,在所述印制导线基片(2)的被所述至少一个外壳件(3、4)所覆盖的部分的外部并且在所述印制导线基片(2)的设有仪器插头件(6)的部分的外部在所述印制导线基片(2)上还布置了至少一个用于另外的电组件(7、8)的触点(21、22),其中,所述印制导线基片是多层印制电路板,所述多层印制电路板的印制导线(14)通过多个层来敷设,其中,所述多层印制电路板构造为板状结构,其具有第一面(15)和背向该第一面的第二面(16)以及环绕的端面(31),其特征在于,所述多层印制电路板的未被所述至少一个外壳件(3、4)和所述仪器插头件(6)以及所述至少一个触点(21、22)所覆盖的外面的区域设有用于防止变速器油、水和其它有害的介质扩散到所述多层印制电路板中的保护涂层(23、24),其中,所述保护涂层(23、24)包括设置在所述第一面及第二面上的保护层(23)以及设置在所述环绕的端面上的棱边覆盖层(24)。
2.按权利要求1所述的变速器控制模块,其特征在于,所述另外的电组件(7)布置在所述印制导线基片(2)上。
3.按权利要求1所述的变速器控制模块,其特征在于,所述保护涂层(23、24)包括铜层、漆层或者其它合适的钝化层。
4.按权利要求1所述的变速器控制模块,其特征在于,所述至少一个触点(21)与设置在所述印制导线基片(2)上的传感器连接件(7)进行电连接或者所述至少一个触点(22)与电液的执行器(8)进行电连接。
5.按权利要求1所述的变速器控制模块,其特征在于,至少一个外壳件(4)设有平坦的表面用于支承在设置用于散热的冷却体(10)上。
6.按权利要求5所述的变速器控制模块,其特征在于,所述冷却体是汽车变速器的液压板。
7.按权利要求1所述的变速器控制模块,其特征在于,至少一个布置在所述印制导线基片(2)的第一面(15)上的产生热量的电结构元件(11)通过所述印制导线基片(2)的通孔敷镀(25)与设置在所述印制导线基片的背向所述第一面的第二面(16)上的导热层(26)进行热连接。
8.按权利要求7所述的变速器控制模块,其特征在于,所述导热层(26)与外壳件(3、4)和/或冷却体(10)处于导热接触之中。
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US8488324B2 (en) 2013-07-16
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