CN101689592B - Ⅲ族氮化物半导体发光元件及其制造方法和灯 - Google Patents
Ⅲ族氮化物半导体发光元件及其制造方法和灯 Download PDFInfo
- Publication number
- CN101689592B CN101689592B CN2008800221346A CN200880022134A CN101689592B CN 101689592 B CN101689592 B CN 101689592B CN 2008800221346 A CN2008800221346 A CN 2008800221346A CN 200880022134 A CN200880022134 A CN 200880022134A CN 101689592 B CN101689592 B CN 101689592B
- Authority
- CN
- China
- Prior art keywords
- intermediate layer
- nitride semiconductor
- layer
- iii nitride
- semiconductor light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/36—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done before the formation of the materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/815—Bodies having stress relaxation structures, e.g. buffer layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/8215—Bodies characterised by crystalline imperfections, e.g. dislocations; characterised by the distribution of dopants, e.g. delta-doping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/22—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using physical deposition, e.g. vacuum deposition or sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2921—Materials being crystalline insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
- H10P14/3202—Materials thereof
- H10P14/3214—Materials thereof being Group IIIA-VA semiconductors
- H10P14/3216—Nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3416—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/17—Semiconductor lasers comprising special layers
- H01S2301/173—The laser chip comprising special buffer layers, e.g. dislocation prevention or reduction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Led Devices (AREA)
- Physical Vapour Deposition (AREA)
- Semiconductor Lasers (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007176099A JP4714712B2 (ja) | 2007-07-04 | 2007-07-04 | Iii族窒化物半導体発光素子及びその製造方法、並びにランプ |
| JP176099/2007 | 2007-07-04 | ||
| PCT/JP2008/062072 WO2009005126A1 (ja) | 2007-07-04 | 2008-07-03 | Iii族窒化物半導体発光素子及びその製造方法、並びにランプ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101689592A CN101689592A (zh) | 2010-03-31 |
| CN101689592B true CN101689592B (zh) | 2011-12-28 |
Family
ID=40226167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008800221346A Active CN101689592B (zh) | 2007-07-04 | 2008-07-03 | Ⅲ族氮化物半导体发光元件及其制造方法和灯 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8674398B2 (https=) |
| JP (1) | JP4714712B2 (https=) |
| KR (1) | KR101042417B1 (https=) |
| CN (1) | CN101689592B (https=) |
| TW (1) | TWI491064B (https=) |
| WO (1) | WO2009005126A1 (https=) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5564331B2 (ja) | 2009-05-29 | 2014-07-30 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| CN102034912B (zh) * | 2009-12-29 | 2015-03-25 | 比亚迪股份有限公司 | 发光二极管外延片、其制作方法及芯片的制作方法 |
| KR101484658B1 (ko) * | 2010-04-30 | 2015-01-21 | 캐논 아네르바 가부시키가이샤 | 에피텍셜 박막형성방법, 진공처리장치, 반도체 발광소자 제조방법, 반도체 발광소자, 및 조명장치 |
| JP2012243780A (ja) * | 2011-05-13 | 2012-12-10 | Toshiba Corp | 半導体発光素子及びウェーハ |
| KR102317822B1 (ko) | 2012-07-02 | 2021-10-25 | 어플라이드 머티어리얼스, 인코포레이티드 | 물리 기상 증착에 의한 알루미늄-질화물 버퍼 및 활성 층들 |
| JP5734935B2 (ja) * | 2012-09-20 | 2015-06-17 | 株式会社東芝 | 半導体装置及びその製造方法 |
| US9362715B2 (en) | 2014-02-10 | 2016-06-07 | Soraa Laser Diode, Inc | Method for manufacturing gallium and nitrogen bearing laser devices with improved usage of substrate material |
| US9379525B2 (en) | 2014-02-10 | 2016-06-28 | Soraa Laser Diode, Inc. | Manufacturable laser diode |
| US9520695B2 (en) * | 2013-10-18 | 2016-12-13 | Soraa Laser Diode, Inc. | Gallium and nitrogen containing laser device having confinement region |
| US9368939B2 (en) | 2013-10-18 | 2016-06-14 | Soraa Laser Diode, Inc. | Manufacturable laser diode formed on C-plane gallium and nitrogen material |
| US9520697B2 (en) | 2014-02-10 | 2016-12-13 | Soraa Laser Diode, Inc. | Manufacturable multi-emitter laser diode |
| US9871350B2 (en) | 2014-02-10 | 2018-01-16 | Soraa Laser Diode, Inc. | Manufacturable RGB laser diode source |
| JP2014241417A (ja) * | 2014-07-15 | 2014-12-25 | シャープ株式会社 | アルミニウム含有窒化物中間層の製造方法、窒化物層の製造方法および窒化物半導体素子の製造方法 |
| TWI553901B (zh) * | 2015-09-07 | 2016-10-11 | 環球晶圓股份有限公司 | 紫外光發光二極體及其製造方法 |
| WO2017094028A1 (en) * | 2015-12-02 | 2017-06-08 | Indian Institute Of Technology Bombay | Method and apparatus for forming silicon doped gallium nitride (gan) films by a co-sputtering technique |
| JP7055595B2 (ja) * | 2017-03-29 | 2022-04-18 | 古河機械金属株式会社 | Iii族窒化物半導体基板、及び、iii族窒化物半導体基板の製造方法 |
| JP7112190B2 (ja) * | 2017-09-29 | 2022-08-03 | 日機装株式会社 | 発光装置 |
| FI129628B (en) * | 2019-09-25 | 2022-05-31 | Beneq Oy | Method and apparatus for processing surface of a substrate |
| US12191626B1 (en) | 2020-07-31 | 2025-01-07 | Kyocera Sld Laser, Inc. | Vertically emitting laser devices and chip-scale-package laser devices and laser-based, white light emitting devices |
| CN114910828B (zh) * | 2022-05-16 | 2024-08-16 | 中国工程物理研究院激光聚变研究中心 | 一种判断量子级联激光器快速退火效果的方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003183823A (ja) * | 2001-12-17 | 2003-07-03 | Sharp Corp | スパッタ装置 |
| JP2003332234A (ja) * | 2002-05-15 | 2003-11-21 | Kyocera Corp | 窒化層を有するサファイア基板およびその製造方法 |
| JP2006114886A (ja) * | 2004-09-14 | 2006-04-27 | Showa Denko Kk | n型III族窒化物半導体積層構造体 |
| JP2007067114A (ja) * | 2005-08-30 | 2007-03-15 | Univ Of Tokushima | Iii族窒化物半導体薄膜およびその製造方法並びににiii族窒化物半導体発光素子 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DD142966A1 (de) * | 1979-05-07 | 1980-07-23 | Reinhard Voigt | Verfahren zur in situ-vorbehandlung und zur beschichtungvon substraten mit duennen schichten |
| JPS60173829A (ja) | 1984-02-14 | 1985-09-07 | Nippon Telegr & Teleph Corp <Ntt> | 化合物半導体薄膜の成長方法 |
| JP3026087B2 (ja) | 1989-03-01 | 2000-03-27 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体の気相成長方法 |
| JPH088217B2 (ja) | 1991-01-31 | 1996-01-29 | 日亜化学工業株式会社 | 窒化ガリウム系化合物半導体の結晶成長方法 |
| JPH06120163A (ja) * | 1992-09-30 | 1994-04-28 | Victor Co Of Japan Ltd | 半導体装置の電極形成方法 |
| JP3773282B2 (ja) | 1995-03-27 | 2006-05-10 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体の電極形成方法 |
| JPH0964477A (ja) * | 1995-08-25 | 1997-03-07 | Toshiba Corp | 半導体発光素子及びその製造方法 |
| JPH11102907A (ja) * | 1997-09-26 | 1999-04-13 | Sharp Corp | 半導体装置の製造方法および絶縁膜形成装置 |
| JP2000216249A (ja) * | 1998-11-16 | 2000-08-04 | Sony Corp | 電子装置の製造方法及びその装置 |
| JP3440873B2 (ja) | 1999-03-31 | 2003-08-25 | 豊田合成株式会社 | Iii族窒化物系化合物半導体素子の製造方法 |
| JP3700492B2 (ja) | 1999-09-21 | 2005-09-28 | 豊田合成株式会社 | Iii族窒化物系化合物半導体素子 |
| JP2001168386A (ja) | 1999-09-29 | 2001-06-22 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体素子 |
| US6406931B1 (en) * | 1999-10-12 | 2002-06-18 | Sandia Corporation | Structural tuning of residual conductivity in highly mismatched III-V layers |
| JP2001185493A (ja) * | 1999-12-24 | 2001-07-06 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体の製造方法及びiii族窒化物系化合物半導体素子 |
| JP3994623B2 (ja) * | 2000-04-21 | 2007-10-24 | 豊田合成株式会社 | Iii族窒化物系化合物半導体素子の製造方法 |
| JP4963763B2 (ja) | 2000-12-21 | 2012-06-27 | 日本碍子株式会社 | 半導体素子 |
| JP2003119564A (ja) | 2001-10-12 | 2003-04-23 | Tokyo Electron Ltd | 成膜方法及びプラズマcvd装置 |
| JP4123828B2 (ja) * | 2002-05-27 | 2008-07-23 | 豊田合成株式会社 | 半導体発光素子 |
| JP2005209925A (ja) | 2004-01-23 | 2005-08-04 | Nichia Chem Ind Ltd | 積層半導体基板 |
| JP5004432B2 (ja) * | 2005-04-11 | 2012-08-22 | 東京エレクトロン株式会社 | 金属シリサイド膜を形成する方法、前処理方法、成膜システム、制御プログラムおよびコンピュータ記憶媒体 |
| JP4912843B2 (ja) * | 2006-11-22 | 2012-04-11 | 昭和電工株式会社 | Iii族窒化物化合物半導体発光素子の製造方法 |
-
2007
- 2007-07-04 JP JP2007176099A patent/JP4714712B2/ja active Active
-
2008
- 2008-07-02 TW TW097124942A patent/TWI491064B/zh active
- 2008-07-03 WO PCT/JP2008/062072 patent/WO2009005126A1/ja not_active Ceased
- 2008-07-03 US US12/666,594 patent/US8674398B2/en active Active
- 2008-07-03 CN CN2008800221346A patent/CN101689592B/zh active Active
- 2008-07-03 KR KR1020097026968A patent/KR101042417B1/ko active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003183823A (ja) * | 2001-12-17 | 2003-07-03 | Sharp Corp | スパッタ装置 |
| JP2003332234A (ja) * | 2002-05-15 | 2003-11-21 | Kyocera Corp | 窒化層を有するサファイア基板およびその製造方法 |
| JP2006114886A (ja) * | 2004-09-14 | 2006-04-27 | Showa Denko Kk | n型III族窒化物半導体積層構造体 |
| JP2007067114A (ja) * | 2005-08-30 | 2007-03-15 | Univ Of Tokushima | Iii族窒化物半導体薄膜およびその製造方法並びににiii族窒化物半導体発光素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| US8674398B2 (en) | 2014-03-18 |
| US20100327311A1 (en) | 2010-12-30 |
| KR101042417B1 (ko) | 2011-06-16 |
| JP4714712B2 (ja) | 2011-06-29 |
| TW200917529A (en) | 2009-04-16 |
| KR20100017917A (ko) | 2010-02-16 |
| CN101689592A (zh) | 2010-03-31 |
| WO2009005126A1 (ja) | 2009-01-08 |
| JP2009016531A (ja) | 2009-01-22 |
| TWI491064B (zh) | 2015-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101689592B (zh) | Ⅲ族氮化物半导体发光元件及其制造方法和灯 | |
| KR101067122B1 (ko) | Ⅲ족 질화물 반도체의 제조 방법, ⅲ족 질화물 반도체 발광 소자의 제조 방법 및 ⅲ족 질화물 반도체 발광 소자, 및 램프 | |
| JP5246219B2 (ja) | Iii族窒化物半導体素子の製造方法及びiii族窒化物半導体発光素子の製造方法 | |
| CN101438429B (zh) | Ⅲ族氮化物化合物半导体叠层结构体 | |
| KR101074178B1 (ko) | Ⅲ족 질화물 화합물 반도체 발광 소자의 제조 방법, 및 ⅲ족 질화물 화합물 반도체 발광 소자, 및 램프 | |
| KR20100049123A (ko) | Ⅲ족 질화물 반도체 발광 소자 및 그 제조 방법, 및 램프 | |
| CN101506946B (zh) | Ⅲ族氮化物化合物半导体发光元件的制造方法、ⅲ族氮化物化合物半导体发光元件和灯 | |
| JPWO2010032423A1 (ja) | Iii族窒化物半導体発光素子の製造方法、iii族窒化物半導体発光素子並びにランプ、iii族窒化物半導体発光素子ウエーハの発光波長分布のばらつき低減方法 | |
| JP2008177525A (ja) | Iii族窒化物半導体発光素子の製造方法、及びiii族窒化物半導体発光素子、並びにランプ | |
| KR20090048590A (ko) | Ⅲ족 질화물 화합물 반도체 발광 소자의 제조 방법, 및 ⅲ족 질화물 화합물 반도체 발광 소자와 램프 | |
| CN102113140A (zh) | Ⅲ族氮化物半导体发光元件的制造方法、ⅲ族氮化物半导体发光元件和灯 | |
| JP2011082570A (ja) | Iii族窒化物半導体発光素子の製造方法 | |
| CN101517759B (zh) | Ⅲ族氮化物化合物半导体发光元件的制造方法 | |
| JP2008124060A (ja) | Iii族窒化物化合物半導体発光素子の製造方法、及びiii族窒化物化合物半導体発光素子、並びにランプ | |
| JP2008047763A (ja) | Iii族窒化物化合物半導体発光素子の製造方法、及びiii族窒化物化合物半導体発光素子、並びにランプ | |
| JP2009155672A (ja) | Iii族窒化物半導体の製造方法、iii族窒化物半導体発光素子の製造方法、iii族窒化物半導体製造装置、iii族窒化物半導体及びiii族窒化物半導体発光素子、並びにランプ | |
| JP5179055B2 (ja) | Iii族窒化物半導体の製造方法、iii族窒化物半導体発光素子の製造方法、及びiii族窒化物半導体発光素子、並びにランプ | |
| JP2008106316A (ja) | Iii族窒化物化合物半導体発光素子の製造方法、及びiii族窒化物化合物半導体発光素子、並びにランプ | |
| JP2008198705A (ja) | Iii族窒化物半導体発光素子の製造方法、及びiii族窒化物半導体発光素子、並びにランプ | |
| JP2008135463A (ja) | Iii族窒化物半導体の製造方法、iii族窒化物半導体発光素子の製造方法、及びiii族窒化物半導体発光素子、並びにランプ | |
| JP2010232700A (ja) | Iii族窒化物半導体発光素子の製造方法 | |
| CN101542756A (zh) | Ⅲ族氮化物半导体发光元件的制造方法、ⅲ族氮化物半导体发光元件和灯 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: TOYODA GOSEI CO., LTD. Free format text: FORMER OWNER: SHOWA DENKO K.K. Effective date: 20130129 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20130129 Address after: Aichi Patentee after: Toyoda Gosei Co., Ltd. Address before: Tokyo, Japan, Japan Patentee before: Showa Denko K. K. |