CN101646300B - 印刷布线板和印刷电路板 - Google Patents

印刷布线板和印刷电路板 Download PDF

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Publication number
CN101646300B
CN101646300B CN200910160333XA CN200910160333A CN101646300B CN 101646300 B CN101646300 B CN 101646300B CN 200910160333X A CN200910160333X A CN 200910160333XA CN 200910160333 A CN200910160333 A CN 200910160333A CN 101646300 B CN101646300 B CN 101646300B
Authority
CN
China
Prior art keywords
wiring
via hole
supply wiring
power
end regions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200910160333XA
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English (en)
Chinese (zh)
Other versions
CN101646300A (zh
Inventor
林靖二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN101646300A publication Critical patent/CN101646300A/zh
Application granted granted Critical
Publication of CN101646300B publication Critical patent/CN101646300B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN200910160333XA 2008-08-07 2009-08-07 印刷布线板和印刷电路板 Expired - Fee Related CN101646300B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2008-203734 2008-08-07
JP2008203734 2008-08-07
JP2008203734 2008-08-07
JP2009145453A JP5284194B2 (ja) 2008-08-07 2009-06-18 プリント配線板およびプリント回路板
JP2009145453 2009-06-18
JP2009-145453 2009-06-18

Publications (2)

Publication Number Publication Date
CN101646300A CN101646300A (zh) 2010-02-10
CN101646300B true CN101646300B (zh) 2011-08-03

Family

ID=41172327

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910160333XA Expired - Fee Related CN101646300B (zh) 2008-08-07 2009-08-07 印刷布线板和印刷电路板

Country Status (6)

Country Link
US (1) US8168895B2 (enExample)
EP (1) EP2152050B1 (enExample)
JP (1) JP5284194B2 (enExample)
KR (1) KR101076671B1 (enExample)
CN (1) CN101646300B (enExample)
AT (1) ATE531241T1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5354949B2 (ja) 2007-06-19 2013-11-27 キヤノン株式会社 プリント回路板
CN102802339B (zh) * 2011-05-23 2017-05-24 永捷电子（始兴）有限公司 印刷电路板
CN103091648A (zh) * 2011-10-28 2013-05-08 爱盛科技股份有限公司 磁感测装置
CN103091649A (zh) * 2011-10-28 2013-05-08 爱盛科技股份有限公司 磁感测装置
JP5904856B2 (ja) 2012-04-23 2016-04-20 キヤノン株式会社 プリント配線板、半導体パッケージ及びプリント回路板
KR101472638B1 (ko) * 2012-12-31 2014-12-15 삼성전기주식회사 수동소자 내장기판
US8723052B1 (en) * 2013-02-27 2014-05-13 Boulder Wind Power, Inc. Methods and apparatus for optimizing electrical interconnects on laminated composite assemblies
US8785784B1 (en) 2013-03-13 2014-07-22 Boulder Wind Power, Inc. Methods and apparatus for optimizing structural layout of multi-circuit laminated composite assembly
JP6385075B2 (ja) * 2013-04-15 2018-09-05 キヤノン株式会社 プリント配線板、プリント回路板及び電子機器
WO2015010080A1 (en) * 2013-07-18 2015-01-22 Quarkstar Llc Luminaire module with multiple light guide elements
US9793775B2 (en) 2013-12-31 2017-10-17 Boulder Wind Power, Inc. Methods and apparatus for reducing machine winding circulating current losses
JP6758888B2 (ja) * 2016-04-06 2020-09-23 株式会社アムコー・テクノロジー・ジャパン 半導体装置
CN107479227A (zh) * 2017-07-06 2017-12-15 惠科股份有限公司 一种电路板及其制作方法
JP6984441B2 (ja) 2018-01-25 2021-12-22 富士通株式会社 基板及び電子装置
JP6984442B2 (ja) 2018-01-25 2021-12-22 富士通株式会社 基板、電子装置、及び基板の設計支援方法
JP2019201070A (ja) * 2018-05-15 2019-11-21 株式会社デンソーテン 多層基板及び多層基板を用いて素子に電流を供給する方法
FR3083320B1 (fr) * 2018-06-27 2022-11-11 Safran Electronics & Defense Circuit imprime integrant un pont diviseur de courant
IT202000029210A1 (it) * 2020-12-01 2022-06-01 St Microelectronics Srl Dispositivo a semiconduttore e corrispondente procedimento
KR102302499B1 (ko) * 2020-12-03 2021-09-16 주식회사 기가레인 전원 전송 라인을 포함하는 연성회로기판

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5969421A (en) * 1997-11-18 1999-10-19 Lucent Technologies Inc. Integrated circuit conductors that avoid current crowding

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0997953A (ja) * 1995-09-29 1997-04-08 Toshiba Ave Corp 大電流用プリント基板
JP3957803B2 (ja) * 1996-02-22 2007-08-15 キヤノン株式会社 光電変換装置
JPH11224974A (ja) * 1998-02-06 1999-08-17 Hitachi Ltd 配線基板
JP2000200948A (ja) * 1999-01-07 2000-07-18 Toshiba Corp 並列回路の配線構造
US6977435B2 (en) * 2003-09-09 2005-12-20 Intel Corporation Thick metal layer integrated process flow to improve power delivery and mechanical buffering
JP2006066665A (ja) * 2004-08-27 2006-03-09 Mitsumi Electric Co Ltd 配線基板
US7501698B2 (en) * 2004-10-26 2009-03-10 Kabushiki Kaisha Toshiba Method and system for an improved power distribution network for use with a semiconductor device
WO2008018160A1 (en) 2006-08-07 2008-02-14 Nippon Avionics Co., Ltd. Method and apparatus for connecting printed wiring boards
JP2008078314A (ja) * 2006-09-20 2008-04-03 Toshiba Corp 高速信号回路装置
US8056039B2 (en) * 2008-05-29 2011-11-08 International Business Machines Corporation Interconnect structure for integrated circuits having improved electromigration characteristics

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5969421A (en) * 1997-11-18 1999-10-19 Lucent Technologies Inc. Integrated circuit conductors that avoid current crowding

Also Published As

Publication number Publication date
US8168895B2 (en) 2012-05-01
KR20100019342A (ko) 2010-02-18
EP2152050B1 (en) 2011-10-26
CN101646300A (zh) 2010-02-10
KR101076671B1 (ko) 2011-10-26
JP5284194B2 (ja) 2013-09-11
ATE531241T1 (de) 2011-11-15
US20100032195A1 (en) 2010-02-11
EP2152050A1 (en) 2010-02-10
JP2010062530A (ja) 2010-03-18

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Granted publication date: 20110803

CF01 Termination of patent right due to non-payment of annual fee